Highly thermally conductive Ti3C2Tx/h-BN hybrid films via coulombic assembly for electromagnetic interference shielding

With the development of electronic equipment, heat problem and electromagnetic pollution severely affect both their functions and human health, which leads to great interests in developing materials synchronously with outstanding thermal conductivity and electromagnetic interference (EMI) shielding performance. Here, ultrathin Ti 3 C 2 T x /h-BN two-dimensional (2D) heterostructure films were prepared via coulombic assembly between Ti 3 C 2 T x MXene and h-BN nanosheet through ultrasonic blending. After the addition of h-BN nanosheet as thermal conductive nanofillers, the hybrid films achieved a higher value of thermal conductivity, compared to Ti 3 C 2 T x composite film without h-BN. The higher thermal conductivity offered by h-BN enables the Ti 3 C 2 T x /h-BN films have good potential for EMI shielding applications on wearable and portable electronic devices. When the mass ratio of Ti 3 C 2 T x /h-BN is 7:3, the hybrid film with the thickness of 47.60 µm exhibited electrical conductivity of 57.67 S/cm and the maximum EMI shielding effectiveness of 37.29 dB.