Selective metallization of glass with improved adhesive layer and optional hydrophobic surface

The metallization of glass with high density and fine spacing possesses promising application in advanced package in 5 G. However, the adhesion strength between the copper and the smooth glass is still limited. In this paper, a feasible method is developed to prepare ZnO coating on the glass surface which served as an adhesive layer to provide a good anchors of copper layer by electroless copper plating. The results proved the adhesion strength of the copper layer is as high as 5B by grid adhesion test. Furthermore, diethoxy-methyl-(3, 3, 3-trifluoro-propyl)-silane was used to create an optional hydrophobic surface to accomplish a selective electroless copper plating pattern. The electroless copper plating is non-toxic, convenient, low economic cost and reliable and it is expected to realize promising application in system-in-package in the future.