Inhibitory effect of graphene on tin whisker growth induced by atomized Sn

Tin (Sn) whiskers pose significant reliability risks in electronics, especially with the transition to lead-free solders. Mitigating Sn whisker growth remains a significant challenge. Here, Ti 2 SnC is used as a model to provide atomized Sn, which is the key driver for Sn whisker growth, and graphene is introduced to inhibit Sn whisker growth. Mechanochemical decomposition of Ti 2 SnC via ball milling releases atomized Sn, which is incorporated into a Sn matrix by thermo-compression to assess its effect on whisker formation. Adding graphene to the composite restricts long-range Sn diffusion, significantly reducing whisker length and density. Graphene's two-dimensional structure forms nanoscale diffusion barriers, hindering atomic migration and aggregation. These dispersed graphene nano-walls inhibit whisker growth effectively without damaging the bulk matrix, providing a promising approach to enhance reliability in lead-free solder systems.