Silica Glasses for AI Computing Chips: Achieving Low Dielectric Constant and High Mechanical Strength via Rapid Light Shaping and Low Temperature Sintering

Silica glass exhibits significant application potential in advanced computing chip substrates, panel-level packaging (PLP), and three-dimensional heterogeneous integration owing to low dielectric constant and loss, superior mechanical properties, and exceptional thermal stability. However, the practical deployment of silica glass substrates is hindered by conventional melt-based processing, which is characterized by high complexity, excessive costs, and limited flexibility for rapid prototyping. In this work, an innovative strategy combining rapid shaping and low-temperature sintering is employed to fabricate a sintered silica glass with properties comparable to those of commercial fused silica, enabling rapid and customizable preparation of high-performance glass substrates for chip packaging process validation. The obtained photopolymerization–sintered silica glass exhibits low dielectric constant of ∼3.8 and loss on the order of 4 × 10 -4 in the microwave frequency band, together with high Young’s modulus of ∼73 GPa, good fracture toughness of ∼1.41 MPa·m 1 ᐟ 2 , and ultralow coefficient of thermal expansion on the order of 0.1 ppm·K -1 , which are superior to commercial TGV glasses such as SCHOTT AF32 and BF33. This approach is expected to provide a viable and flexible pathway for the development of next-generation advanced packaging technologies.