摘要
The rapid increase in power density and the more limited space in compact electronic devices necessitate highly thermally conductive yet electrically insulating tapes for heat dissipation. However, state-of-the-art tapes have an in-plane thermal conductivity ( κ // ) lower than 70 W m −1 K −1 when the thickness exceeds 200 µm, limiting their applications in high heat flux devices. Herein, a multilayer, highly thermally conductive yet electrically insulating tape (MTCEIT) is developed by sandwiching graphene paper within boron nitride nanosheet-filled polymer nanocomposite adhesives and in series combining it with a boron nitride flake-filled polymer composite film. At ≈300 µm thickness, the MTCEIT exhibits an ultrahigh κ // of 121.22 W m −1 K −1 , while maintaining a volume electrical resistivity of 5.07 × 10 11 Ω·cm and a Weibull characteristic breakdown strength of 36.9 kV mm −1 . The multilayer structure endows the MTCEIT with exceptional electrical insulation and highly efficient heat dissipation capability, which can reduce the equilibrium temperature of a central processing unit (CPU) by 9 °C in a thin laptop and stabilize the video frame rate (fluctuation ≤ 0.1 fps) of an ultrathin smartphone without forced cooling. This study provides an innovative solution to the challenge of dissipating high heat flux in compact electronic devices.
危险品化学品经营许可证(带存储)