CRYSTENGCOMM
·
2019
·Vol. 22
·期 4
·678-685
·
IF 3.382
Xiao Shao,Tianyong Zhang,Bin Li,Yue Wu,Xiaoyuan Ma,Jingchao Wang,Shuang Jiang
Copper sulfide (Cu2−xS) is a kind of cation deficient transition metal sulfide, which has attracted great interest due to its unique properties that arise from degenerate vacancy-doping, particularly its tunable localized surface plasmon resonance (LSPR) properties. In this work, a range of vacancy-doped Cu2−xS nanocrystals (NCs) (Cu1.2S, Cu1.4S, Cu1.75S, and Cu1.94S NCs) with a size of around 10 nm was prepared with tunable LSPR through a hot injection method. The doping level was manipulated effectively by varying the injection volume of sulfur powder–oleic acid (S–OA) to finely tune the LSPR wavelength. Cu2−xS NCs with four different doping levels were investigated as photocatalysts for degradation of dyes. The Cu1.94S NCs with the highest LSPR energy exhibited the best photocatalytic activity due to the highest free carrier density, presumably influenced by Cu vacancies and the volume of the S–OA solution. Theoretical calculations of the free carrier density of Cu2−xS NCs are consistent with the order of the photocatalytic activity. The results demonstrate that the correlation of the photocatalytic activity with the corresponding concentration of free holes and the LSPR wavelength is of interest, which will provide inspiration for the design of non-noble metal catalysts by regulating the free hole concentration in degenerate p-doped Cu2−xS caused by cation vacancies.
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Nanomaterials
·
2021
·Vol. 12
·期 1
·127
·
IF 5.076
Qining Wang,Quanwang Yan,Yu Zhao,Jie Ren,Ning Ai
Cu-Mg-Al layered double hydroxides (LDHs) with amine modification were prepared by an organic combination of an anionic surfactant-mediated method and an ultrasonic spalling method usingN-aminoethyl-γ-aminopropyltrimethoxysilane as a grafting agent. The materials were characterized by elemental analysis, XRD, SEM, FTIR, TGA, and XPS. The effects of the Cu2+content on the surface morphology and the CO2adsorption of Cu-Mg-Al LDHs were investigated, and the kinetics of the CO2adsorption and the photocatalytic reduction of CO2were further analyzed. The results indicated that the amine-modified method and appropriate Cu2+contents can improve the surface morphology, the increase amine loading and the free-amino functional groups of the materials, which were beneficial to CO2capture and adsorption. The CO2adsorption capacity of Cu-Mg-Al N was 1.82 mmol·g−1at 30 °C and a 0.1 MPa pure CO2atmosphere. The kinetic model confirmed that CO2adsorption was governed by both the physical and chemical adsorption, which could be enhanced with the increase of the Cu2+content. The chemical adsorption was suppressed, when the Cu2+content was too high. Cu-Mg-Al N can photocatalytically reduce CO2to methanol with Cu2+as an active site, which can significantly improve the CO2adsorption and photocatalytic conversion.
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Materials Reports: Energy
·
2022
·
IF 0
Zhanyou Xu,Yi Xie,Ying Wang
Electrochemical CO 2 reduction reaction (CO 2 RR) exhibits remarkable potential in producing valuable chemicals with renewable energy. Operating CO 2 RR in acidic media is beneficial to solve the issue of low carbon utilization brought by (bi)carbonate formation at the cathode. Suppressing the competing hydrogen evolution reaction and achieving stable CO 2 RR performance remains challenging. Herein, we constructed a 3-dimensional Cu (3D-Cu) gas diffusion electrode (GDE) to achieve efficient C 2 H 4 production with a partial current density ( j C2H4 ) of over 470 mA cm −2 and a Faradaic efficiency (FE C2H4 ) of 40%. With pause electrolysis, the decay rate of the j C2H4 is only half that of the traditional constant electrolysis. The GDE after constant electrolysis was found to suffer from severe salt formation, leading to the decreased activity and poor stability.
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Nature Communications
·
2021
·Vol. 12
·期 1
·1-10
·
IF 14.919
Yu Jiafeng,Sun Xingtao,Tong Xin,Zhang Jixin,Li Jie,Li Shiyan,Liu Yuefeng,Tsubaki Noritatsu,Abe Takayuki,Sun Jian
The rational design of high-temperature endurable Cu-based catalysts is a long-sought goal since they are suffering from significant sintering. Establishing a barrier on the metal surface by the classical strong metal-support interaction (SMSI) is supposed to be an efficient way for immobilizing nanoparticles. However, Cu particles were regarded as impossible to form classical SMSI before irreversible sintering. Herein, we fabricate the SMSI between sputtering reconstructed Cu and flame-made LaTiO 2 support at a mild reduction temperature, exhibiting an ultra-stable performance for more than 500 h at 600 °C. The sintering of Cu nanoparticles is effectively suppressed even at as high as 800 °C. The critical factors to success are reconstructing the electronic structure of Cu atoms in parallel with enhancing the support reducibility, which makes them adjustable by sputtering power or decorated supports. This strategy will extremely broaden the applications of Cu-based catalysts at more severe conditions and shed light on establishing SMSI on other metals.
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Journal of Materials Chemistry A
·
2025
·
IF 9.5
Yinlu Fan,Yuxin Li,Jiu Shi,Yanwei Sun
A hierarchical Cu-gallate-based mesh membrane was synthesized on macroporous copper mesh substrate via mesoporous copper hydroxide transition layer. The resulting hierarchical pore structure and enhanced hydrophilicity enabled exceptional water flux alongside high separation efficiency for oil-water mixtures. These results significantly surpassed the performance limits of current state-of-the-art MOF membranes. Our findings highlight the promise of this hierarchical membrane for the efficient treatment of industrial oily wastewater.
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Results in Chemistry
·
2025
·
IF 4.2
JianGuo Huang,Rashid Khan,Chunhui Zhai,Xianting Ding,Li-Sha Zhang,Jin-Ming Wu,Zhizhen Ye
The development of efficient disinfection techniques that can persistently eradicate viruses or disrupt their transmission is of paramount significance for curbing the spread of pandemics. Existing disinfection techniques commonly suffer from secondary pollution and difficulty in achieving continuous disinfection while ensuring safety and effectiveness, particularly in crowded environments. In this study, we adopted ozone synergistic catalytic oxidation (OSCO) technology for the highly efficient disinfection of bacteria and viruses. The OSCO route is based on the catalytic decomposition of ozone into active radicals in the presence of an optimized rod-like Cu/MnO 2 catalyst. The high catalytic activity of the Cu-doped MnO 2 catalyst can be attributed to the presence of numerous oxygen vacancies, which facilitate the catalytic decomposition of ozone into active radicals. This method serves multiple purposes, including the eradication of bacteria and viruses as well as the prompt decomposition of ozone to prevent any potential leakage. A disinfection rate of 99.9 % for both Staphylococcus albicans and H1N1 viruses was achieved within 20 min. The catalyst also demonstrated exceptional efficiency in degrading residual ozone, achieving a high removal rate of 99.99 % within 25 min, thus assuring safe disinfection. Density functional theory (DFT) calculations further supported that Cu doping induced lattice defects in MnO 2 , promoting the formation of interfacial oxygen vacancies and in turn favoring the catalytic oxidation process. The current OSCO technology offers a highly efficient and secure disinfection method with a wide range of potential applications in various fields.
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Nanomaterials
·
2025
·Vol. 16
·期 1
·
IF 4.3
Ying Xie,Qitong Sun,Yuanyuan Li,Wanwan Li,Zhiwei Hou,Lihui Wei,Sujun Guan
We report a galvanic replacement-driven strategy for the in situ growth of highly uniform one-dimensional (1D) Cu@CuO-X (X = Ag, Bi) nanobelts directly on aluminum foils. Unlike conventional multi-step coating or hard-template replication strategies, the formation of these heterostructured nanobelts is governed by a spontaneous interfacial galvanic replacement process between Cu and the introduced metal species, ensuring in situ growth and intimate interfacial integration. Comprehensive SEM, TEM, XRD, and XPS characterizations confirm the successful formation of Cu@CuO-Ag and Cu@CuO-Bi architectures, where Bi predominantly exists in the oxidized Bi3+state, forming Bi2O3-like surface species. Benefiting from their 1D anisotropic framework and controllable heterointerfaces, this work underscores the distinctiveness and versatility of the self-templated galvanic replacement strategy for the design of multifunctional nanomaterials.
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PubMed
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Materials Chemistry Frontiers
·
2025
·
IF 6.4
Eman-Shaiba Thani,Yi-Ting Yang,Qiu-Yu Du,Rou Yuan,Yong-Qi Zhang,Yu-Tong Yan,Xuan Ai,Yu Chen,Shuni Li
The electrochemical nitrate reduction (NO3RR) offers a promising alternative synthetic route for sustainable ammonia (NH3) production, effectively removing nitrate (NO3−) from wastewater under mild operating conditions. Copper (Cu) nanomaterials are considered to be effective catalysts for NO3RR. This study reports the simple synthesis of a porous Cu nanosheets via a two-step reaction, which are obtained from the electrochemical reduction of CuO nanosheets. The porous Cu nanosheets exhibit a high selectivity and activity for NO3RR, achieving an NH3 yield of 42.5 mg·h-1·mgcat-1 and a Faradaic efficiency of 97% for the conversion from NO3− to NH3 at the potential of −0.7 V (vs. RHE). The prominent electrocatalytic activity can be ascribed to porous architecture, high surface area, and low mass transfer resistance.
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JOURNAL OF ELECTRONIC MATERIALS
·
2016
·Vol. 45
·期 12
·6095-6101
·
IF 1.491
Wang Yan,Han Jing,Ma Limin,Zuo Yong,Guo Fu
The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 10 4 A/cm 2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu 6 Sn 5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.
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JOURNAL OF ALLOYS AND COMPOUNDS
·
2021
·
IF 5.316
M.Z. Chu,C. Zhang,X.H. Liang,C.H. Hu,G.T. Ma,R.Y. Fang,Chengying Tang
The Au-Cu nanoalloys (NPs) were produced by NaBH 4 co-reduction from the mixture precursor solution of component Au and Cu, under the protection of sodium citrate stabilizer . The Au-Cu NPs encapsulated in SiO 2 , Au 5 Cu 5 @SiO 2 NPs, were then synthesized by the Stöber method based on the obtained Au-Cu NPs. The microstructure and particle sizes were characterized by TEM observation. The phase transition temperature of Au-Cu@SiO 2 was determined by DSC measurement. The surface tension, surface segregation and surface energy of Au-Cu NPs as a function of particle size and temperature were calculated by the theoretical model based on the thermodynamic properties of pure component of Au and Cu NPs, respectively. The thermodynamic parameters of Au-Cu system at various nanoscales were optimized on the basis of experimental and theoretical results in this work and previous results in literature. Based on the obtained the thermodynamic data set, the nano phase diagrams of the Au-Cu system at nanoscale were calculated, and the thermodynamic properties of Au-Cu nanometer system were obtained. The results show that the calculated results agree well with experimental work.
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MATERIALS CHARACTERIZATION
·
2026
·
IF 6.2
Ruofan Wang,Yanfu Yan,Xuemeng Zhou,Gangjian Li,Zheng Wu,Shaowu Dai
A novel no-clean flux enabled direct, plating-free soldering of Cu/Al joints using Sn42Bi58 paste. • Organic acid carbon chain length was tailored to regulate flux activity and interfacial reactions. • A synergistic mechanism between organic acids and fluoroborate salts was elucidated. • The medium-chain succinic acid flux achieved optimal joint strength via interfacial solid solution formation. • The study establishes a clear structure-property relationship from molecular design to joint performance. This study addresses the challenge of low-temperature, flux-based direct soldering for copper‑aluminum dissimilar joints, a critical need in advanced thermal management. A series of novel fluxes were synthesized by incorporating dicarboxylic acids with varying carbon chain lengths—malonic, succinic, and adipic acid—into a triethanolamine-fluoroborate matrix, mixed with Sn42Bi58 powder to form corresponding solder pastes (TL-1 to TL-4). Comprehensive characterization, including wettability tests, shear strength measurements, XRD, SEM-EDS, and FIB-TEM analysis, was conducted. Mechanistically, it is revealed that the carbon chain length dictates the critical balance between flux viscosity (steric hindrance) and carboxylate activation capability. The medium-chain succinic acid in TL-3 achieves an optimal “activation-diffusion-reaction” synergy. It acts concertedly with fluoroborates to thoroughly disrupt the stable native oxides (CuO and Al 2 O 3 ) while simultaneously lowering the diffusion energy barrier for Zn 2+ . This specific interfacial modulation entirely suppresses the conventional formation of brittle intermetallic compounds (IMCs) or non-bonded oxide residues. Consequently, TL-3 facilitates the formation of continuous nanoscale Cu 0.95 Zn 0.049 and Al 0.86 Zn 0.14 solid solution layers at the copper and aluminum interfaces, respectively, achieving robust atomic-level metallurgical bonding. Macroscopically, TL-3 exhibits superior performance with a minimum contact angle of 3.2° on Cu, an exceptional shear strength of 125.86 MPa, and an interfacial nanohardness of 0.826 ± 0.068 GPa. The primary scientific contribution of this work lies in elucidating this novel solid-solution-mediated interfacial strengthening mechanism, offering an innovative atomic-scale engineering pathway for the highly reliable, electroplating-free low-temperature soft soldering of Cu/Al heterogeneous structures. Download: Download high-res image (209KB) Download: Download full-size image
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JOURNAL OF CATALYSIS
·
2018
·
IF 6.759
Yanan Liu,Jiaying Zhao,Junting Feng,Yufei He,Yiyun Du,Dianqing Li
Environmental benign non-noble NiCu catalysts with well-distributed homogeneous nanoalloy structure was fabricated from layered double hydroxide for semi-hydrogenation of acetylene. Compared with monometallic Ni catalyst, the introduction of Cu enhanced ethene selectivity and decreased the deactivation rate in long-term reaction. Furthermore, to give a thorough understanding on structure dependent performance, conventional impregnation was also used to obtain bimetallic NiCu catalyst for comparison. Interestingly, imp-NiCu/MMO presented the mixture of monometallic Ni, Cu and bimetallic NiCu. Catalytic results indicated that 100% conversion was achieved at 160 °C with improved selectivity (>70%) over NiCu nanoalloy catalyst, while bimetallic NiCu catalyst with mixed structure showed both poor conversion (50%) and selectivity (65%). Enhanced activity was attributed to small particle size (3.2 nm) and high metal dispersion (31.4%). Improved selectivity and anti-coking ability were related to the alloying of Ni with Cu, which was conducive to isolate Ni atoms from one another confirmed by STEM-EDX and transfer electron from Cu to Ni certified by XPS. Additionally, superior performance was also found in semi-hydrogenations of hexyne, phenylacetylene, 1,2-diphenylethyne and ethyl phenylpropiolate over NiCu nanoalloy.
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