摘要
The growing demand for efficient thermal management has increased the importance of phase change materials (PCMs). Microencapsulation technology mitigates the leakage issue of liquid-state PCMs. However, enhancing the thermal conductivity and structural stability of microencapsulated PCMs (MEPCMs) remains a challenge. Graphene oxide (GO) and its chemically functionalized derivatives have shown great potential in enhancing the performance of MEPCMs. In this study, GO and octadecylamine-grafted GO (GO-ODA) were employed as thermally conductive fillers to modify n -octadecane@melamine-formaldehyde resin microcapsules. Four formulations were developed by varying the spatial distribution of GO and GO-ODA within the microcapsules. The dispersion of GO-ODA in the core was found to reduce defects in the shell structure, while distributing the additives across the core, interface, and shell promoted the formation of a continuous thermal conduction network. The experimental results indicate that, with a filler content of 0.2 wt%, the thermal conductivity increased by 5.8 times, reaching 0.587 W/(m·K), compared to the unmodified MEPCM with a value of 0.086 W/(m·K). Additionally, the leakage rate was reduced by 87.5%, significantly enhancing the structural stability of the microcapsules.
危险品化学品经营许可证(带存储)