摘要
The rigid chain structure of polyimide (PI) provides exceptional mechanical strength, outstanding thermal stability, and excellent chemical resistance. However, it severely limits its self-healing capabilities, which require a high degree of chain segment mobility. Achieving both high performance and rapid self-healing in PIs is critical for applications in aerospace and other demanding environments, yet it presents a significant challenge. Here, we innovatively constructed a hierarchically dynamic dual-network in PI architecture through molecular topological design—featuring B 3 O 3 as reversible chemical crosslinks and reduced graphene oxide (rGO) mediated hydrogen-bond networks as physical dissipation units. This innovative composite structure achieves high-performance Boroxine-containing polyimide (BPI) — Tensile strength is 111.3 MPa, Young's modulus is 2.63 GPa, fracture toughness is 12.56 MJ/m 3 and T d5% is 536 °C, while enabling record-fast, on-demand damage healing within just 5 min under simple near-infrared (NIR) irradiation. Notably, it also enables the regulation of frictional properties through light control, with a friction coefficient range of 0.277 to 0.122. By integrating photo-controlled self-healing with intelligent friction modulation, this approach sets a new paradigm for designing adaptive smart materials capable of withstanding complex operational environments.
危险品化学品经营许可证(带存储)