Low temperature joining of GH3039 for high temperature applications with Au-Si isothermal solidification

Owing to the isothermal solidification of eutectic Au-Si filler, GH3039 joints were successfully manufactured at 430 °C. After Ti modified, GH3039 joints that could endure 800 °C were creatively achieved through the transformation of reaction layers. Dispersed Ni 49 Ti 14 Si 37 whiskers and CrSi 2 fine particle layer formed at the interface instead of continuous Ni 3 Si layer. This improved the joint shear strength to 131 MPa at room temperature and 15 MPa at 800 °C. Joining at low temperature but applying at high temperature offers a new option for the dissimilar bonding of Ni-based superalloy and ceramics that is in need of the residual stress alleviation.