Dual bio-inspired design of highly thermally conductive and superhydrophobic ZnO/SiC/epoxy resin-based composite membrane for stable passive heat dissipation

Epoxy resins are widely used in microelectronic packaging for wearable devices due to their excellent insulating properties and superb chemical stability. However, the performance of epoxy resins in high-temperature and humid environments is hindered by moisture condensation, which reduces thermal conductivity and may lead to the failure of electronic components. Herein, we propose a dual bio-inspired composite membrane based on ZnO/SiC/epoxy resin. It synergistically integrates high thermal conductivity, which is more than 50 % higher than pristine epoxy resin, and superior superhydrophobicity, with a water contact angle: 160° ± 1°. Addressing a critical gap in multifunctional thermal management materials, unlike previous studies that focused on a single function, such as vertically aligned boron nitride (BN) composites for thermal conductivity or ZIF-8/POTS coatings for hydrophobicity, this study innovatively combines polyurethane-modified ZnO and SiC with 1H,1H,2H,2H-perfluorooctyltriethoxysilane (POTS) to achieve dual functionality. POTS-modified ZnO/SiC coatings form layered micro/nano-roughness and low surface energy through covalent Si-O-Si and C-F bonding, outperforming conventional physically roughened surfaces. The cost-effective coating method replaces complex layer-by-layer deposition, ensuring uniform dispersion and industrial viability. This work not only addresses the trade-off between thermal management and environmental resilience, but also pioneers a scalable strategy for next-generation electronics packaging, especially for 5 G and wearable technologies. By demonstrating synergistic material design and proven long-term stability, this research sets a benchmark for the use of multifunctional composites in demanding operating environments.