Yao Liu,Jinqiang Zhou,Jianwei Zhang,Jianguo Cheng,Lina Zhan
The attenuation coefficient of ultraviolet UV light is a critical factor influencing the mechanical properties of photocurable ceramics. Aiming to fabricate high-precision and high-performance ZrO2 ceramics, this study systematically investigates the impact of the UV attenuation coefficient on the polymerization kinetics of ZrO2 ceramic slurries. Through linear fitting, the absorption and scattering coefficients of the ZrO2 slurry were determined as 66 cm−1. By integrating the Beer-Lambert law, we further validated how the UV attenuation coefficient affects the variation in C=C double bond conversion within the cured slurry layers. Additionally, based on Mie scattering theory, although the incident energy was 52 mW cm−2 and slice thickness was 50 μm, the curing depth Cd and exposure energy In{E}_{o} is optimal. The ZrO2 ceramic was formed , in which the sintered sample density was 6.02 g cm−3 (99%).
To meet the high demand for ceramic/superalloy composite structural components in various fields, an advanced high-temperature adhesion technique was firstly developed by preparing a novel inorganic/organic hybrid adhesive suitable for ZrO 2 and TC4 . Chemical bonding started to work at ∼600°C, and became the crucial bonding mechanism at elevated temperatures. The formation of ZrSiO 4 and Ti 5 Si 3 at the interfaces of two substrates not only increased the interfacial connection strength , but also formed two gradient layers with a size of ∼2 μm to effectively alleviate the difference of composition and performance between the adhesive and substrates. In the temperature range of 500–900°C, the matching degree of CTE among ZrO 2 , adhesive and TC4 is higher, and the maximum difference does not exceed 3×10 -6 K -1 . Meanwhile, the formation of a composite structure containing various ceramics (ZrO 2 , SiC and ZrB 2 ) and intermetallics (Ni–Si, Al–Ni), and the improvement of structural compactness of adhesive from 500 to 900°C greatly improved the bonding strength to the maximum value of 31.4 MPa at 900°C. Also, the adhesive pretreated at 900°C showed good thermal cycling resistance, and the strength was still higher than 15 MPa after 50 cycles. For cured adhesive, when used directly in an extreme environment, it can provide bonding strength not less than 5 MPa in the whole temperature range, indicating that the adhesive possessed potential emergency repair convenience. This work significantly broadened the application of high-temperature-resistant adhesion technology in the connection of dissimilar ceramics and alloys.