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APPLIED SURFACE SCIENCE · 2023 · IF 6.7

Cu-loaded MOF-303 for iodine adsorption: The roles of Cu species and pyrazole ligands

Menglin Li,Xinpeng Wang,Jian Zhang,Yonghao Gao,Wen Zhang

The capture of toxic radioiodine is an increasingly important priority for the safe development of nuclear energy. Copper is a promising alternative for expensive silver to capture iodine. To develop novel copper-based adsorbents and determine the effect of copper species on iodine adsorption, the metal–organic framework with dual-pyrazole ligands (MOF-303) is employed as the scaffold to bind Cu 2+ species. Cu 0 nanoparticles were formed after the reduction by NaBH 4 . The obtained Cu 2+ -MOF-303 and Cu 0 -MOF-303 show high iodine uptake capacities at 353 K, 747 mg·g −1 and 837 mg·g −1 , respectively. They also show high iodine uptake capacities of more than 300 mg·g −1 at a high temperature (423 K), which are better than other Cu-based adsorbents. Besides, the loading of Cu can enhance the iodine selectivity under humid vapor, and iodine adsorption rate in iodine-cyclohexane solutions. The Cu 0 on Cu 0 -MOF-303 can react with iodine directly via the redox mechanism. For Cu 2+ -MOF-303, the adjacent pyrazole ligands can chelate with Cu 2+ ions strongly and transfer charges to trapped iodine to form polyiodide anions, and thus stable CuI species could also be generated. The strategy of anchoring Cu species using MOF-303 provides large channels for iodine diffusion, and highly-dispersed Cu and N sites for iodine capture.

CAS / MDL: 7447-39-4 16940-66-2
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JOURNAL OF SOLID STATE CHEMISTRY · 2023 · IF 3.3

Porous Cu-based metal organic framework (Cu-MOF) for highly selective adsorption of organic pollutants

Abid Hussain Shah,Zain Ul Abideen,Sumaira Maqsood,Farzana Rashid,Rafi Ullah,Attiq Ur Rehman,Muhammad Dildar,Manzoor Ahmad,Kifayat Ullah,Muhammad Numan Rafi,Fei Teng

In this study, copper based metal organic frame work (Cu-MOF) was synthesized by using different solvents i. e. H 2 O, Dimethylformamide (DMF) and DMF ​+ ​C 2 H 5 OH ​+ ​H 2 O solutions at various temperatures. Cu-MOF synthesized in different solvents exhibited a large number of properties and advantages including easy synthesis procedure, high porosity, good crystallinity , high surface area, massive pore volume , controllable pore surface properties (zeta potential), rigid and chemical stability. The as-synthesized Cu- MOF was analysed by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), Scanning electron microscopy (SEM), Brunauer–Emmett–Teller (BET) surface area, zeta potential , electrostatic attraction and Thermal gravimetric analysis (TGA). A higher BET surface area of 121.1 ​m 2  ​g −1 was obtained for Cu-MOF synthesized in DMF ​+ ​C 2 H 5 OH ​+ ​H 2 O compared with H 2 O (109.3 ​m 2  ​g −1 ) and DMF (115.1 ​m 2  ​g −1 ) solvents. The as-obtained Cu-MOF was used to investigate adsorption kinetic performances of methylene blue (MB) and methyl orange (MO) dye molecules. Compared with other samples, Cu-MOF synthesized in (DMF ​+ ​C 2 H 5 OH ​+ ​H 2 O) has a significantly enhanced adsorption ability for MB but a lower for MO dyes. After 4 ​min, the adsorption co-efficient ( k) values were calculated to be 0.506, 0.846 and 1.1915 min −1 for MB and 0.029, 0.024 and 0.005 min −1 for MO dyes for Cu-MOF (H 2 O), Cu-MOF (DMF) and Cu-MOF (DMF ​+ ​C 2 H 5 OH ​+ ​H 2 O), respectively. It was found that Cu-MOF has a higher adsorption for MB dye but a poor adsorption capacity for MO, which was attributed to the electrostatic attraction/repulsion phenomena. Moreover, compared with Cu-MOF (DMF) and Cu-MOF (H 2 O), Cu-MOF (DMF ​+ ​C 2 H 5 OH ​+ ​H 2 O) shows an improved stability at 370, 417 and 423 ​°C temperatures. The result obtained through experiment suggested that porous Cu-MOF microstructures synthesized in DMF ​+ ​C 2 H 5 OH ​+ ​H 2 O have potential application for the treatment wastewaters having MB and MO dyes.

CAS / MDL: 10031-43-3 554-95-0
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Journal of Energy Chemistry · 2023 · IF 13.1

Cu, N codoped carbon nanosheets encapsulating ultrasmall Cu nanoparticles for enhancing selective 1,2-propanediol oxidation

Yonghai Feng,Min Yu,Minjia Meng,Lei Liu,Dewei Rao

In the selective oxidation of biomass-based 1,2-propanediol (PDO) with oxygen as the terminal oxidant, it is challenging to improve the lactic acid (LA) selectivity for nonnoble metal nanoparticles (NPs) due to their limited oxygen reduction rate and easy C–C cleavage. Given the high economic feasibility of nonnoble metals, i.e., Cu, in this work, copper and nitrogen codoped porous carbon nanosheets encapsulating ultrafine Cu nanoparticles (Cu@Cu-N-C) were developed to realize highly selective of PDO oxidation to LA. The carbon-encapsulated ultrasmall Cu 0   NPs in Cu@Cu-N-C have high PDO dehydrogenation activity while N-coordinated Cu (Cu-N) sites are responsible for the high oxygen reduction efficacy. Therefore, the performance of catalytic PDO conversion to LA is optimized by   a proposed pathway of PDO → hydroxylacetone → lactaldehyde → LA. Specifically, the enhanced LA selectivity is 88.5%, and the PDO conversion is   up to 75.1% in an O 2 -pressurized reaction system (1.0 MPa O 2 ), superior to other Cu-based catalysts, while in a milder nonpressurized system (O 2   flow rate of 100 mL min −1 ), a remarkable LA selectivity (94.2%) is obtained with 39.8% PDO conversion, 2.2 times higher than that of supported Au nanoparticles (1% Au/C). Moreover, carbon encapsulation offers Cu@Cu-N-C with strong leaching resistance for better recycling.

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LANGMUIR · 2022 · IF 4.331

Hierarchical Structures Composed of Cu(OH)2 Nanograss within Directional Microporous Cu for Glucose Sensing

Yibo Ao,Jinqing Ao,Ling Zhao,Liwei Hu,Fengsheng Qu,Biao Guo,Xue Liu

Cu(OH)2 nanomaterials are widely investigated for non-enzymatic glucose sensors due to their low-cost and excellent performance. Cu(OH)2 nanomaterials usually grow on substrates to form sensor electrodes. Reported works mainly focus on structure adjusting of the Cu(OH)2 nanostructures, while the optimization of substrates is still lacking. In the present work, directional porous Cu (DPC) was applied as the substrate for the growth of Cu(OH)2 nanograss (NG), and hierarchical structures of Cu(OH)2@DPC were prepared by alkaline oxidation. The morphology and microstructure evolution of the prepared hierarchical structures was investigated, and the non-enzymatic glucose sensing performance was evaluated. Cu(OH)2@DPC exhibits enhanced comprehensive non-enzymatic glucose sensing performance compared to the reported ones, which may benefit from both the effective adsorption of the Cu(OH)2 NG with a relatively high surface area and the high solute exchange of the DPC by a channel effect. This work provides new insights into the further improvement of the non-enzymatic glucose sensing performance of Cu(OH)2 nanostructures by optimizing the substrate structure.

CAS / MDL: 7727-54-0 1310-73-2
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ACS Applied Electronic Materials · 2022 · IF 4.494

Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu3Sn Paste for High-Power Electronics Packaging

Longjun Guo,Wei Liu,Xiaoliang Ji,Ying Zhong,Chunjin Hang,Chunqing Wang

In this work, a multiscale coralloid nano-Cu3Sn composed of a bimodal structure (∼55 and ∼120 nm) has been successfully synthesized to meet low-cost and Pb-free packaging demands for high-power electronic application. Owing to the excellent oxidation resistance of the Cu3Sn intermetallic compounds (IMCs) and the protection of solvent poly(ethylene glycol)-400 (PEG-400) at high temperature, the full-Cu3Sn joints sintered in air have a comparative shear strength with the joints acquired in vacuum when the sintering temperature is no more than 300 °C. The full-Cu3Sn joints acquired at 300 °C in air achieve a high bonding strength of 40.4 MPa, which is superior to those of traditional Sn-based solder joints (19 MPa) and full-Cu6Sn5 joints (17.7 MPa). The electrical resistivity of the sintered Cu3Sn films reaches 29.1 μΩ·cm in air. Cu3.02Sn0.98 is formed at the interface between the Cu substrate and sintered Cu3Sn layer, contributing to the exceptional bonding strength of the full-Cu3Sn joints. The bonding strength of the joints after high-temperature storage (HTS) tests reveals that the prepared full-Cu3Sn joints possess outstanding long-term thermal stability with a shear strength of 47.9 MPa after 800 h of storage at 250 °C. Our work breaks through the synthesis bottleneck of nano-Cu3Sn IMCs and provides the underlying insights needed to guide the design of highly stable full-IMC joints for high-temperature electronic packaging.

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Materials · 2022 ·Vol. 15 ·期 5 ·1846 · IF 3.748

Effect of Electroless Cu Plating Ti3AlC2 Particles on Microstructure and Properties of Gd2O3/Cu Composites

Haiyao Cao,Zaiji Zhan,Xiangzhe Lv

Ti3AlC2presents a hexagonal layered crystal structure and bridges the gap between metallic and ceramic properties, and Gadolinia (Gd2O3) has excellent thermodynamic stability, which make them potentially attractive as dispersive phases for Cu matrix composites. In this paper, Cu@Ti3AlC2-Gd2O3/Cu composites, Ti3AlC2-Gd2O3/Cu composites, and Gd2O3/Cu composites were prepared by electroless Cu plating, internal oxidation, and vacuum hot press sintering. The microstructure and the effect of the Cu plating on the properties of the Cu@Ti3AlC2-Gd2O3/Cu composites were discussed. The results showed that a Cu plating with a thickness of about 0.67 μm was successfully plated onto the surface of Ti3AlC2particles. The ex situ Ti3AlC2particles were distributed at the Cu grain boundary, while the in situ Gd2O3particles with a grain size of 20 nm were dispersed in the Cu grains. The electroless Cu plating onto the surface of the Ti3AlC2particles effectively reduces their surfactivity and improves the surface contacting state between the Cu@Ti3AlC2particles and the Cu matrix, and reduces electron scattering, so that the tensile strength reached 378.9 MPa, meanwhile, the electrical conductivity and elongation of the Cu matrix composites was maintained at 93.6 IACS% and 17.6%.Keywords:Cu@Ti3AlC2-Gd2O3/Cu composites;electroless Cu plating;microstructure;electrical conductivity;mechanical properties

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ACS Applied Materials & Interfaces · 2023 · IF 9.5

Epoxy Resin-Assisted Cu Catalytic Printing for Flexible Cu Conductors on Smooth and Rough Substrates

Xiaoqiang Dou,Haoran Wang,Zihan Liu,Bowen Zheng,Zijian Zheng,Xuqing Liu,Ruisheng Guo

Flexible copper conductors have been extensively utilized in flexible and wearable electronics. They can be fabricated by using a variety of patterning techniques such as vacuum deposition, photolithography, and various printing techniques. However, vacuum deposition and photolithography are costly and result in material wastage. Moreover, traditional printing inks require posttreatment, which can damage flexible substrates, or grafting polymers, which involve complex processes to adhere to flexible substrates. Therefore, this study proposes a facile method of fabricating flexible metal patterns with high electrical conductivities and remarkable bonding forces on a diverse range of flexible substrates. Catalytic ink was prepared by using a mixture of epoxy resin, copper nanopowder, and nanosilica. The ink was applied to a variety of flexible substrates, including a poly(ethylene terephthalate) (PET) film, polyimide film, and filter paper, using screen printing to establish a bridge layer for subsequent electroless deposition (ELD). The catalytic efficiency was significantly improved by treating the cured ink patterns with air plasma. The fabricated flexible metals exhibited excellent adhesion and desirable electrical conductivity. The sheet resistance of the copper layer on the PET substrate decreased to 9.2 mΩ/□ after 150 min of ELD. The resistance of the flexible metal on the PET substrate increased by only 3.125% after 5000 bending cycles. The flexible metals prepared in this study demonstrated good foldability, and the samples with filter paper and PET substrates failed after 40 and 70 folds, respectively. A pressure sensor with a bottom electrode consisting of a copper interdigital electrode on a PET substrate displayed favorable sensing performance.

CAS / MDL: 112945-52-5
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NANOTECHNOLOGY · 2020 ·Vol. 31 ·期 19 ·195710 · IF 3.551

Preparation and conductive property of Cu coatings and Cu-graphene composite coatings on ABS substrate

Songtan Yang,Zhixin Kang,Tao Guo

A facile, low-cost and environmentally-friendly technique has been developed to prepare highly conductive copper-graphene nanosheet (Cu-GNS) composite coatings on ABS (Acrylonitrile-Butadiene-Styrene) substrate. The surface activation of ABS substrate was obtained by a chrome-free and palladium-free pretreatment consisting of molecular bonding. Before electroplating Cu, the homogeneous single Ag film on ABS surface was achieved by the electroless spray-plating process. In addition, the deposition of Cu and GNS increased in the coatings along with the current density increasing. Four-point-probe test confirmed that the resistivity of Cu coatings (0.08 mΩ mm) and Cu-GNS composite coatings (0.05 mΩ mm) was in the same order of magnitude as pure copper (0.0175 mΩ mm) at high current density. Meanwhile, comparing with the Cu coatings, the resistivity of Cu-GNS composite coatings was reduced by nearly 40% at the same current density. The conductive property was significantly improved owing to the deposition of GNS. Therefore, this work was expected to expand the method of polymer materials surface metallization.

CAS / MDL: 7782-42-5
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ANALYTICAL CHEMISTRY · 2019 · IF 6.35

Promising Electrochemiluminescence from CuInS2/ZnS Nanocrystals/Hydrazine via Internal Cu(I)/Cu(II) Couple Cycling

Li Fu,Bin Zhang,Xiaoyan Long,Kena Fu,Xuwen Gao,Guizheng Zou

Screening a novel electrochemiluminescence (ECL) system is crucial to ECL evolution. Herein, an efficient ECL system with less interference and environmental concern under physiological condition is developed via a unique internal Cu(I)/Cu(II) couple cycling amplified strategy by employing the glutathione- and citrate-capped copper indium sulfide (CIS)/ZnS nanocrystals (NCs) as electrochemiluminophore and N2H4·H2O as co-reactant. CIS/ZnS NCs can be electrochemically injected with valence band (VB) hole at 0.46 and 0.87 V (vs Ag/AgCl), and then achieve the same hole-injected states by relocalizing VB holes with the Cu(I) species inside of CIS/ZnS NCs to form internal Cu(II) defects, while each N2H4·H2O molecule can be successively oxidized to two more reducing species N2H3• and N2H2 around 0.10 V, and inject conduction band (CB) electron onto CIS/ZnS NCs for triple times. The internal Cu(I)/Cu(II) couple cycling involved radiative-charge recombination between these VB hole and CB electron eventually enables two efficient near-infrared ECL processes (around 731 nm) at 0.55 and 0.87 V, in which each single nanocrystal may participate in multiple ECL reaction cycles to produce multiple photons for amplified ECL, similar to the tris(bipyridyl)ruthenium(III) based ECL system. The low-triggering-potential ECL process at 0.55 V can be utilized to selectively determine Cu(II) with a wide linear range from 10 and 1500 nM and a limit of detection of 5 nM (S/N = 3). This work presents a NCs engineering and co-reactant selecting combined strategy for further ECL evolution.

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APPLIED SURFACE SCIENCE · 2024 · IF 6.3

Cu–Cu direct bonding in air by in-situ reduction of copper oxide with glycerol

Xiaocun Wang,Shuo Han,Fei Xiao

With the maximum operating temperature of semiconductor devices becomes higher, novel die attach methods for high temperature application are required. Cu–Cu direct bonding provides a simple solution that eliminates the use of die attach materials and the related reliability issues. However, the easy oxidation of copper is the main obstacle for Cu–Cu direct bonding. In this study, a simple and efficient method for Cu–Cu direct bonding in minutes at low pressure and low temperature in air without complex pre-treatment was developed. The problem of copper oxidation was solved by rapid in-situ reduction and temporary passivation of glycerol. The bonded samples show very high shear strength. The surface leveling effect of the glycerol reduction was verified, which is beneficial for bonding. The bonded samples showed little change in shear strength after 1000 h of aging at 250 °C in air, demonstrating a long-term high temperature service capability. This new bonding method has great potential in power devices packaging and flip chip bonding.

CAS / MDL: 112-60-7
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JOURNAL OF HAZARDOUS MATERIALS · 2024 · IF 12.2

Autocatalytic degradation of Cu-EDTA in the Calcite/PMS system: Singlet oxygen and Cu(III)

Ziyang Chu,Zhengyan Han,Haibo Liu,Tianhu Chen,Xuehua Zou,Hanlin Wang,Fuwei Sun,Hao Wang,Dong Chen

The simultaneous removal of heavy metal complexes (HMCs) and heavy metal ions presents a significant challenge in treating wastewater. To address this, we propose a Calcite/Peroxymonosulfate (Calcite/PMS) system aimed at simultaneously decomplexing Cu-EDTA and removing Cu ions . Calcite/PMS system could achieve 99.5 % Cu-EDTA decomplexation and 61.9 % Cu ions removal within 60 min under initial conditions of Cu-EDTA (10 mg/L), Calcite (3 g/L), and PMS (2 mM). Singlet oxygen ( 1 O 2 ) emerged as the predominant reactive species responsible for Cu-EDTA decomplexation, which selectively targeted the N-C bonds in the Cu-EDTA structure to produce intermediates with lower biotoxicity than EDTA. Interestingly, solid phase Cu(III) (≡Cu(III)) promoted the generation of superoxide radicals (O 2 •− ) with a contribution of up to 72.8 %. Subsequently, nascent ≡Cu(III) and O 2 •− accelerated the degradation of intermediates. Besides, coexisting organic substances inhibited Cu-EDTA decomplexation, whereas inorganic ions had a weak impact. After five cycles of use, the Calcite/PMS system retained 99.3 % efficiency in decomplexing Cu-EDTA. This investigation provides valuable insights into using calcite to remove HMCs and enhances our comprehension of the decomplexation intermediates accelerating HMCs degradation.

CAS / MDL: 70693-62-8
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Nature Communications · 2024 ·Vol. 15 ·期 1 ·1-10 · IF 14.7

Water-assisted oxidative redispersion of Cu particles through formation of Cu hydroxide at room temperature

Fan Yamei,Li Rongtan,Wang Beibei,Feng Xiaohui,Du Xiangze,Liu Chengxiang,Wang Fei,Liu Conghui,Dong Cui,Ning Yanxiao,Mu Rentao,Fu Qiang

Sintering of active metal species often happens during catalytic reactions, which requires redispersion in a reactive atmosphere at elevated temperatures to recover the activity. Herein, we report a simple method to redisperse sintered Cu catalysts via O 2 -H 2 O treatment at room temperature. In-situ spectroscopic characterizations reveal that H 2 O induces the formation of hydroxylated Cu species in humid O 2 , pushing surface diffusion of Cu atoms at room temperature. Further, surface OH groups formed on most hydroxylable support surfaces such as γ-Al 2 O 3 , SiO 2 , and CeO 2 in the humid atmosphere help to pull the mobile Cu species and enhance Cu redispersion. Both pushing and pulling effects of gaseous H 2 O promote the structural transformation of Cu aggregates into highly dispersed Cu species at room temperature, which exhibit enhanced activity in reverse water gas shift and preferential oxidation of carbon monoxide reactions. These findings highlight the important role of H 2 O in the dynamic structure evolution of supported metal nanocatalysts and lay the foundation for the regeneration of sintered catalysts under mild conditions.

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