MATERIALS CHEMISTRY AND PHYSICS
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2023
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IF 4.6
Jingpi Gao,En Li,Kena Song,Tongtong Ma,Ran Yang,Yi Zhang,Nan Li,Xiaoran Liu,Jinghua Li
The dye degradation method based on Fenton-like heterogeneous nanostructures has gained significant attention in recent years. We have developed a Copper-Stannum-Polypyrolle-Heterogeneous (Cu–Sn oxide-PPy Heterogeneous, CSPHGs) catalytic system. The system uses a PN junction formed by two oxide semiconductors (Cu 2 O and SnO 2 ) as the core, which is then coated with polypyrolle (PPy) on the outer layer. Under near-infrared (NIR) light irradiation (500.0 μg ml −1 , 1.2w·cm −2 ), the temperature rapidly reached approximately 45 °C within 5 min, demonstrating excellent photothermal performance. We have overcome the limitation of traditional Fenton reactions that require weak acidic conditions for effective operation. Moreover, we have increased the photostability of Cu 2 O monomers by incorporating them into a three-layer heterostructure . The Rhodamine B (RhB) degradation experiment revealed that the generated reactive oxygen species (·OH), effectively catalyze the decomposition of dyes. Within 120 min, the degradation rate exceeded 99%. This research provides a new option for environmental remediation through the combination of photo-Fenton and photothermal processes.
研究领域:
环境科学
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材料科学
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DOI
高影响因子
CHEMISTRY OF MATERIALS
·
2026
·
IF 7.1
Peng Wu,Yourong Shu,Yongjiang Di,Huichao He,Qian Yang,Wenrong Wang,Hanmei Jiang,Lijian Meng,Haibo Ruan,Sheng Tang,Jingguo Zhang,Tao Han
Cu@Sn core–shell nanoparticles have emerged as promising candidates for high-density electronic packaging owing to their excellent mechanical strength, electrical conductivity, and thermal stability. However, the intrinsic mismatch in the interdiffusion rates of Cu and Sn inevitably leads to the formation of severe Kirkendall voids, compromising the microstructural integrity and overall device reliability. In this work, a solid Cu@Sn core–shell nanostructure was constructed by introducing trace amounts of P during the Cu–Sn chemical displacement process, which shows an optimized Sn-to-Cu thickness ratio of ∼10%, with a Cu core of 2.65 ± 0.06 μm and an Sn shell of ∼0.29 μm. At the Sn/Cu interface, P selectively enriches on the Cu surface to form an adsorbed layer, suppressing the inward diffusion of Sn, where P promotes the in situ formation of ultrafine Cu3P nanocrystals and exerts a significant interfacial pinning effect on outward Cu diffusion and increases the vacancy formation energy. Notably, thermogravimetric analysis confirms the substantially enhanced oxidation resistance of the solid Cu@Sn nanoparticles (residual mass at 600 °C: 109.66% for Cu@Sn vs 123.54% for bare Cu). When used as soldering precursors, the P-mediated Cu@Sn solid nanoparticles form dense Cu3Sn intermetallic compound (IMC) frameworks after reflow at 300 °C, yielding void-free joints with remelting temperatures above 425 °C. This work not only elucidates the mechanism by which P-mediated interfacial engineering suppresses Kirkendall void formation but also highlights the significant potential of Cu@Sn nanoparticles for high-reliability electronic packaging, offering a promising pathway toward enhanced power density and device reliability.
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DOI
高影响因子
MATERIALS CHEMISTRY AND PHYSICS
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2025
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IF 4.7
Haozhe Pang,Shimao Shangguan,Ya Chen,Yue Zhang,Siyuan Fan,Lida Shen,Zongjun Tian,Zhidong Liu
Bronze, as a solid self-lubricating material, is widely used in various frictional applications. However, under increasingly common high-frequency and high-load conditions, particularly in the absence of lubricants, bronze layers are prone to rapid wear. Incorporating MoS 2 particles to fabricate solid self-lubricating composite coatings is considered a promising approach to improve overall performance in harsh environments. In this study, a friction-assisted jet electrodeposition process is employed to fabricate Cu-Sn-MoS 2 composite coatings. This technique enhances particle embedding and surface leveling, producing uniform and dense coatings with significantly improved tribological performance. The methodological framework of this study involves the fabrication of Cu-Sn-MoS 2 composite coatings via friction-assisted jet electrodeposition, followed by systematic characterization of their surface morphology, microhardness, adhesion, and tribological behavior. The results show that a MoS 2 content of 5 g/L provides a uniform and compact surface with fine grains, sufficient microhardness and adhesion strength, and a continuous lubricating film formed during wear. The wear mechanism was revealed to explain why the Cu-Sn-MoS 2 coating exhibited a strong performance in mechanical properties and wear resistance. This content achieves the lowest friction coefficient and the best wear resistance among all tested compositions.
研究领域:
材料科学
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表面工程
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摩擦学
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电沉积
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复合涂层
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DOI
高影响因子
ELECTROCHIMICA ACTA
·
2025
·
IF 5.6
Yixin Liu,Wenyu Dong,Tao Wang,Jianwei Zhao,Peng Li
Conventional planar copper (Cu) current collectors severely limit the rate capability and cycle life of lithium-ion batteries. To overcome this, we report a three-dimensional (3D) porous Cu-Sn alloy architecture fabricated via scalable, cyanide-free electrodeposition and chemical dealloying methods. Its core innovation lies in the synergistic benefits of the porous structure and Cu-Sn alloying: the interconnected pores facilitate rapid Li⁺ transport and buffer graphite's volume expansion, while the intrinsic lithiophilicity of Sn ensures a stable, low-impedance interface. Consequently, an anode using the optimized porous collector delivers a remarkable specific capacity of 120.3 mAh g⁻¹ at 5C, representing a nearly five-fold enhancement in high-rate capacity retention over conventional Cu foil. The collector also confers exceptional cycling stability, enabling a 57.2 % capacity increase over 200 cycles, in stark contrast to the decay observed with standard foil. Electrochemical analysis confirms that the porous design drastically reduces electrode impedance while maintaining structural integrity. This work validates that engineering the current collector architecture is a powerful and effective strategy for developing high-performance, fast-charging batteries.
研究领域:
材料科学
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储能
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电化学
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电池技术
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DOI
高影响因子
ACS Applied Electronic Materials
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2025
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IF 4.7
Ke-Xin Chen,Rui-Chong Li,Li-Yin Gao,Zhi-Chao Meng,Chang Liu,Zhi-Quan Liu
The interfacial reactions between Cu and Sn at the nanoscale, which is critical to the development of microbump (μ-bump) technology, require further understanding. Constructing the nanoscale interface for observing the interfacial behavior during reactions is a challenge. This study investigates the interfacial reactions within Cu/Sn composite nanoarrays fabricated through template electrodeposition to explore the growth process of intermetallic compounds (IMCs). The results reveal that polycrystalline Cu/Sn composite nanoarrays were successfully electroplated with varying Sn fractions, which regulated the growth of IMCs. Additionally, both polycrystalline copper/IMC and nanotwinned copper (nt-Cu)/IMC nanowires were analyzed to explore the effect of the Cu microstructure on IMC growth. Finally, full-IMC nanowires were prepared via high-temperature storage, where twins may act as vacancy sinks at this condition, preventing the formation of voids, which should hold great significance for guiding the preparation of full-IMC μ-bumps in transient liquid-phase (TLP) bonding. This work provides deeper insights into solder joint interface changes in electronic devices during operation.
研究领域:
材料科学
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电子封装
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纳米技术
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DOI
高影响因子
CERAMICS INTERNATIONAL
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2026
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IF 6
Wei Feng,Jian Zhang,Yong Xiao,Peng Cao,Guoqiang Luo,Qiang Shen
Active metal brazing of Si 3 N 4 /Cu joints typically forms a rigid TiN/Ti 5 Si 3 interface that suffers from significant thermal mismatch. This study demonstrates an alternative strategy for engineering the interfacial reaction pathway using a (Cu20Sn) 100-x Ti x filler. A distinct Cu 2 Ti 4 O interfacial layer formed through oxygen participation in the interfacial reaction during brazing. Thermodynamic analysis reveals that the Ti-O reactions possess a significantly greater driving force than conventional Ti-N and Ti-Si reactions. The resulting Cu 2 Ti 4 O phase establishes a beneficial coefficient of thermal expansion (CTE) gradient across the joint, thereby effectively mitigating interfacial thermal stress. Joint brazed with 5 wt% Ti achieved the highest shear strength of 137.3 MPa, which is attributed to the optimized morphology of a discontinuous Cu 2 Ti 4 O layer and the reduced brittle CuSn 3 Ti 5 precipitation. These results demonstrate a new approach for interfacial engineering of non-oxide ceramic joints, confirming that trace oxygen can act as an effective microstructural modifier.
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高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
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2019
·Vol. 30
·期 5
·4378-4384
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IF 2.195
Wu Jie,Gao Chunhui,Han Lu,Shen Shanshan,Jia Ming,Wang Li,Jiang Liangxing,Liu Fangyang
Ternary Cu 2 SnS 3 (CTS) is a promising material for thin-film solar cells because it consists of nontoxic and earth-abundant elements. The present paper reports the preparation of monoclinic CTS thin films by a sol–gel solution-based method. The effects of the Cu/Sn atomic ratio on the structure and morphology were investigated. As the atomic ratio of Cu/Sn varied from 1.6 to 2.0, the compactness of the CTS films improved; furthermore, secondary phases, such as SnS, gradually disappeared; and the grain size of the films decreased. The CTS film with a Cu/Sn ratio of 1.9 showed a monoclinic structure with homogeneous morphology and a band gap of 1.12 eV, yielding a power conversion efficiency of 0.58%. These results could pave the way for the development of CTS thin-film solar cells.
研究领域:
材料科学
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可再生能源
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DOI
高影响因子
危险品化学品经营许可证（带存储）