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Synthesis of Benzocyclobutene-Capping Liquid Crystalline Poly(ester imide)s with Low Coefficient of Thermal Expansion and Dielectric Constant

Journal 2026 · IF 5.8 · 18(5): 604 · 发表于 2026 年 2 月 28 日
作者: Shengtao Pan,Wenhu Wu,Xinfang Wang,Huan Guan,Huaguang Yu,Jiyan Liu,Zuogang Huang,Xueqing Liu
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摘要

Liquid crystalline poly(ester imide)s (LCPEIs) were synthesized by solution polymerization from 4-hydroxybenzoic acid (4-HBA), 6-hydroxy-2-naphthoic acid (HNA) and N -(3-carboxyphenyl)-4-hydroxyphthalimide (3-CHP), with the capping groups of benzocyclobutene (BCB)-containing compounds (BCB-HP for phenolic hydroxyl group and BCB-CP for aromatic carboxylic acid). Subsequent cross-linking of the BCB capping groups upon hot pressing afforded the cured LCPEI films. Optimal properties of these films were achieved by adjusting the capping BCB-HP/BCB-CP contents.These LCPEIs showed favorable thermal properties with a relatively high glass transition temperature ( T g , 137–167 °C) and low melting temperature ( T m , 186–194 °C). With the increase in BCB capping content, the tensile modulus, tensile strength, and coefficient of thermal expansion (CTE) exhibited a non-linear tendency of first decreasing and then increasing. LCPEI-3.0 (3 mol% BCB) showed optimal performance: a relatively low CTE (20 × 10 −6 K −1 ), a relatively high storage modulus (2.55 GPa), a moderate tensile modulus (2.65 GPa), a relatively low dielectric constant ( Dk = 3.17) with low dielectric loss ( Df = 0.0034) at 10 GHz, and excellent hydrophobicity (water contact angle = 133°). This improvement embodies an effective strategy to combine advantages of polyester, polyimide, and benzocyclobutene to achieve favorable and excellent comprehensive properties for convenient processability and practical application prospects.

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