Novel method for protecting copper: An in-situ click-assembly film on copper surface

The in-situ self-assembled film on the copper surface is prepared via a novel click chemistry reaction between furfuryl mercaptan (FM) and tert-butyl acetylene (TBA). The formation of the click-assembled film on the copper surface is confirmed by Fourier transform infrared spectrum , Raman, and X-ray photoelectron spectroscopy analyses. The corrosion inhibition ability of the click-assembled film is evaluated using electrochemical methods. The impedance results indicate that the click-assembled film exhibits a maximum inhibition efficiency of up to 99.86 %, which is attributed to the formation of the C-S bond. This bond facilitates the attachment of corrosion inhibitors to the copper surface. Quantum chemistry calculations and molecule dynamics simulations are conducted to further elucidate the corrosion inhibition mechanism.