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Journal of Materials Chemistry C · 2025 · IF 5.1

Research on high thermal conductivity PPENK/PVP modified BN electrospinning hot-pressed multifunctional nanocomposite films

Jingyi Wang,Lishuai Zong,Yuhang Wang,Zichun Ding,Runze Liu,Jinyan Wang,Xigao Jian,Chenghao Wang

With the rapid advancements of communication technology, developing multifunctional thermally conductive materials is crucial to addressing future heat management challenges. In this study, highly thermally conductive PPENK/PVP modified BN (PPENK/MBN) multilayer nanocomposite films inspired by wafer biscuits were constructed through a simple and efficient strategy. Verified by X-ray microscopy (XRM), the designed wafer biscuit-like structure provided abundant internal heat conduction pathways. As a result, the PPENK/MBN nanocomposite films with 39.2 wt% MBN content exhibited in-plane and out-of-plane thermal conductivities of 9.66 W m−1 K−1 and 1.13 W m−1 K−1, respectively, as well as excellent dielectric properties with a dielectric constant of 3.51 and a dielectric loss value as low as 0.010@15 GHz. Furthermore, the composites demonstrated a high thermal decomposition temperature of 511.3 °C. This study lays a foundation for the preparation of high thermal conductivity nanocomposites and provides possible applications in thermal management.

研究领域: 材料科学 · 热管理技术
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International Journal of Minerals Metallurgy and Materials · 2025 ·Vol. 32 ·期 3 ·718-727 · IF 7.2

Preparation of hierarchical MoS2 microsphere/BN composites for microwave absorption and thermal management

Wen Haoliang,Zhang Weidong

The increase in the utilization of infrared heat detection technology in military applications necessitates research on composites with improved thermal transmission performance and microwave absorption capabilities. This study satisfactorily fabricated a series of MoS 2 /BN- xyz composites (which were characterized by the weight ratio of MoS 2 to BN, denoted by xy : z ) through chemical vapor deposition, which resulted in their improved thermal stability and thermal transmission performance. The results show that the remaining mass of MoS 2 /BN-101 was as high as 69.25wt% at 800°C under air atmosphere, and a temperature difference of 31.7°C was maintained between the surface temperature and the heating source at a heating temperature of 200°C. Furthermore, MoS 2 /BN-301 exhibited an impressive minimum reflection loss value of −32.21 dB at 4.0 mm and a wide effective attenuation bandwidth ranging from 9.32 to 18.00 GHz (8.68 GHz). Therefore, these simplified synthesized MoS 2 /BN- xyz composites demonstrate great potential as highly efficient contenders for the enhancement of microwave absorption performance and thermal conductance.

研究领域: 材料科学 · 物理化学
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COMPOSITES COMMUNICATIONS · 2025 · IF 7.7

Si3N4 fiber-reinforced epoxy resin composites with different c-BN content for printed circuit board applications

Qinghe Shi,Kang Jin,Yuxuan Zhang,Hongyan Xia

Fiber-reinforced resin matrix composites are widely used in organic printed circuit boards (PCBs). However, conventional glass fiber reinforced epoxy resin (EP) matrix composites suffer from low thermal conductivity and poor electrical properties. Herein, to coordinate the thermal and electrical properties of the composites, a novel c-BN/EP/Si 3 N 4 composite for PCBs was prepared by hot-pressing moulding method by selecting Si 3 N 4 fibers instead of glass fibers and introducing nano cubic boron nitride (c-BN) particles as filler at the same time. Combined with Si 3 N 4 fibers, nano c-BN filler with suitable content can further improve thermal transfer capacity and limit the volume shrinkage of EP during curing, resulting in the decreased porosity and strong interfacial bonding between Si 3 N 4 fibers and EP. When c-BN content is 20 wt%, the c-BN/EP/Si 3 N 4 composite shows excellent in-plane thermal conductivity (2.124 W m −1  K −1 ), low coefficient of thermal expansion (4.34 ppm K −1 ) and excellent breakdown strength (55.71 kV mm −1 ). Therefore, the c-BN/EP/Si 3 N 4 composites have a potential application in the field of organic PCBs substrates.

CAS / MDL: 931-36-2
研究领域: 材料科学 · 电子工程
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Materials · 2025 ·Vol. 18 ·期 15 ·3573 · IF 3.2

Microstructural, Mechanical, and Thermal Properties of Textured Si3N4/BN Composite Ceramics Prepared Using Two-Step Sintering

Dexiang Gong,Yi Zhou,Yunwei Shi,Qianglong He

Textured Si3N4/BN composite ceramics were successfully fabricated using two-step sintering, combining pseudo-hot isostatic pressing (PHIP) and gas pressure sintering. The grain size of h-BN platelets had a significant influence on densification and mechanical and thermal properties. With an increase in h-BN grain size, the volume density of the composite ceramics gradually decreased, while flexural strength gradually increased. Meanwhile, larger h-BN platelets were more likely to trigger toughening mechanisms like large-angle deflection and greatly increase fracture toughness. Through proper selection of h-BN grain size, textured ceramics, with the addition of h-BN platelets of 1–2 μm, showed high thermal conductivity (∼92 W∙m−1∙K−1) and reliable mechanical properties (∼540 MPa, ∼7.5 MPa∙m1/2, ∼11.1 GPa). Therefore, texture control is an effective means of improving the overall performance of ceramic materials. Novel textured composite ceramics thus have great potential in large-scale fabrication and directional heat dissipation applications.

研究领域: 材料科学 · 陶瓷 · 热管理材料 · 机械工程 · 复合材料
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JOURNAL OF ALLOYS AND COMPOUNDS · 2021 · IF 5.316

Construction of 2D/2D Bi2WO6/BN heterojunction for effective improvement on photocatalytic degradation of tetracycline

Tongqi Yan,Zhao Du,Jingjing Wang,Huayi Cai,Dandan Bi,Zhonglu Guo,Zhenya Liu,Chengchun Tang,Yi Fang

Bi 2 WO 6 /BN heterojunction photocatalyst with high catalytic activity has been successfully constructed by the solvothermal synthesis . It is worth noting that the formation of superoxide radicals (·O 2 - ) and hydroxyl free radicals (·OH) benefit from the formation of heterojunctions, which effectively degrade pollutants. The photocatalytic activities of the optimal sample for tetracycline (TC) and ofloxacin (OFL) degradation efficiency reached almost 99.1% and 94.66% under visible-light irradiation, respectively. It is mainly because the addition of BN not only provided more active sites for the catalyst but also improved the separation efficiency of electron-hole pairs. It can be found that h + and·O 2 - played a major role in the degradation process through the active species quenching experiment. Furthermore, the possible photocatalytic degradation pathways of TC were revealed by analyzing intermediates and a reasonable photocatalytic mechanism was proposed. Moreover, Bi 2 WO 6 /BN heterojunctions were endowed with excellent recycling and stability. Therefore, this research illustrated that two dimensions/two dimensions (2D/2D) Bi 2 WO 6 /BN heterojunction may hold a great prospect for the degradation of antibiotics in wastewater.

CAS / MDL: 10043-35-3 107-21-1
研究领域: 环境科学 · 材料科学 · 光催化技术
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MOLECULES · 2022 ·Vol. 27 ·期 22 ·8066 · IF 4.927

Fluorine-Containing Flow Modifier for BN/PPS Composites Enabled by Low Surface Energy

Bo Cao,Xiaodan Huang,Wenxiang Zhang,Peng Wu

In this study, a fluorine-containing flow modifier (Si-DF) with low surface energy is successfully synthesized, which is applied to fabricate ideal electronic packaging materials (BN/PPS composites) with high thermal conductivity, excellent dielectric properties, processability, and toughness by conventional melt blending. Si-DPF is located at the interface between the BN fillers and the PPS matrix, which not only improves the dispersion of BN fillers but also strengthens the interaction. With the help of 5 wt% Si-DF,BN/PPS/Si-DF (70/25/5)still exhibits the high thermally conductive coefficient (3.985 W/m·K) and low dielectric constant (3.76 at 100 MHz) although BN fillers are loaded as high as 70 wt%. Moreover, the sample processes a lower stable torque value (2.5 N·m), and the area under the stress–strain curves is also increased. This work provides an efficient way to develop high-performance polymer-based composites with high thermally conductive coefficients and low dielectric constants for electronic packaging applications.Keywords:BN/PPS composites;fluorine-containing flow modifier;dispersion;thermal conductivity;dielectric property

CAS / MDL: 35948-25-5 454-89-7
研究领域: 材料科学 · 电子工程
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CERAMICS INTERNATIONAL · 2023 · IF 5.2

Design and preparation of low-filled magnetic oriented BN@Fe3O4/EP insulating composite with improved thermal conductivity and thermal stability

Zeyu You,Ling Weng,Lizhu Guan,Xiaorui Zhang,Zijian Wu

As an excellent two-dimensional insulating material with high thermal conductivity , high temperature stability and high hardness, hexagonal boron nitride(h-BN) is widely applied in semiconductor manufacturing, aerospace, metallurgical manufacturing and other cutting-edge fields. However, the unique surface structure of h-BN leads to poor lubricity and easy agglomeration, which limits the application of h-BN especially in the field of electronic packaging. To address key issues boosted above, this study designed and prepared the BN@Fe 3 O 4 magnetic insulating particles and doped it into the reduced viscosity epoxy resin to prepare the composites. By selecting appropriate external magnetic field strength and BN@Fe 3 O 4 particles’ content, a novel 3D structure of fillers like dominoes in epoxy resin composite was successfully constructed. The microstructure of the BN@Fe 3 O 4 particles and composites were analyzed, the thermal conductivity, the mechanical and the electrical properties of composites were simultaneously tested. Results manifested that the core-shell structures with BN as core and Fe 3 O 4 as shell was successfully prepared, linking through the PDA middle layer between the BN core and Fe 3 O 4 shell. Under the influence of magnetic orientation, the BN@Fe 3 O 4 magnetic particles were preferred an out-of-plane oriented in the epoxy resin composites, resulted an enormously enhanced on thermal conductivity of composites. At a magnetic field strength of 60 mT and 25 vol% BN@Fe 3 O 4 content, the thermal conductivity of BN@Fe 3 O 4 /EP composites is as lofty as 1.832 W/(m K), which is 1023.46% higher than that of pure epoxy resin. Meanwhile, the thermal stability has also been slightly improved, the elastic modulus and insulation performances remain at the same level.

CAS / MDL: 62-31-7
研究领域: 材料科学 · 热工程 · 复合材料
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Materials · 2023 ·Vol. 16 ·期 14 ·4979 · IF 3.4

The Synergistic Lubrication Effects of h-BN and g-C3N4 Nanoparticles as Oil-Based Additives for Steel/Steel Contact

Wen Zhong,Jiazhi Dong,Siqiang Chen,Zhe Tong

The synergistic effect of different types of solid particles in liquid lubricants is of great interest. In this work, g-C3N4nanosheets were initially prepared using a calcination method and then as-prepared, and h-BN were used as lubricating additives to the white oil. A comparison between the mixed additives and the single g-C3N4or h-BN additives revealed that the base oil with the addition of g-C3N4and h-BN showed the best lubricating properties. The results show a 12.3% reduction in friction coefficient, resulting in a 68.6% reduction in wear rate compared to the white oil when filled with 0.5 wt% g-C3N4and h-BN (1:1 by weight). Moreover, the addition of g-C3N4and h-BN improves the high-temperature lubrication properties of the white oil. However, the friction coefficient and wear rate increase with increasing oil temperature. The large contact area between g-C3N4and its sliding counterpart and the strong adhesive force between h-BN and its sliding counterpart improve the film formation efficiency, leading to enhanced tribological properties under oil lubrication conditions.

CAS / MDL: 10043-11-5
研究领域: 材料科学 · 机械工程 · 表面工程
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JOURNAL OF THE AMERICAN CERAMIC SOCIETY · 2014 ·Vol. 98 ·期 3 ·879-887 · IF 2.428

Microstructure, Thermal Conductivity, and Electrical Properties of In Situ Pressureless Densified SiC–BN Composites

Yinsheng Li,Jie Yin,Haibo Wu,Jingxian Zhang,Jian Chen,Yongjie Yan,Xuejian Liu,Zhengren Huang,Dongliang Jiang

The microstructure, thermal conductivity, and electrical properties of pressureless densified SiC–BN composites prepared from in situ reaction of Si 3 N 4 , B 4 C, and C were systematically investigated, to achieve outstanding performance as substrate materials in electronic devices. The increasing BN content (0.25–8 wt%) in the composites resulted in finer microstructure, higher electrical resistivity, and lower dielectric constant and loss, at the expense of only slight degradation of thermal conductivity. The subsequently annealed composites showed more homogeneous microstructures with less crystal defects, further enhanced thermal conductivities and electrical resistivities, and reduced dielectric constants and losses, compared with the unannealed ones. The enhanced insulating performance, the weakened interface polarization, and the reduced current conduction loss were explained by the gradual equalization of dissolved B and N contents in SiC crystals and the consequent impurity compensation effect. The schottky contact between graphite and p -type SiC grains presumably played a critical role in the formation of grain-boundary barriers. The annealed composites doped with 8 wt% BN exhibited considerably high electrical resistivity (4.11 × 10 11 Ω·cm) at 100 V/cm, low dielectric constant (16.50), and dielectric loss (0.127) at 1 MHz, good thermal conductivity [66.06 W·(m·K) −1 ] and relatively high strength (343 MPa) at room temperature.

CAS / MDL: 10043-11-5
研究领域: 材料科学 · 电子工程
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CERAMICS INTERNATIONAL · 2020 · IF 3.83

Addition of h-BN for enhanced machinability and high mechanical strength of AlN/Mo composites

Yunzi Li,Fei Chen,Xiaoyu Li,Qiang Shen,Lianmeng Zhang

Ceramic/metal composites, as high-temperature structural materials, have limited applications because of their poor machinability . AlN/Mo/Mo 2 B machinable composites were fabricated by adding h-BN to AlN/Mo composites by plasma-activated sintering at various temperatures and at an axial pressure of 30 MPa under argon atmosphere. The sample sintered at 1500 °C exhibited excellent machinability for cemented carbide tools, with a bending strength of approximately 500 MPa and a Vickers hardness value of 9.34 GPa. The effects of sintering temperature on the microstructure, mechanical properties, and machinability were investigated, and the reactions introduced by adding h-BN were studied. These reactions reinforced the composite and newly introduced a Mo 2 B phase, which showed better ability to deflect cracks and prevent them from moving deep inside the composite, thus improving its machinability. This research provides a possible solution for improving the machinability of ceramic/metal composites without sacrificing the strength .

研究领域: 材料科学 · 机械工程
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CERAMICS INTERNATIONAL · 2023 · IF 5.2

Cactus-like double-oriented magnetic SiC and BN networks leading to simultaneously enhanced dielectric strength and thermal conductivity of epoxy composites

Wenxia Sima,Wenlong Pang,Potao Sun,Tao Yuan,Ming Yang,Zhaoping Li,Hefei Wang

Epoxy-based composites with high insulation and thermal conductivity are desirable materials for electronic and electrical applications. However, resolving the tradeoff between insulation and thermal conductivity remains challenging. Based on the functional requirement, we designed and fabricated a cactus-like double-oriented epoxy composite by combining magnetic orientation and ice-templated methods. Semiconducting SiC endowed the composite with field-grading characteristics, thus relieving local electric field stress along the horizontal direction, while BN with high thermal conductivity promoted heat dissipation along the vertical direction. The composite exhibited its highest performance with 15 vol% filler, improving the breakdown voltage and thermal conductivity by 43.7% and 1312% compared with pure epoxy, respectively, outperforming recently developed packaging materials. It is believed that this work offers an efficient strategy for the fabrication of the filler structure and provides insights on the simultaneous enhancement in insulation and thermal conductivity of polymer composites .

研究领域: 材料科学 · 电子工程
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COMPOSITES SCIENCE AND TECHNOLOGY · 2024 · IF 8.3

Enhanced thermal conductivity of CS/BN/Ti3O5 coatings to promote electron transport for ultra-sensitive fire sensing

Sijia Sun,Shuai Zhang,Mingzhu Pan

Intelligent fire warning system is a crucial protective equipment reduce fire hazards . A recent increasing concern is the development of sensitive fire warning materials that can be integrated with combustible materials to provide real-time alarms in the fire. However, current research on improving the sensitivity of fire warning sensors based on temperature-resistance response focuses on constructing continuous conductive networks. The effect of the heat transfer process is ignored, which limits the further improvement of alarm sensitivity. Here, we developed a strategy to improve thermal conductivity . Based on the chitosan (CS) conductive network in Ti 3 O 5 -based fire sensing system, aminated 2D h-BN nanosheets with high temperature resistance and ultrahigh in-plane thermal conductivity were further introduced. The h-BN improves the thermal conductivity of the fire warning coating from 1.43 W/m·K to 2.29 W/m·K. Intelligent fire warning sensors with ultra-sensitivity (1.16 s), low response temperature (170 °C), duration time (12 min) and durability (100 cycles) were successfully prepared by improving thermal conductivity to rapidly transfer heat to Ti 3 O 5 , which leads to a rapid decrease in resistance as the core mechanism. This work proposed an ingenious strategy for the construction of high fire safety and thermal conduction fireproof coatings, which revealed enticing prospects in the field of intelligent coatings.

CAS / MDL: 10043-11-5 9012-76-4
研究领域: 材料科学 · 传感技术
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