An Artificial Piezoelectric-Conductive Integrated Peri-Implant Gingiva Enables Efficient Bacterial Inhibition and Soft-Tissue Integration

Peri-implantitis is the main reason for dental implant failure. Optimizing electroactivity at the interface between dental implants and tissue is essential for enhancing integration and preventing bacterial invasion. Here, a bioinspired piezoelectric-conductive integrated peri-implant gingiva (PiG) with simultaneously enhanced antibacterial efficacy and soft-tissue integration, which is based on a flexible piezoelectric film and conductive polymer network, is presented. The piezoelectricity of PiG is achieved through the electrospinning of polyvinylidene fluoride/BaTiO 3 /MXene on a polydopamine-modified plasma-activated Ti surface, whereas the conductive property of PiG is achieved by the in situ polymerization of 3,4-ethylenedioxythiophene monomers. Under ultrasonic irradiation, PiG can promote the formation of neutrophil extracellular traps and reactive oxygen species, thus achieving synergistic and efficient piezodynamic killing of Staphylococcus aureus ( S. aureus ) and Escherichia coli (E. coli) . Additionally, piezoelectricity-enabled electrical stimulation endows PiG with enhanced fibroblasts adhesion, proliferation, and collagen secretion. As a demonstration, ultrasound irradiation of PiG-grafted Ti implanted in a subcutaneous implantation rat model efficiently eliminates the S. aureus infection and rescues the implant with increased soft-tissue integration. The concept of an artificial PiG is anticipated to open new avenues for the development of high-performance implant materials, potentially extending their lifespans. Graphical abstract