ACS Nano
·
2021
·
IF 15.881
Haoran Ning,Yan Zeng,Shouwei Zuo,Stephen V. Kershaw,Yi Hou,Yingying Li,Xiaona Li,Jing Zhang,Yuanping Yi,Lihong Jing,Jian Li,Mingyuan Gao
Ultrathin two-dimensional (2D) semiconductors exhibit outstanding properties, but it remains challenging to obtain monolayer-structured inorganic semiconductors naturally occurring as nonlayered crystals. Copper sulfides are a class of widely studied nonlayered metal chalcogenide semiconductors. Although 2D copper sulfides can provide extraordinary physical and chemical applications, investigations of 2D copper sulfides in the extreme quantum limit are constrained by the difficulty in preparing monolayered copper sulfides. Here, we report a subnanometer-thin quasi-copper-sulfide (q-CS) semiconductor formed upon self-assembly of copper(I)–dodecanethiol complexes. Extended X-ray absorption fine structure analysis revealed that the existence of Cu–Cu bonding endowed the layer-structured q-CS with semiconductor properties, such as appreciable interband photoluminescence. Theoretical studies on the band structure demonstrated that the optical properties of copper–dodecanethiol assemblies were dominated by the q-CS layer and the photoluminescence originated from exciton radiative recombination across an indirect band gap, borne out by experimental observation at higher temperatures, but with the onset of a direct emission process at cryogenic temperatures. The following studies revealed that the metal–metal bonding occurred not only in copper–alkanethiolate complex assemblies with variable alkyl chain length but also in silver–alkanethiolate and cadmium–alkanethiolate assemblies. Therefore, the current studies may herald a class of 2D semiconductors with extremely thin thickness out of nonlayered metal sulfides to bridge the gap between conventional inorganic semiconductors and organic semiconductors.
研究领域:
材料科学
·
物理化学
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DOI
PubMed
高影响因子
JOURNAL OF HAZARDOUS MATERIALS
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2022
·
IF 14.224
Huizhong Chi,Wenbiao Jin,Jianqiao Zhang,Yibin Xiu,Tao Xu
In recent years, there has been growing interest in the mechanism (radical or nonradical) of persulfate activation processes. In this study, the enhancement of naproxen (NPX) degradation in a Cu 0 /peroxymonosulfate (PMS) system by complexing reagents was investigated. Surprisingly, neocuproine (NCP) alters the nature of reactive species in the Cu 0 /PMS system. A high-valent copper species, Cu(III)-NCP, was found to dominate NPX degradation rather than radicals under acid conditions for the first time. Moreover, systematically designed experiments revealed that the Cu(III)-NCP complex was a strong selective oxidant that reacted with organics through a single electron transfer pathway. Meanwhile, the degradation efficiency of NPX was highly dependent on the solution pH and dosage of Cu 0 and NCP, but was irrelevant to the concentration of NPX. Additionally, the enhancement of NCP on other copper based PMS activation systems (i.e., Cu 2+ /HA/PMS and Cu 0 /HA/PMS systems) was investigated. Considering that the released copper can be removed by a simple precipitation method to meet the effluent standards, the new complex-enhanced Cu 0 /PMS system provided a new method to enhance the degradation efficiencies of pollutants by a copper-catalyzed Fenton-like system.
研究领域:
环境科学
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化学工程
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DOI
PubMed
高影响因子
MINERALS ENGINEERING
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2023
·
IF 4.8
Xiaopeng Chi,Zihan Ye,Hao Wang,Wei Weng,Shuiping Zhong
The nature of copper slag flotation is unique due to the high temperature in the flotation pulp and high metallic copper content in the feed. Despite its great potential for valorizing slag, copper slag flotation remains challenging due to the deactivation of traditional dithiocarbonate (DTC) collectors (e.g., butyl xanthate) under high temperatures. DTC collectors also respond poorly to the metallic copper due to the difficulty in forming stable chemical adsorption. In this work, possible deactivation mechanisms of DTC collectors are proposed, i.e., decomposition, oxidation and thermal desorption. A novel furfuryl trithiocarbonate (FTTC) collector was designed and synthesized. Spectral characterization using FT-IR, H-NMR and ion trap MS confirmed the molecular structure of the synthesized collector and its decomposition, oxidation and polymerization products at 55 °C. The novel collector features high-temperature resistance and high metallic copper recovery, as revealed by the single mineral flotation experiments of chalcopyrite, pyrite and metallic copper at both 25 °C and 55 °C. The high collecting ability and selectivity of our collector were explained by E HOMO and E LUMO values using first-principles calculations. Our work provides guidance for the design of collectors exhibiting high-temperature resistance for copper slag flotation, aims at constituting a meaningful contribution for unlocking potential copper resources in copper slag.
研究领域:
矿物加工工程
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材料化学
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DOI
高影响因子
CHEMICAL ENGINEERING JOURNAL
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2024
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IF 13.3
Wangcai Zou,Jun Cheng,Yingqiang Ou,Yiqing Deng,Qiang Zhao
Recently, antimicrobial surface coatings have emerged as an effective strategy to mitigate microbial contamination and disease transmission. The application of cuprous (I) oxide (Cu 2 O) and copper (II) pyrithione (CPT) in antimicrobial surfaces faces several challenges such as deep color, weak stability, limited functionality, and poor dispersion in coatings. These challenges complicate the design of novel copper-based antimicrobial agents. In this study, high-purity CPT was synthesized innovatively using Cu 2 O as a copper source, differing from traditional methods. Following this approach, diatomaceous earth/cuprous oxide/copper pyrithione (DME/Cu 2 O/CPT) composites with enhanced antimicrobial activity and a lighter color than Cu 2 O and CPT were prepared by adjusting the SPT dosage. Notably, in DME/Cu 2 O/CPT composites, Cu 2 O existed as nanoscale fragments adhering to the surfaces of CPT. Furthermore, coatings made from composites and latex paint exhibited a lighter color difference, higher stability, and exceptional antimicrobial activity against pathogens such as S. aureus, E. coli, P. aeruginosa, C. albicans, and human enterovirus 71. The DME/Cu 2 O/CPT composites displayed high, stable, and broad-spectrum antimicrobial efficacy, attributing to the synergistic enhancement effects of released Cu + and Cu 2+ . Consequently, this study introduced a simple and scalable method for preparing DME/Cu 2 O/CPT composites, serving as a coating additive with broad-spectrum antimicrobial activity and long-term stability for various solid surfaces.
研究领域:
材料科学
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微生物学
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生物医学工程
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DOI
高影响因子
APPLIED ORGANOMETALLIC CHEMISTRY
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2021
·Vol. 35
·期 7
·e6245
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IF 4.105
Ruonan Ma,Zhiyin Xiao,Wei Zhong,Chunxin Lu,Zhongquan Shen,Dan Zhao,Xiaoming Liu
Cuprous halides, best described as (CuX) n (X = Cl − , Br − , and I − ) in their solid state, catalyse selective aerobic oxidation of alcohols with the assistance of both NMI ( N -methylimidazole) and TEMPO (2,2,6,6-tetramethylpiperidine-1-oxyl), and the iodide generally demonstrates the highest activity, for example, in the oxidation of 1-octanol at ambient temperature under 24 h' reaction. However, in the aerobic oxidation of benzylic alcohols, the chloride showed superiority to the iodide in that the aerobic oxidation was quantitatively completed within 3 h at ambient temperature whereas the iodide showed only about half the activity of the chloride analogue. By probing the system using electrochemistry, electric conductivity, and 1 H NMR titration, it was revealed that the surprising anomaly was due to the difference in the rate of forming active species, [Cu (NMI) 2 X(MeCN)], from the polymeric solid in a two-stage process. Substrates expansion of 11 benzylic alcohols indicated that CuCl/NMI/TEMPO system demonstrated quantitative conversion of benzylic alcohols into corresponding aldehydes within 3 h and showed great tolerance to the substituents on the phenyl ring of the substrates. Furthermore, electron-withdrawing substituent was beneficial to the oxidation and could offset the steric effect at orthro -substituent. Such a behaviour suggested that in the catalysis, increasing the acidity of the hydroxyl group (OH) of the substrates could ease the oxidation, which implied that the deprotonation via an internal pathway might be one of the rate-determining steps. Our results also showed that the anion halide participated actively in the catalysis by coordinating to Cu(I) in the active species.
研究领域:
化学
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催化反应
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DOI
高影响因子
JOURNAL OF MATERIALS CHEMISTRY
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2012
·Vol. 22
·期 43
·23169-23174
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IF 5.968
Xianguang Ding,Yu Zou,Jiang Jiang
The synthesis of hybrid nanostructures has been of great interest to many material scientists, yet simple and facile routes to prepare these structures remain a difficult task with many reaction variables to tune. Herein, we report the synthesis of Au–Cu2S heterodimers from AuCu alloy nanoparticles by simply adding 1-dodecanethiol. Detailed characterization of this structural transformation process revealed that the crucial step of this synthetic approach was the alloy oxidization and subsequent formation of intermediate copper thiolate. Roles of surfactants and sulfur source have also been investigated. These observations provide critical insight into the understanding of the pathways of structure transitions from AuCu alloy to Au–Cu2S heterodimer nanoparticles, and will open up new ways of synthesizing heterodimer nanoparticles from metallic alloys.
研究领域:
材料科学
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纳米技术
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DOI
高影响因子
JOURNAL OF COLLOID AND INTERFACE SCIENCE
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2021
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IF 8.128
Yanming Feng,Xinyue Lv,Xi Ran,Caifeng Jia,Lujie Qin,Maoshen Chen,Ruijuan Qi,Hui Peng,Hechun Lin
Cuprous oxide (Cu 2 O) and cupric oxide (CuO) are widely available and low cost raw materials. Their applications as precursors for wet chemical synthesis of metallic Cu materials are greatly limited due to their insoluble in water and most organic solvents . In this work, copper superfine particles (Cu SPs) are synthesized using Cu 2 O and CuO as precursors via a heating process in monoethanoamine (MEA). Due to the strong coordinating character, Cu 2 O and CuO can be partially dissolved in MEA. The dissolved copper source is reduced by MEA at elevated temperature with the drastically releasing of NH 3 . As the dissolved copper source is reduced, more oxide will be dissolved and finally leads to the full reduction of Cu 2 O and CuO to produce the Cu SPs. The advantage of this synthesis method is that MEA acts as both the solvent and the reducing agent. The antimicrobial properties are investigated to find that the obtained Cu SPs depress the growth of Escherichia coli (E. coli) and Staphylococcus aureus (St. aureus) efficiently. More interesting, the composites produced via curing Cu 2 O and CuO with a small amount of MEA also exhibit excellent antimicrobial activity, indicating the MEA curing method is high-efficiency. The synthesis is low cost, high-efficiency, high atom-economy and up-scale synthesizing easily, which will benefit the wide applications of Cu SPs.
研究领域:
材料科学
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微生物学
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产品关联
DOI
PubMed
高影响因子
JOURNAL OF INORGANIC BIOCHEMISTRY
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2025
·
IF 3.2
Haoran Liu,Jingyi Zhang,Yanping Li,Jiamin Jin,Jian Chen,Juzheng Zhang
Although elesclomol (Es) has been investigated as a copper ionophore in antitumor clinical trials, its therapeutic potential remains limited by suboptimal copper transport efficiency and a narrow mechanism of action. To overcome these limitations and improve the anticancer efficacy of copper ionophores, we designed and synthesized L1—a novel chelator capable of forming the binuclear copper complex C1. Our results demonstrate that C1 exhibits superior therapeutic properties compared to Elesclomol–Cu (Es Cu), including enhanced cellular copper uptake in gastric cancer cells and multiple anticancer mechanisms. These mechanisms include potent induction of cuproptosis (significantly stronger than Es Cu), generation of mitochondrial superoxide and intracellular reactive oxygen species, induction of autophagic lysosome accumulation, DNA damage, and activation of apoptosis. More importantly, in vivo studies revealed a remarkable tumor inhibition rate of 80.3 % for C1, substantially higher than that of Es Cu (45 %). These findings establish C1 as a promising next-generation copper-based anticancer agent with enhanced therapeutic potential.
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DOI
PubMed
高影响因子
Surfaces and Interfaces
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2025
·
IF 6.3
Yabing Zhang,Xiaofeng Dai,Hongbin Shi,Tao Wang
In this work, we demonstrate the catalytic application of magnetic core-shell copper-coated-nickel (Ni@Cu) nanoparticles (NPs) for dimethylamine borane (DMAB) reduced electroless plating copper to fabricate flexible, highly conductive copper patterns. The Ni@Cu NPs, with size of 40 to 46 nm and saturation magnetization of 9.13 emu/g, exhibited strong magnetism, which can be separated by a magnet. Furthermore, the NPs possessed superparamagetism, which meant that the NPs could quickly redisperse in a solvent once the external magnetic field was removed. The core-shell structure of Ni@Cu NPs offered distinct advantages: the nickel core facilitated straightforward magnetic separation, while the copper shell ensured effective dispersion and robust catalytic activity. As the catalyst seeds for electroless plating copper, the Ni@Cu NPs exhibited superior catalytic activity for preparing conductive, adhesive, antioxidative, and bendable flexible copper patterns. The resistivity of the obtained conductive copper patterns was quite low, approximately 1.2 times that of bulk copper. The surface of the copper patterns was smooth, with a relative roughness of 2.67 %, and remained stable under 2000 cycles bending test and 50 cycles 3 M tape test, without any increase in sheet resistance or detachment of the conductive coating. The results of this research will provide new perspectives and basics for the low-cost and large-scale preparation of flexible printed circuits, and will promote the development of the flexible electronics industry towards high efficiency and environmental friendliness.
研究领域:
材料科学
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电子工程
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产品关联
DOI
高影响因子
APPLIED SURFACE SCIENCE
·
2021
·
IF 6.707
Yabing Zhang,Teng Zhang,Hongbin Shi,Qing Liu,Tao Wang
Flexible conductive copper patterns with low electric resistance, good adhesion, and high stability were successfully prepared on heat-sensitive polyethylene terephthalate (PET) substrate by combining the inkjet print with copper nanoparticles (Cu NPs) conductive ink and electroless plating (ELP) copper at room temperature. The Cu NPs served as the catalysts to promote copper ions electroless deposition on PET surface. Dimethylaminoborane (DMAB) was used as the reductant to place poisonous formaldehyde in the electroless plating process. The Cu patterns had a strong adhesion with PET substrate modified by 3-Mercaptopropyltriethoxysilane (MPTES) and would not fall even after 4000 cycles bending test. The electric resistivity of patterns could be as low as 5.43 μΩ·cm, which is about three times that of bulk copper. The minimum sheet resistance of the patterns was 54 mΩ/sq and had little change in the atmosphere for five months, that showed the patterns had an excellent anti-oxidation performance.
研究领域:
材料科学
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电子工程
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产品关联
DOI
高影响因子
APPLIED SURFACE SCIENCE
·
2024
·
IF 6.3
Xiaocun Wang,Shuo Han,Fei Xiao
With the maximum operating temperature of semiconductor devices becomes higher, novel die attach methods for high temperature application are required. Cu–Cu direct bonding provides a simple solution that eliminates the use of die attach materials and the related reliability issues. However, the easy oxidation of copper is the main obstacle for Cu–Cu direct bonding. In this study, a simple and efficient method for Cu–Cu direct bonding in minutes at low pressure and low temperature in air without complex pre-treatment was developed. The problem of copper oxidation was solved by rapid in-situ reduction and temporary passivation of glycerol. The bonded samples show very high shear strength. The surface leveling effect of the glycerol reduction was verified, which is beneficial for bonding. The bonded samples showed little change in shear strength after 1000 h of aging at 250 °C in air, demonstrating a long-term high temperature service capability. This new bonding method has great potential in power devices packaging and flip chip bonding.
研究领域:
材料科学
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电子工程
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2022
·Vol. 33
·期 7
·3576-3585
·
IF 2.779
Gao Yue,Xiao Yu-bo,Liu Zhi-Quan,Liu Yang,Sun Rong
Cu-Cu bonding is always conducted at high temperature and high pressure in reductive atmosphere to eliminate the influence caused by oxidation. Herein, a novel low-pressure sinterable Cu nanoparticle (Cu-NPs) paste was developed using Cu Metal Organic Decomposition (MOD) ink as solvent and surface modifier. The Cu MOD ink in paste introduced in Cu nanoparticle paste not only eliminated the surface oxidation of Cu-NPs, but also modified Cu-NPs with Cu atoms due to the thermal decomposition during sintering process. As a result, robust Cu sinter joints for die-attachment could be realized at a low pressure of 0.4 MPa in non-reductive nitrogen atmosphere. Using the paste with 20 wt.% Cuf addition in solvent, a relative high shear strength of 17.1 MPa could be achieved at 300 °C, which is about 3.8 times higher than that sintered without MOD ink (4.5 MPa). When bonding temperature rose to 350 °C, even higher shear strength over 20 MPa was obtained. The bonding strength was comparable to the traditional Pb-5Sn solder alloy, promising its industrial potential.
研究领域:
材料科学
·
电子工程
·
纳米技术
✓ 已验证
DOI
高影响因子
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