摘要
HighlightsUniform and dense a-SiOC coatings were successfully prepared on optical fibers by PECVD, demonstrating the feasibility of direct amorphous ceramic coating deposition on silica fibers with good interfacial adhesion.Revealed the temperature-driven evolution mechanism of a-SiOC coatings in a PECVD HMDS/Ar/O2system.Clarified the differentiated failure modes and mechanical property variations of a-SiOC coatings in 500–900 °C wet-oxygen.Optical fiber sensors deployed in harsh industrial fields, e.g., high-temperature wet-oxygen, face severe challenges in signal attenuation and mechanical degradation. While amorphous silicon oxycarbide (a-SiOC) coatings offer a promising solution due to their adjustable thermo-mechanical properties, balancing their structural density with environmental stability remains a critical technical bottleneck. In this study, a-SiOC coatings were deposited on optical fibers using hexamethyldisilane (HMDS) and trace oxygen via radio-frequency capacitively coupled plasma-enhanced chemical vapor deposition (PECVD). A systematic investigation was conducted to determine the impact of deposition temperature (70–420 °C) on the precursor dissociation kinetics, microstructural evolution, and corrosion resistance of the coatings. An elevation in temperature promotes the elimination of organic terminal groups (–CH3, –H) and enhances surface diffusion, driving the coating from a loose, carbon-rich “polymer-like” structure (dominated by Si–C bonds) to a dense, inorganic “silica-like” skeleton (dominated by Si–O–Si bonds). High-temperature corrosion tests in a wet-oxygen environment (500–900 °C) demonstrate that the failure mechanism is highly dependent on deposition temperature. Coatings deposited at low temperatures suffer catastrophic cracking due to pronounced oxidative shrinkage and the release of volatile species, whereas coatings deposited at 420 °C exhibit microcracking caused by severe carbon phase separation and stress concentration within the rigid inorganic network. In the present system, 350 °C is identified as the optimal deposition temperature, as it achieves the best balance of network densification and structural flexibility, while exhibiting the best mechanical performance.
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