A Two-Step Strategy of Surface Modification and Low-Temperature Sintering for Reliable Cu/Graphite Joining

The reliable joining of graphite and Cu holds significant promise for applications in electronic heat dissipation and sliding electrical contacts. However, the substantial differences in their physicochemical properties, poor wettability, and mismatch in coefficients of thermal expansion often result in low joint strength. In this study, a two-step joining strategy combines surface modification with low-temperature sintering, and this is proposed for fabrication of Cu/graphite joints. First, the graphite surface is modified using an AgCuTi active filler alloy under vacuum conditions. Ti preferentially segregates at and reacts with the graphite interface, leading to the formation of an Ag-Cu eutectic modified layer on the graphite surface. Subsequently, low-temperature joining of the modified graphite to a Cu substrate is achieved via a hot-pressing sintering process using a Ag paste. In the sintered joint, the Ag sintered layer forms sound metallurgical bonds with both the Cu substrate and the graphite-modified layer. When the sintering temperature is 250 °C, the joint exhibits a shear strength of 30 MPa, which is significantly higher than that of a directly brazed joint. This strategy effectively reduces thermal residual stress in the joint during cooling and shifts the failure location from the brittle graphite substrate to the ductile Ag sintered layer, thereby substantially enhancing the mechanical performance.