Enhancing thermal conductivity and dielectric properties of Al2O3@Si/polyphenylene oxide composites by surface functionalization

Recently, soaring developments in 5 G technology have raised an intensive challenge in developing polymer composites with excellent thermal conductivity and dielectric properties . Herein, Al 2 O 3 @Si/MPPO composites were developed through synergistic modification and solution mixing methods. The double bond reaction between Al 2 O 3 @Si and MPPO enhanced the interfacial force and greatly reduced the interfacial thermal resistance and interfacial polarization, leading to highly thermally conductive composites with excellent dielectric properties. The resultant polymer composites exhibited high thermal stability, excellent dynamic mechanical properties, a low dielectric loss of 0.00292, and a high thermal conductivity (TC) of 1.49 W/(m·K), which was 5.21 times higher than that of the pure MPPO resin, making it an ideal thermal management material for electronic devices.