Metal-polyphenol network coating for cardiovascular implants to prevent thrombosis and promote endothelialization

Cardiovascular implants, such as stents, often face challenges including thrombosis, intimal hyperplasia, and delayed reendothelialization due to endothelial damage post-implantation. To address these issues, this study developed a multifunctional metal-polyphenol network (TEC-Cu) coating capable of in situ nitric oxide (NO) generation via glutathione peroxidase-like catalytic activity. The TEC-Cu coating was fabricated through a simple dip-coating process by chelating a tripodal Schiff base polyphenolic ligand (TEC) with copper ion (Cu²⁺). In vitro evaluations demonstrated that the coating achieved sustained NO release (1.13 ×10⁻¹⁰ mol·cm⁻²·min⁻¹), effectively inhibiting platelet adhesion/activation (about 80 % reduction) and prolonging activated partial thromboplastin time (APTT by 82.5 s). Additionally, TEC-Cu significantly enhanced endothelial cell proliferation while suppressing smooth muscle cell hyperplasia (about 50 % reduction), attributed to the synergistic effects of polyphenol-mediated bioactivity and NO-driven signaling. Surface characterization confirmed the successful coordination of Cu²⁺ with phenolic hydroxyl groups, forming a stable, hydrophilic interface. Hemocompatibility tests revealed negligible hemolysis (<5 %). These results highlight the TEC-Cu coating’s dual functionality in anticoagulation and endothelialization, offering a promising strategy for next-generation cardiovascular implants to mitigate thrombosis and restenosis.