Preparation of a SiCf/Al composite precursor by electrochemical deposition in a LiCl–KCl–AlCl3 molten salt

The preparation of suitable SiC fiber (SiC f )/Al precursors is crucial for the fabrication of SiC f -strengthened Al alloys . In this work, a SiC f /Al precursor was prepared by pulse current deposition in a molten LiCl–KCl–AlCl 3 melt. The electrochemical deposition of Al 3+ was separately investigated on the Mo wire, Cu wire, SiC f , and Cu-coated SiC f electrodes. The intermediate Cu layer can eliminate the Li generated by the underpotential deposition on the carbon layer outside SiC f . In addition, open circuit chronopotentiometry was performed to confirm the reduction processes of Al 3+ on the Cu wire and Cu-coated SiC f , and the results indicate that Al 3+ exhibits similar reduction processes on the two electrodes. The deposited Al layer possibly formed Al–Cu alloys with the intermediate Cu layer on SiC f , which was beneficial to the connection between the Al layer and SiC f substrate. Scanning electron microscopy was employed to investigate the morphology and microstructure of the prepared SiC f /Al fiber. After the pulse current was optimized, a compact and even layer of Al was deposited on SiC f .