JOURNAL OF ALLOYS AND COMPOUNDS
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2018
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IF 3.779
Guang Yang,Haixu Wang,Ning Wang,Rong Sun,Ching-Ping Wong
Copper chemical mechanical planarization (Cu-CMP) is an essential procedure for the fabrication of integrated circuits (IC). The corrosion inhibitors in the Cu-CMP slurry could balance the over etching from the corrosion reagents to facilitate the global planarization of the copper layers. However, the normally used Cu-CMP inhibitor 1-benzotriazole (BTA) was toxic for the long time usage. In this paper, the biocompatible polyvinyl pyrrolidone (PVP) was proposed to substitute the BTA in the Cu-CMP. With an integrated electrochemical test, including the Tafel polarization, electrochemical impedance spectra (EIS), and the electrochemical noise (EN), it was found that the PVP could possess a good inhibition effect comparable to BTA, which opened up a promising way for the design of biocompatible inhibitors in the Cu-CMP.
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JOURNAL OF ALLOYS AND COMPOUNDS
·
2018
·
IF 3.779
Ailian Chen,Yang Chen,Xiaobing Zhao,Yayun Wang
For chemical and mechanical polishing/planarization (CMP) applications, the finished surface roughness , polishing efficiency, and defectivity critically depend on the type of abrasive particles and their physical and surface chemical characteristics. Both of core/shell structured inorganic/organic hybrids and porous particles exhibit important potentials in achieving high-efficiency and damage-free CMP. In this work, the polystyrene (PS)-core/mesoporous silica (mSiO 2 )-shell hybrid particles with a comparable shell thickness and tunable core size were synthesized via a modified Stöber process using cetyltrimethylammonium bromide as the template and tetraethyl orthosilicate as the silica precursor. The as-obtained PS/mSiO 2 hybrid particles were characterized by XRD , FT-IR, FESEM , HRTEM , STEM-EDX, HAADF-STEM, DLS, and N 2 sorption-desorption measurements. The mechanical properties (elastic moduli) of PS/mSiO 2 hybrids were investigated via atomic force microscopy (AFM) nano-indentation using Hertz contact model. The effect of the abrasive particle size of PS/mSiO 2 hybrids on CMP performances for oxidized silicon wafers was investigated in terms of root-mean-square ( RMS ) roughness and material removal rate ( MRR ). The PS/mSiO 2 hybrid abrasives presented a reduced roughness and an enhanced MRR with respect to non-porous solid silica abrasives with a comparable particle size. The improved CMP performance might be attributed to the reduction of overall hardness and/or elastic modulus and the improvement of interfacial tribo-chemical wear, resulting from the abundant meso-channels in the silica shells. Furthermore, the RMS roughness and MRR decreased as the PS core size decreased for PS/mSiO 2 hybrids with a comparable mSiO 2 shell thickness. The presented work describes our effort to engineer hybrid abrasives by regulating their polymer core size in order to optimize the CMP performance.
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高影响因子
RSC Advances
·
2017
·Vol. 7
·期 11
·6548-6558
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IF 3.108
Yang Chen,Ailian Chen,Jiawei Qin
Organic/inorganic composite particles with a core–shell structure exhibit potential applications in chemical mechanical polishing/planarization (CMP) for mechanically challenging materials (copper and low-k dielectrics etc.). In this work, the spherical composites comprised of polystyrene (PS) cores and mesoporous silica (mSiO2) shells were synthesized through a self-assembly of cetyltrimethylammonium bromide and silicate oligomers combined with a selective etching strategy. The composites with sponge-like (composites-A) or worm-like shells (composites-B) were obtained by adjusting the stirring rate in the synthesis processes. The oxide CMP performances of the composites with different shell structures were compared in terms of surface finishing and material removal rate (MRR). Polishing results showed that the particles consisted of mesoporous shells (composites-A and -B) and presented a lower surface roughness and higher MRR than those of the composites with CTAB/SiO2 nonoporous shells (composites-C), indicating that the mSiO2 shells contributed to the reduction of indentation depth (surface roughness) and improvement of MRR. The average root-mean-square (RMS) roughness and MRR for composites-A were 2.65 Å and 65 nm min−1, respectively, which were comparable to the measured values for composites-B (2.07 Å and 75 nm min−1). As confirmed by FESEM, the sponge-like shells in some of composites-A peeled off, whereas the radial mSiO2 shells for most of composites-B were not disrupted. An improved organization of mesochannels in the silica shells is beneficial to the enhanced mechanical and structural stability of PS/mSiO2 composite particles during CMP applications.
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MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
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2025
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IF 4.6
Zheng Wu,Changxin Dong,Xinhuan Niu,Jiakai Zhou,Chao He,Xinjie Li,Bin Hu,Jiahui Li
As technology nodes shrink below 10 nm, stricter demands are required for the one-step polishing of copper (Cu) films in ruthenium (Ru)-based Cu interconnects: a high Cu removal rate (RR) and a near-zero Ru RR. In this work, an eco-friendly slurry was newly formulated by combining hydroxyethylethylene diphosphonic acid (HEDP) and phytic acid (PA), both containing phosphate groups, to enhance corrosion inhibition and polishing performance during Cu/Ru CMP. Polishing and electrochemical experiments demonstrated that the synergistic inhibitors achieved a corrosion inhibition efficiency of 96 % for Cu. Under optimized conditions, the material removal rates (MRRs) of Cu and Ru reached 5432 Å/min and 10 Å/min, respectively, with a maximum removal rate selectivity (RRS) of 543:1 and surface roughness ( Sqs ) of 0.76 nm and 0.53 nm. Contact angle, coefficient of friction (COF), Ultraviolet–visible spectroscopy (UV–Vis), X-ray photoelectron spectroscopy (XPS) analyses confirmed the formation of a protective passivation film on Cu/Ru surfaces from both mechanical and chemical perspectives. Theoretical calculations identified the reactive sites of the inhibitors and simulated their adsorption behavior in a CMP environment, revealing that the synergistic inhibitors exhibited the highest adsorption energy. Without the use of surfactants, the multifunctional synergistic inhibitors improved surface quality through lubrication and passivation effects while reducing reagent consumption. This work provides both theoretical and practical guidance for the design of green and efficient CMP slurries in advanced semiconductor manufacturing.
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MICROELECTRONICS RELIABILITY
·
2026
·
IF 2.5
Zhe Liang,Yu Zhu,Ru Wang,Zhanjie Du,Yang Chen,Peng Yang,Yunhui Shi
This study aimed to optimize the backside chemical mechanical polishing (CMP) process of silicon through-hole (TSV) wafers by investigating diethylenetriamine (DETA). The study reveals DETA's synergistic mechanism through electrochemical analysis, characterization (FESEM/XPS), and density-functional theory (DFT) calculations. Under optimized conditions (1.5 wt% SiO 2 , 0.05 wt% SDBS and 0.25 wt% DETA), a high Si-to-Cu removal rate ratio of 16.7 is achieved, with a Si removal rate exceeding 1 μm/min. This ensures efficient Cu pillar exposure. Furthermore, surface roughness is significantly improved: Si Sq decreases from 1.790 nm to 0.825 nm and Cu Sq from 3.190 nm to 1.540 nm. The total thickness variation (TTV) meets industry standards. The findings provide a viable process optimization scheme and theoretical support for high-precision TSV polishing.
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APPLIED SURFACE SCIENCE
·
2024
·
IF 6.3
Zhenyu Zhang,Ning Wang,Xingzi Wang,Zheng Zhao,Chen Dong,Xianmin Tan,Yuanyuan Zheng,Zongyu Feng,Xiangxi Zhong,Juanyu Yang,Xiaowei Huang
With the linewidth of integrated circuits has progressively narrowed, imposing higher demands on the chemical mechanical polishing (CMP) process. Cerium oxide nanoparticles are widely used as abrasives in CMP, with their physical structure and the surface content of Ce 3+ ions and oxygen vacancies directly affecting their CMP performance. Here in, we synthesized La/Pr/Nd doped CeO 2 with the porous self-assembled spherical structures. Doping with La/Pr/Nd reduced the grain size of cerium oxide, increased its specific surface area, decreased the pore size, and increased the pore volume. HR-TEM analysis shows that the porous self-assembled spherical CeO 2 primarily exposes the (111) crystal facet. Additionally, the density functional theory (DFT) calculation, XPS, H 2 -TPR and XANES analyses shown that doping of La/Pr/Nd facilitated the formation of oxygen vacancies and increased the Ce 3+ content on the (111) crystal facet of the CeO 2 . La atoms are more likely to stabilize on the CeO 2 (111) surface compared to Pr and Nd atoms. The CMP results indicated that, The La-CeO 2 exhibited a higher MRR of 338 ± 7.54 nm/min, which is a 35 % increase compared to p-CeO 2 , and achieved superior surface roughness ( Ra = 0.201 ± 0.010 nm).
研究领域:
材料科学
·
纳米技术
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Silicon
·
2025
·
IF 3.3
Xing Yi,Liu Weili,Song Zhitang
To enhance silicon wafer surface quality and corrosion resistance during chemical mechanical polishing (CMP), this study develops a composite surfactant system combining nonionic AEO-9 and anionic ADBS. At an optimal AEO-9/ADBS molar ratio of 2:1, the formulation achieves low surface roughness (Ra = 0.135 \(nm\) ), a high material removal rate (MRR = 198 \(nm/min\) ), stable slurry dispersion, and peak corrosion inhibition efficiency of 93.3%. Synergistic effects at this ratio are confirmed by a negative interaction parameter ( \(\beta\) = − 1.90) and enhanced micellization. Adsorption between surfactant molecules and silicon wafer follows the Langmuir adsorption isotherm. Molecular dynamics simulations further reveal strong adsorption of surfactant molecules in a parallel orientation on the silicon surface, with a high binding energy of 337.2 \(kJ/mol\) , which improves wetting and water retention. This work presents a strategy integrating corrosion inhibition with surface quality optimization in CMP slurries, providing molecular-level insights into surfactant-assisted protection for designing high-efficiency, low-defect slurries for advanced wafer fabrication.
研究领域:
材料科学
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半导体制造
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表面化学
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胶体与界面科学
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计算材料科学
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JOURNAL OF MOLECULAR LIQUIDS
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2023
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IF 6
Shihao Zhang,Yazhen Wang,Baimei Tan,Fangyuan Wang,Xiaolong Wang,Haoyu Du
Post-chemical mechanical polishing (CMP) cleaning is an indispensable process to remove organic residues and particles on the wafer surface after CMP. Benzotriazole (BTA), a dominant corrosion inhibitor in Cu-CMP slurry, can easily remain on the copper surface after CMP, affecting the performance and yield of devices, and its removal has attracted more attention. This paper revealed the effect and mechanism of three amino acids, lysine, serine, and proline, on BTA removal in tetraethyl ammonium hydroxide-based alkaline solutions during post-Cu-CMP cleaning. Experimental results showed a diminishing enhancement in the cleaning efficiency of BTA after adding lysine (97.1%), serine (96.7%), and proline (94.1%) with almost the same concentration. Ultraviolet–visible absorption spectrum proved the lysine’s complexing ability was slightly better than the other. Besides, quantum chemical parameters of amino acid molecules calculated by density functional theory further suggested that lysine has more reactive sites and mainly bonds with copper through N2 and N8. The adsorption structures of three amino acids were simulated through the molecular dynamics method, and lysine turned out to be parallel absorbed on the Cu (1 1 1) surface with the lowest adsorption energy of −30.24 eV. Finally, the cleaning process simulation revealed the dynamic behaviors of BTA and lysine.
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APPLIED SURFACE SCIENCE
·
2017
·
IF 3.387
Tingting Liu,Hong Lei
Abrasive is one of the most important factors in chemical mechanical polishing (CMP). In order to improve the polishing qualities of sapphire substrates, the novel Nd 3+ -doped colloidal SiO 2 composite abrasives were prepared by seed-induced growth method. In this work, there were a series of condensation reactions during the synthesis process of Nd 3+ -doped colloidal SiO 2 composite abrasives and the silica cores were coated by shells (which contains SiO 2 , Nd 2 Si 2 O 7 and Nd(OH) 3 ) via chemical bonds and hydrogen bonds in the Nd 3+ -doped colloidal SiO 2 composite abrasives, which made the composite abrasives’ core-shell structure more sTable Scanning electron microscopy (SEM) showed that Nd 3+ -doped colloidal SiO 2 composite abrasives were spherical and uniform in size. And the acting mechanisms of Nd 3+ -doped colloidal SiO 2 composite abrasives on sapphire in CMP were investigated. Time-of-flight secondary ion mass spectroscopy (TOF-SIMS) analysis and X-ray photoelectron spectroscopy (XPS) analysis demonstrated that the solid-state chemical reactions between the shells (which contained SiO 2 , Nd 2 Si 2 O 7 and Nd(OH) 3 ) of Nd 3+ -doped colloidal SiO 2 composite abrasives and the sapphire occurred during the CMP process. Furthermore, Nd 3+ -doped colloidal SiO 2 composite abrasives exhibited lower surface roughness and higher material removal rate (MRR) than the pure colloidal SiO 2 abrasives in the same polishing conditions, which was attributed to the solid-state chemical reactions between shells of Nd 3+ -doped colloidal SiO 2 composite abrasives and sapphire.
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Desalination and Water Treatment
·
2024
·
IF 1
Songhao Luo,Zhigang Yi,Min Cheng,Biao Song,Chengyun Zhou,Wenjun Wang,Zhifeng Liu
It is challenging to produce soft polymer materials with high surface area and nanoscale morphology that can be used for continuous flow water treatment in a processable, versatile, and stable manner. Here, we manufactured a processable Ag@CMPA-bph and used it to treat pollutants in wastewater at continuous flow conditions. The aerogel was prepared by a simple reduction method of CMP matrix and Ag metal precursors. Thermogravimetric analysis and electron microscopy showed that the aerogel had excellent thermal stability and distribution of fine Ag nanoparticles. The synthesized aerogel inherits the controllable properties of the CMP matrix and can be tailored to a specific shape for installation into the water treatment unit. In continuous flow conditions, this aerogel shows excellent catalytic activity to efficiently treat the combined pollutant containing p- nitrophenol and methyl orange ( p- NP&MO), which can reach a removal rate of more than 99 % at the flow rate of 0.6 L h -1 . Furthermore, the Ag@CMPA-bph can also be used for continuous flow treatment of pollutants in river water sample and shows robust anti-pollution load capacity and catalytic activity.
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Small Methods
·
2026
·
IF 8.7
Gulraiz Tanvir,Kamran Amin,Zhixiang Wei
Conjugated microporous polymers (CMPs) have emerged as promising materials for energy storage devices, including lithium-ion batteries (LIBs), owing to their high surface area, chemical tunability, eco-friendliness, and fast redox kinetics. However, their practical applications are limited by poor conductivity, low active material utilization, lower redox potential and cycling degradation, which hampers their utilization for LIBs. Herein, we report the synthesis of dihydrophenazine based CMP (TPA-DPZ) with multi-redox centers and its composite with acid functionalized CNTs equal to only 5% of CNTs by total wt.% of monomers using in situ polymerization technique (TPA-DPZ@CNT 5%). The fabricated cathode with high active material loading of 80% with an average discharge potential of 3.39 V achieved a maximum specific capacity of 128 mAh g −1 . Remarkably, at a higher current density of 20 A g −1 , it retains a capacity of 68.34 mAh g −1 with a discharge time of only 13 s. The electrode exhibits excellent long-term stability, retaining 89% of its initial capacity after 10 000 cycles. It possessed a high energy density of 445 Wh kg −1 (at 0.1 A g −1 ) combined with a high power density of 67 kW kg −1 at 20 A g −1 . This work highlights the synergistic effect of multi-redox CMP and conductive CNTs in overcoming the limitations of organic electrodes.
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PubMed
高影响因子
ChemistrySelect
·
2026
·Vol. 11
·期 8
·e07116
·
IF 2.3
Xiongtao Yu,Haiping Xu,Rui Wang,Feng Zhou,Chunmin Yang
In this manuscript, Au nanoparticles (AuNPs) and a nanospherical conjugated microporous polymer (CMP) were prepared and then modified on the surface of screen-printed carbon electrode (SPCE) to construct an electrochemical sensor for high sensitivity and rapid detection of 3-amino-2-oxazolidinone (AOZ). The preparation process of the materials and electrodes were characterized by scanning electron microscope (SEM), transmission electron microscope (TEM), cyclic voltammetry (CV), differential pulse voltammetry (DPV) and electrochemical impedance (EIS), and the test conditions were optimized. Under optimal conditions, the oxidation peak current of AOZ and the concentrations show a wider linear relationship in the ranges of 1.0×10 −8 ∼1.0×10 −6 and 1.0×10 −6 ∼ 1.0×10 −4 mol/L ( R 1 2 = 0.996, R 2 2 = 0.998), respectively, and a lower detection limit which is as low as 3.3×10 −9 mol/L (S/N = 3) compared to existing methods. The reason for this result may be that CMP exhibited abundant porous structures and numerous active sites, which could significantly improve response sensitivity; AuNPs also possess high specific surface area and make the diffusion and transport of electrolyte ions easier. CMP-AuNPs nanocomposites greatly improved the electron transport rate, signal intensity and electroactive surface of SPCE, thereby improving the sensitivity of the sensor. It is worth noting that the sensor also has strong anti-interference ability, stability, and reproducibility. When applied to detect AOZ in real samples, it also showed good recovery rate. Compared with HPLC-MS/MS, the sensor also obtained good accuracy and consistency, which has great application potential for rapid on-site analysis and detection in animal-derived food not only for AOZ but also for Furazolidone (FZD).
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危险品化学品经营许可证（带存储）