Achieving synergistic enhancement of conductivity, strength, and wear resistance in Cu-matrix composites via a hierarchical Ag–MXene architecture

Rapid electrification and renewable-energy infrastructure expansion demand copper materials simultaneously achieving high conductivity and robust structural performance. To address this, the study developed a strategy that couples a solution–solid displacement reaction with electrostatic self-assembly to construct hierarchical MXene/Ag@Cu composite powders, thereby achieving dual molecular-level compositing of Ag and MXene. During sintering, the Ag formed a continuous strip-like Ag phase within the Cu matrix, thereby establishing efficient dual pathways for electron and mechanical conduction, as confirmed by both microstructure characterization and finite element simulation. The first-principles analyses further revealed that Ag acts as an interfacial coupling element, effectively bridging self-lubricating MXene nanosheets with the Cu matrix, thereby enhancing electron transport, load-bearing capacity, and tribological performance. Furthermore, the Ag–MXene architecture was shown to construct a robust physicochemical barrier. Thermophysical measurements indicated its role in managing frictional heat, while first-principles simulations revealed its high energy barrier against O diffusion, collectively mitigating oxidative wear. Benefiting from multiscale synergistic reinforcement, the Cu-matrix composite simultaneously achieved high conductivity (96.3% IACS), excellent strength (354.3 MPa), and an ultralow wear rate (1.72 × 10 − 6 mm 3 N -1 m -1 ). These results demonstrate that the hierarchical Ag–MXene architecture successfully overcomes the conventional conductivity–strength–wear-resistance trade-off, offering a promising strategy for next-generation high-performance copper in advanced energy and industrial applications.