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A FinFET with one atomic layer channel

Journal 2020 · IF 12.121 · 11(1): 1-7 · 发表于 2020 年 3 月 5 日
作者: Chen Mao-Lin,Sun Xingdan,Liu Hang,Wang Hanwen,Zhu Qianbing,Wang Shasha,Du Haifeng,Dong Baojuan,Zhang Jing,Sun Yun,Qiu Song,Alava Thomas,Liu Song,Sun Dong-Ming,Han Zheng
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摘要

Since its invention in the 1960s, one of the most significant evolutions of metal-oxide-semiconductor field effect transistors (MOS-FETs) would be the three dimensionalized version that makes the semiconducting channel vertically wrapped by conformal gate electrodes, also recognized as FinFET. During the past decades, the width of fin ( W \({}_{{\rm{fin}}}\) ) in FinFETs has shrunk from about 150 nm to a few nanometers. However, W \({}_{{\rm{fin}}}\) seems to have been levelling off in recent years, owing to the limitation of lithography precision. Here, we show that by adapting a template-growth method, different types of mono-layered two-dimensional crystals are isolated in a vertical manner. Based on this, FinFETs with one atomic layer fin are obtained, with on/off ratios reaching \(\sim\!\! 10^{7}\) . Our findings push the FinFET to the sub 1 nm fin-width limit, and may shed light on the next generation nanoelectronics for higher integration and lower power consumption.