Additive-Free Super-reactive metastale intermixed C-doped Al/Co3O4 coating with excellent Structural, exothermic and hydrophobic stability for a Transient-chip

In 21st century, the microchip plays an essential role in data and information security, and preventing information leakage stored in chips becomes more challenging. This paper firstly introduced electrophoretic assembly technique and surface functionalization to design the C-doped nano-Al/Co 3 O 4 functional energetic material (nFEM) coating with triple stability of anti-wetting, micro-structure and energy-release for at least one year, and the energetic film was integrated with copper based-chip to construct the C-doped Al/Co 3 O 4 nFEM-chip to realize its self-destruction. Product shows outstanding anti-wetting properties with high water contact angle of 168 ± 1° and extremely low sliding angle of ∼ 1°, and well weather resistance in variable environments. Impressively, the output of heat (Q) of product can reach up to 3598 J/g nearly 85% of theoretical value with a relatively low activation energy of 235.46 kJ/mol, and keeps almost thermopositive stability even for immersed samples for fifty cycles after one year exposure test. In addition, C-doped Al/Co 3 O 4 nFEM-chip after immersion and exposure tests can also be effectively destroyed or ignited with a dazzling flame in an ultrashort time (<1ms), demonstrating the great advantage and huge application potentials for the design of other functional transient-chips with nano/micro-scale high-energy systems applied in different environments, even underwater.