Additive manufacturing construction and directional damage effect research of Al/KIO4-based semi-constrained energetic assembly

Metastable intermolecular composites (MICs) have demonstrated significant potential in microscale applications because of their favorable chemical reaction properties. However, the variability in reaction rates associated with conventional powder states, along with a limited understanding of reaction behaviors within semiconfined environments, has constricted the functional application of MICs to some extent. This study integrates and constructs a semiconfined energetic assembly embedded with MICs energetic sticks via additive manufacturing technology. Building upon this foundation, the energy release behavior of the assembly, characterized by varying energy release systems and component ratios, aims to elucidate the microscale reaction behavior of MICs within a semiconfined environment by investigating the energy release mechanisms of the energetic assembly. These findings indicate that MICs-based energetic assembly can inflict irreversible damage to silicon chips due to the pressure accumulation of gas-phase products during combustion. Notably, the Al/KIO 4 -based energetic assembly, which exhibits high reaction kinetics and efficient pressure release characteristics, can completely destroy a silicon chip with a thickness of 725 μm within 6 ms. Furthermore, it demonstrates the shortest response time (64 ms), the most effective damage impact, and favorable environmental adaptability in a slightly fuel-rich state (Φ = 1.5). This research not only enhances the understanding of the microscale energy release effects of MICs materials but also provides a novel perspective for their functional applications.