Effect of Silicon on the Microstructure and Performance of the New Binary Deep Eutectic Ti–Cu–Zr–Ni-Based Filler Metal

This study designed (Ti0.55Cu0.20Zr0.15Ni0.10)1−xSixamorphous alloys based on binary deep eutectics and examined the effect of silicon (Si) on the amorphous forming ability of the filler alloys. The results show that a certain amount of Si added to the filler metals could improve the amorphous forming ability of the alloys. Under the same experimental conditions, the Ti0.55Cu0.20Zr0.15Ni0.10filler metal with 0.5 wt % Si had the strongest amorphous forming ability compared to the other filler alloys containing different amounts of Si; its reduced glass transition temperature (Trg) was 0.5554, and its supercooled liquid phase region width (∆Tx) reached 60 °C. The (Ti0.55Cu0.20Zr0.15Ni0.10)99.5%Si0.5%filler metal designed in these experiments presented good amorphous forming ability and wettability. The brazed joint of SiC and TC4 obtained with this amorphous filler metal showed a shear strength of 102 MPa, indicating an increase of 122% compared to the brazed joint obtained with the filler metal without Si.