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A Strong Interfacial Adhesion and High Stress Dissipation Binder for Durable Microsized SiOx Anodes

Journal 2025 · IF 19 · 发表于 2025 年 4 月 24 日
作者: Ziqiao Yan,Xiujuan Wei,Wenwei Zhang,Lin Xu,Jie Zhang,Shuxing Wu,Kai-Hang Ye,Zeheng Li,Zhan Lin,Jun Lu
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摘要

The rapid capacity decay of microsized SiO x anode resulting from large volume change hinders its commercial application. Herein, a polymer binder with strong interfacial adhesion and high stress dissipation is designed to alleviate the volume change of microsized SiO x anode and maintain structural integrity of electrode. The density functional theory calculations (DFT) and X-ray photoelectron spectroscopy (XPS) reveal that the multifunctional polymeric network enhances interfacial contact between the binder and silicon oxide (SiO x ) particles through gradient hydrogen bonds. Additionally, the designed binder exhibits high mechanical strength and self-healing function via the synergy of supramolecular and covalent chemistry. The designed binder enables SiO x electrodes to exhibit notable cycling stability and superior rate performances. This work provides valuable insights into the structure-function relationship of binder for high-capacity SiO x anodes.

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