Effect of surface functionalized SiO2 particles filled polyolefin on the dielectric properties of laminates

Dielectric materials play a crucial role in 5G communication technological applications such as printed circuit board (PCB) high-frequency substrate materials. Unfortunately, the fabrication of desirable dielectric performance in organic–inorganic composites is a great challenge because of lack of good interfacial compatibility and uniform dispersion between fillers and polymer. In this work, silicon dioxide (SiO 2 ) was synchronously functionalized by γ-methacryloxypropyltrimethoxysilane (MPS, s-SiO 2 ) and 1,2-polybutadiene (PB, v-SiO 2 ), which were then used as fillers to fabricate the s-SiO 2 /polyolefin or v-SiO 2 /polyolefin laminates. All the v-SiO 2 /polyolefin laminates exhibited better dielectric, thermal and mechanical properties than those of s-SiO 2 /polyolefin laminates under the same filler content. Specially, the 50 wt% v-SiO 2 /polyolefin laminate displays a low dielectric constant (3.42) and loss (3.55 × 10 -3 ) at 10 GHz. Meanwhile, it also shows good stability of dielectric properties in a wide range of high-frequency. This work is conducive to develop laminates with superior dielectric properties and apply to PCB high-frequency substrate field.