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Wood that bonds itself via homologous adhesion through cellulose reconstitution

Journal 2026 · IF 18.1 · 发表于 2026 年 4 月 30 日
作者: Sun Yuan,Liu Yang,Bai Long,Liu Shouxin,Wan Zhangmin,Yang Zhaolin,Yu Liwen,Huan Siqi,Wang Chengyu,Li Zhiguo,Lu Yi,Rojas Orlando J.
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摘要

Wood panels are extensively applied in furniture, construction fields, where their versatility and cost-effectiveness make them indispensable, but their assembly relies on adhesives that emit toxic formaldehyde, demand energy-intensive curing, and form weak interfacial bonds. Inspired by wood’s self-repair via cellulose microfibril reorganization, we develop a cellulose-based homologous active adhesive (HAA) derived from wood components. HAA cures under ambient hydration, eliminating toxic emissions and reducing energy consumption by >80%. Its mechanism activates wood surface hydroxyl groups and regenerates cellulose to create a seamless transition layer that enhances load transfer and resistance. This architecture enables specific bonding strength up to 100× greater than conventional adhesives, despite ultra-low solid content (<5%). Using molecular dynamics simulations, AFM nanomechanics, spectroscopy, and life-cycle assessment, we reveal that HAA outperforms commercial resins, offering pot life >30 days, full biodegradability, and >70% lower environmental impacts. HAA establishes a biomimetic, circular pathway for sustainable, high-strength wood bonding.