Materials Today Communications
·
2023
·
IF 3.8
Guangyin Liu,Jun Shen,Qin Tang,Hao Li,Chaofan Ma,Yuhui Zhang
Cu nano/microparticle pastes have garnered considerable research interest and investigation for their application in the packaging of power devices. However, their inherent porosity negatively affects joint performance. In this study, we addressed the issue of porosity in Cu-Cu joints by incorporating a liquid metal (LM) into a Cu nano/microparticle paste solder. The LM exhibits wettability and flowability , enabling it to spontaneously fill the pores in the Cu nano/microparticle structure and establish connections with the substrate surface. Moreover, the LM creates additional conductive pathways and reduces thermal resistance, resulting in enhanced electrical and thermal conductivities . The experimental thermal conductivity reached an impressive value of 342.68 W/(m·K), while the observed electrical resistivity was as low as 6.16 μΩ·cm. These findings demonstrate the positive effect of LM on Cu-Cu joints and offer a novel theoretical foundation for improving the electrical and mechanical properties of such joints.
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高影响因子
MATERIALS & DESIGN
·
2026
·
IF 8.2
Huijun Cao,Yiwei Cui,Yuncong Wang,Qinghua Li,Yichen Zhu,Zihao Long,Zhihao Zhang
Realizing Cu-Cu bonding with (111)-oriented nanotwinned Cu pillar bumps (Cu-bumps) is a key route to overcoming the limitations of Moore’s Law and enabling high-density 3D packaging. In this study, we optimized direct current electrodeposition and produced highly (111)-oriented nanotwinned Cu at a stirring speed of 1100 rpm. We then fabricated Cu-bumps and examined their deformation behavior before and after thermal aging under five bonding cycles with progressively increased compressive loading. In the as-electrodeposited state, the bump deformation was governed by a lamella-thickness-dependent transition between Type-II confined-layer slip and Type-III partial glide. Localized stresses at the bump head activated Type-II slip, thinning lamellae without inducing detwinning, whereas delayed activation of Type-III at the base led to detwinning. In comparison, thermal-aging-induced recovery reduced lattice friction and accelerated Type-III glide, leading to pronounced softening. The softened bump showed a marked reduction in compressive strength, potentially increasing the risk of tilting or bridging in fine-pitch interconnects. These results elucidate the mechanical response of (1 1 1)-oriented nanotwinned Cu bumps under repeated Cu-Cu thermocompression bonding and provide critical insights into identifying and mitigating failure risks in advanced 3D packaging.
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SEPARATION AND PURIFICATION TECHNOLOGY
·
2022
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IF 9.136
Fei Yu,Xueting Bai,Mingxing Liang,Jie Ma
Considering the increasingly serious levels of antibiotic pollution, it is necessary to find new and efficient adsorbents. In this study, the adsorptive removal of a model quinolone antibiotic, ciprofloxacin (CIP), from wastewater is presented using a metal–organic framework (MOF)-derived carbon. HKUST-1-derived carbon (HDC-1100) was obtained by high-temperature carbonization of the HKUST-1 precursor at 1100 °C. HDC-1100 has a regular octahedron shape decorated with Cu/Cu 2 O particles and has a microporous and mesoporous structure with abundant oxygen-containing functional groups on the surface. Within 48 h, HDC-1100 could reach adsorption equilibrium for 30 mg·L -1 CIP, and the kinetic data were fitted with a pseudo-first-order model and a pseudo-second-order model. In this study, the maximum adsorption capacity of HDC-1100 for CIP was as high as 592 mg·g −1 . The high adsorption capacity is attributed mainly to metal–organic complexation, electrostatic interactions, and hydrogen bonding. Also, the effects of environmental factors, such as pH, ionic strength, and humic acid, on the adsorption capacity were considered. This study is significant for the treatment of high-concentration antibiotic-polluted wastewater.
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APPLIED SURFACE SCIENCE
·
2021
·
IF 6.707
Yulei Yuan,Houya Wu,Junjie Li,Pengli Zhu,Rong Sun
The development of WBG (wide bandgap) semiconductors has put forward higher requirements for packaging and interconnection technology. Cu sintering is widely considered as an advanced interconnection technology which can be used in high temperature and high power density service. In this paper, a new type of self-reducible Cu nanoparticle paste was proposed to solve the problems of easy oxidation and high sintering temperature of normal Cu nanoparticles. The proposed Cu paste was developed by mixing formic acid treated Cu nanoparticles, reducing solvents and MOD (metal organic decomposition) solutions. Based on the new type of self-reducible Cu nanoparticle paste, Cu-Cu bonding experiments were carried out with different bonding temperature and time, and a reliable Cu-Cu joint with a high shear strength of 52.01 MPa can be achieved at 250 °C under ambient condition, without any assistance of reducing or inert atmosphere. In addition, the MOD assisted self-reduction and sintering mechanism was proposed after shear strength testing, element composition analyzing, cross-sectional morphology and fracture structure observation, which can provide an effective theoretical support for the practical application of Cu-Cu bonding.
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ACS Applied Materials & Interfaces
·
2021
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IF 9.229
Yingying Zhong,Tiantian Wang,Zhiting Lao,Minglei Lu,Shan Liang,Xiping Cui,Qing-lan Li,Suqing Zhao
Herein, a Au-Au/IrO2 nanocomposite with tandem enzyme-mimicking activity was innovatively synthesized, which can show outstanding glucose oxidase (GOx)-like activity and peroxidase-like activity simultaneously under neutral conditions. Moreover, a Au-Au/IrO2@Cu(PABA) reactor was prepared via encapsulation of the Au-Au/IrO2 nanocomposite in a Cu(PABA) metal organic framework. The reactor not only exhibits excellent organic solvent stability, acid resistance, and reusability but also displays better cascade reaction catalytic efficiency (kcat/Km = 148.86 min–1 mM–1) than the natural free enzyme system (GOx/HRP) (kcat/Km = 98.20 min–1 mM–1) and Au-Au/IrO2 nanocomposite (kcat/Km = 135.24 min–1 mM–1). In addition, it is found that the reactor can catalyze glucose or dissolved oxygen to produce active oxygen species (ROS) including HO, 1O2, and O2–· through its enzyme-mimicking activity. Finally, the novel reactor was successfully used in organic dye degradation and antibacterial application. The results show that it can effectively degrade methyl orange, methylene blue, and rhodamine B, which all can reach a degradation rate of nearly 100% after interacting with Au-Au/IrO2@Cu (PABA) for 3.5 h. Furthermore, the reactor also exhibits excellent antibacterial activity, so as to achieve a complete bactericidal effect to Staphylococcus aureus and Escherichia coli at a concentration of 12.5 μg mL–1.
研究领域:
纳米材料
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催化
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环境科学
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材料科学
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生物技术
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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
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2022
·Vol. 33
·期 7
·3576-3585
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IF 2.779
Gao Yue,Xiao Yu-bo,Liu Zhi-Quan,Liu Yang,Sun Rong
Cu-Cu bonding is always conducted at high temperature and high pressure in reductive atmosphere to eliminate the influence caused by oxidation. Herein, a novel low-pressure sinterable Cu nanoparticle (Cu-NPs) paste was developed using Cu Metal Organic Decomposition (MOD) ink as solvent and surface modifier. The Cu MOD ink in paste introduced in Cu nanoparticle paste not only eliminated the surface oxidation of Cu-NPs, but also modified Cu-NPs with Cu atoms due to the thermal decomposition during sintering process. As a result, robust Cu sinter joints for die-attachment could be realized at a low pressure of 0.4 MPa in non-reductive nitrogen atmosphere. Using the paste with 20 wt.% Cuf addition in solvent, a relative high shear strength of 17.1 MPa could be achieved at 300 °C, which is about 3.8 times higher than that sintered without MOD ink (4.5 MPa). When bonding temperature rose to 350 °C, even higher shear strength over 20 MPa was obtained. The bonding strength was comparable to the traditional Pb-5Sn solder alloy, promising its industrial potential.
研究领域:
材料科学
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电子工程
·
纳米技术
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RARE METALS
·
2025
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IF 11
Xia Shi-Yu,Li Xiang-Ji,Guo Ying-Jie,Yuan Jun-Jie,Sun Zhe-Fei,Cao Hui-Jun,Zhang Shu-Ye,Cai Wen-Zhi,Li Jin-Tang,Zhang Zhi-Hao
Cu nanoparticles exhibit excellent properties as high-temperature-resistant, conductive, heat-dissipating, and connecting materials. However, their susceptibility to oxidation poses a major challenge to the production of high-quality sintered bodies in the air, severely limiting their widespread adoption in power electronics packaging. This study presents a novel approach to the synthesis of Cu nanoparticles capped with oleylamine ligands. By employing a simple solvent-cleaning process, effective control of the density of oleylamine ligands on particle surfaces was achieved, resulting in high-performance Cu nanoparticles with both oxidation resistance and air-sintering susceptibility. Moreover, through our research, the solvent-cleaning mechanism was clarified, a model for the oleylamine ligand decomposition was developed, the air-sintering behavior of Cu nanoparticles was analyzed, and the impacts of both the sintered bodies and interfaces on the sintering performance were explained. Additionally, Cu nanoparticles subjected to 5 cleaning rounds followed by sintering at 280 °C and 5 MPa in air were confirmed to be able to produce the highest shear strength (49.2 ± 3.51 MPa) and lowest resistivity (6.15 ± 0.32 μΩ·cm). Based on these results, flexible capacitive pressure sensors with Cu sintered electrodes were fabricated and demonstrated a stable pressure–capacitance response over the temperature range of 25–250 °C. These findings underscore the impressive robustness and durability of sintered structures and the potential for high-temperature applications of oleylamine-capped Cu nanoparticles. Our study provides reliable application demonstrations for the low-cost manufacture of high-performance power electronics packaging structures that can operate in high-current–density, high-heat-flow-density, high-temperature, and high-stress environments. Graphical abstract
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ACS Sustainable Chemistry & Engineering
·
2026
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IF 7.3
Wenjun Zhang,Zijiang Zhao,Yonggang Gang,Xiaosong An,Liboting Gao,Siyi Bao,Xuping Ren,Jun Wang,Jianhua Yan,Hao Zhang
Cu/ZnO/Al2O3 (CZA) catalyst remains the benchmark for methanol synthesis but suffers from active-site sintering and insufficient CO2 activation. In this study, we proposed a dual strategy to enhance and regulate the active sites of CZA: hydrothermal treatment induces Cu–Zn coordination to create high-density Cu–ZnO1–x interfaces that promote CO2 conversion, while subsequent La doping regulates Cu0/Cu+ species to favor methanol selectivity. As a result, the maximum space-time yield (STY) of methanol over the designed CZA&5%La-LRCP (prepared by the ligand-regulated coprecipitation method) catalyst improved significantly from 283.0 gMeOH·kgcat–1·h–1 for the conventional coprecipitation-prepared CZA to 400.4 gMeOH·kgcat–1·h–1 under the tested conditions, surpassing most literature reports on La-doped Cu-based catalysts. Comprehensive characterizations and kinetic studies revealed that high-density Cu–ZnO1–x interfaces enhance CO2 adsorption and activation, while uniformly distributed electron-enriched Cu0/Cu+ species promote H2 dissociation and facilitate formate formation and transformation, together establishing an efficient pathway for CO2 activation and hydrogenation. This study demonstrates a promising strategy for the rational design of CO2hydrogenation catalysts through the synergistic modulation of interfacial structure and electronic properties.
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Journal of Materials Research and Technology-JMR&T
·
2025
·
IF 6.6
Yu Zhang,Tao Liu,Qiang Liu,Xianchong Yu,Zenos Hsueh,Guannan Yang,Guanghan Huang,Chengqiang Cui
With the rapid development of third-generation power semiconductor devices, there is an increasing demand for advanced interconnect materials. Copper nanoparticles have emerged as a promising alternative to their cost-effectiveness, superior durability, and electrical conductivity comparable to silver. However, the practical application of copper is hindered by its susceptibility to oxidation, which prevents low-temperature sintering in ambient air. This study introduces an innovative in situ preparation method for copper paste, where benzimidazole-coated copper particles are synthesized directly through a one-step process. This novel approach simultaneously integrates copper particle synthesis, in-situ benzimidazole coating, and paste formulation, thereby obtain oxidation-resistant and well-dispersed copper paste. The entire process is simple, efficient, environmentally friendly, and achieves a yield of up to 99 %. An encapsulation sintering method is further developed to protect the joint from oxidation during sintering via an epoxy sealing layer. The copper paste was successfully sintered in air at 220 °C, and exhibited remarkable performance, with a shear strength of 60.35 MPa and a low resistivity of 19.25 × 10 −8 Ω m. The method of this study effectively reduces the requirement for protective sintering atmospheres of copper nanoparticles, representing a substantial advancement for the power semiconductor industry.
研究领域:
材料科学
·
电子封装
·
纳米技术
·
半导体技术
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Desalination and Water Treatment
·
2024
·
IF 1
Huali Zhang,Jiaxin Zhang,Hanjun Wu,Yi Pan,Yan Xia,Zhiquan Pan,Dongshen Wang
In this work, heterogeneous catalysts of Cu(II)-ethylenediamine tetramethylene phosphonic acid (Cu(II)-EDTMPA) complex intercalated layered double hydroxides (EDTMPA-Cu-LDH) was synthesized by co-precipitation method for visible-light photocatalytic degradation of Rhodamine B (RhB). The synthesized catalysts were characterized by X-ray diffraction, Fourier-transform infrared spectroscopy, scanning electron microscopy, transmission electron microscopy, UV-Vis diffuse reflectance spectroscopy, and X-ray photoelectron spectroscopy. The results indicated that the EDTMPA-Cu-LDH showed a typical layered structure. After intercalation, layer spacing increased from 7.96 to 12.21 Å. The catalysts showed excellent catalytic activity for the degradation of RhB in visible light. The optimum conditions for RhB degradation were confirmed to be natural initial pH value 5.85, 10 mmol L –1 of RhB concentration, 7 mmol L –1 of H 2 O 2 concentration, and 0.3 g L –1 of catalyst dosage. The maximum degradation efficiency was 98.2% under the optimum conditions and excellent reusability and stability were obtained in the regeneration test. In the end, the reaction mechanism that might exist in the heterogeneous UV-Fenton system was proposed.
研究领域:
环境科学
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催化
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材料科学
·
光催化
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无机化学
·
分析化学
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ACS Applied Materials & Interfaces
·
2023
·
IF 9.5
Xiaoyu Hu,Fengyun Ding,Renjin Xiong,Yongtao An,Xingwen Feng,Jiangfeng Song,Linsen Zhou,Peilong Li,Changlun Chen
Realizing ideal deuterium separation from isotopic mixtures remains a daunting challenge because of their almost identical sizes, shapes, and physicochemical properties. Using the quantum sieving effect in porous materials with suitable pore size and open metal sites (OMSs) enables efficient hydrogen isotope separation. Herein, synthetic HKUST-1-derived microporous mixed-valence Cu(I)Cu(II)-BTC (BTC = benzene-1,3,5-tricarboxylate), featuring a unique network of distinct Cu(I) and Cu(II) coordination sites, can remarkably boost the D2/H2 isotope separation, which has a high selectivity (SD2/H2) of 37.9 at 30 K, in comparison with HKUST-1 and other porous materials. Density functional theory (DFT) calculations indicate that the introduction of Cu(I) macrocycles in the framework decreases the pore size and further leads to relatively enhanced interaction of H2/D2 molecules on Cu(II) sites. The significantly enhanced selectivity of Cu(I)Cu(II)-BTC at 30 K can be mainly attributed to the synergistic effect of kinetic quantum sieving (KQS) and chemical affinity quantum sieving (CAQS). The results reveal that Cu(I) OMSs exhibit counterintuitive behaviors and play a crucial role in tuning quantum sieving without a complex structural design, which provides a deeper insight into quantum sieving mechanisms and a new strategy for the intelligent design of highly efficient isotope systems.
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高影响因子
CHEMOSPHERE
·
2021
·
IF 7.086
Qing Zhao,Xiao Zhang,Dezhi Huang,Long Chen,Shuxin Li,Jean-Marc Chovelon,Lei Zhou,Guangli Xiu
Cu(II) is generally considered to be a poor activator for PMS decomposition, thus the potential impact of trace Cu(II) on PMS induced oxidation of typical pollutants is always overlooked. In this study, we reported that trace Cu(II) could significantly promote PMS induced degradation of four selected sulfonamide antibiotics (SAs), namely, sulfamehoxazole (SMX), sulfathiazole (STZ), sulfamerazine (SMZ), and sulfamonomethoxine (SMM). Different from conventional PMS-induced oxidation process, high-valent Cu(III) was ascertained as the primary reactive intermediate for SAs degradation, which was confirmed by raman tests and electron paramagnetic resonance (EPR). High concentrations of Cu(II) or PMS were beneficial to degradation of the selected contaminants. In PMS/Cu(II) oxidation system, all the selected SAs could undergo several different degradation pathways including continuous oxidation of aniline group, hydroxylation and S–N bond cleavage. In particular, for six-membered SAs, such as SMZ and SMM, a SO 2 extrusion pathway was also detected. The potential mechanism for Cu(III) formation was also proposed, which was believed to be highly related to the nature of the SAs. Hydroxylamine-SAs (N 4 –OH–SAs), generated from direct PMS oxidation of SAs, was deduced as the “promoter” for the whole oxidation process. And the generation of Cu(III) was likely to proceed through the interaction between PMS and Cu(I), which possibly derived from the reduction of Cu(II) by N 4 –OH–SAs. The results obtained in this study validated the contribution of Cu(III) to the elimination of pollutants and expanded our understanding of the oxidation process of PMS in the presence of trace amounts of Cu(II).
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