Green Energy & Environment
·
2020
·
IF 6.395
Hongmin Zhang,Qingzhu Jia,Fangyou Yan,Qiang Wang
In this study, a series of CuMgAl layered double oxides (CuMgAl-LDOs) were obtained via calcination of CuMgAl layered double hydroxides (CuMgAl-LDHs) synthesised via a co-precipitation method. The results show that CuMgAl-LDO can be prepared using an optimal Cu : Mg : Al molar ratio of 3 : 3 : 2, NaOH : Na 2 CO 3 molar ratio of 2 : 1, and calcination temperature of 600 °C. CuMgAl-LDO is a characteristic of mesoporous material with a lamellar structure and large specific surface area. The removal efficiency of sulfameter (SMD) based on CuMgAl-LDO/persulfate (PS) can reach > 98% over a wide range of initial SMD concentrations (5–20 mg L −1 ). The best removal efficiency of 99.49% was achieved within 120 min using 10 mg L −1 SMD, 0.3 g L −1 CuMgAl-LDO, and 0.7 mmol L −1 PS. Kinetic analysis showed that the degradation of SMD was in accordance with a quasi-first-order kinetic model. The stability of the CuMgAl-LDO catalyst was verified by the high SMD removal efficiency (> 97% within 120 min) observed after five recycling tests and low copper ion leaching concentration (0.89 mg L −1 ), which is below drinking water quality standard of 1.3 mg L −1 permittable in the U.S. Radical scavenging experiments suggest that SO 4 · − is the primary active species participating in the CuMgAl-LDO/PS system. Moreover, our mechanistic investigations based on the radical scavenging tests and X-ray photoelectron spectroscopy (XPS) results indicate that Cu (II) –Cu (III) –Cu (II) circulation is responsible for activating PS in the degradation of SMD and the degradation pathway for SMD was deduced. Accordingly, the results presented in this work demonstrate that CuMgAl-LDO may be an efficient and stable catalyst for the activation of PS during the degradation of organic pollutants.
研究领域:
环境科学
·
催化
·
水处理
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DOI
高影响因子
SEPARATION AND PURIFICATION TECHNOLOGY
·
2022
·
IF 9.136
Haoran Song,Shiting Pan,Yuwei Wang,Yang Cai,Wei Zhang,Yongming Shen,Changping Li
There exists an obvious contradiction between Cu(III) generation and Cu(I) contribution in reductants enhanced Cu(II)/peroxymonosulfate (PMS) process because the involved electron transfer pathways were always ignored in previous studies. This study investigated the MXene-mediated electron transfer mechanism in Cu(II)/PMS for the first time. The introduction of MXene significantly promoted atrazine degradation under acidic condition because the in-situ generation of Cu(I) was an excellent activator for PMS. Under alkaline condition, although addition of MXene generated a large amount of Cu(I), the degradation of atrazine was inhibited due to that the conversion of Cu(I) to Cu(III) was interrupted. The strong metal-support interaction (SMSI) altered the reactive intermediate species from Cu(III) (two-electron transfer) to hydroxyl radical (HO • ) and sulfate radical (SO 4 •- ) (one-electron transfer) under alkaline condition. This work proposed a novel MXene-mediated electron transfer mechanism and improved the understanding of Cu(III)/Cu(I) transformation pathway.
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DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2025
·Vol. 36
·期 9
·1-13
·
IF 2.8
Huang Jiaqiang,Ning Zhiling,Yu Caiping,Liu Dongjing,Liu Yujie,Xiao Dawei
The sintering technology of Cu nanoparticle paste has significant potential for application in wide bandgap semiconductor devices. In this study, a high-performance and multi-scale Cu nanoparticle paste is proposed to solve the critical issues of easy oxidation during preparation and storage, as well as high sintering temperature. The multi-scale Cu nanoparticles with sizes ranging from 20 to 140 nm were synthesized simply and efficiently using a liquid-phase reduction method. These nanoparticles were subsequently mixed with a reducing composite solvent to develop a Cu nanoparticle paste. Based on this paste, pressure-assisted Cu–Cu bonding experiments were conducted at various temperatures and durations. The Cu–Cu joints achieve an average shear strength of 33.3 MPa after sintering at 240 °C in a nitrogen atmosphere and even exceed 60 MPa when the temperature is raised to 280 ℃. Additionally, with a reductive surface coating, the multi-scale Cu nanoparticles can be stored for over 20 days under ambient air condition. Besides, the enhanced bonding strength and dense microstructure are attributed to the close-packing effect of multi-scale nanoparticles and the facilitation of small size nanoparticles. The proposed multi-scale Cu nanoparticle paste exhibits excellent oxidation resistance and low-temperature sintering performance, which demonstrates significant potential for application in power device packaging and interconnection.
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DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2024
·Vol. 35
·期 22
·1-11
·
IF 2.8
Liu Sushi,Yang Le,Xin Jianbo,Lv Xiaochun,Chen Yi,Liu Yang
Cu particles sintering is considered one of the most suitable connection technologies for power devices, but Cu has poor oxidation resistance and Cu oxides hinder the sintering process. In this paper, formic acid vapor is used for baking Cu paste to achieve high strength Cu–Cu joints at low temperature. The Cu–Cu joint of 33.9 MPa is obtained easily at 200 °C through baking by formic acid vapor at 130 °C for 15 min. Formic acid vapor effectively reduces the Cu oxides on the surface of the Cu particles, improving the sintering performance of the Cu paste. The effects of baking atmosphere, temperature and time on the shear strength on Cu–Cu joints are analyzed. Additionally, the mechanism of formic acid vapor in reducing the sintering temperature of Cu paste is investigated by the analysis of phase composition and thermal behavior. This work further expands the application of Cu paste in the packaging of high-power semiconductor devices.
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DOI
高影响因子
Materials Today Communications
·
2023
·
IF 3.8
Guangyin Liu,Jun Shen,Qin Tang,Hao Li,Chaofan Ma,Yuhui Zhang
Cu nano/microparticle pastes have garnered considerable research interest and investigation for their application in the packaging of power devices. However, their inherent porosity negatively affects joint performance. In this study, we addressed the issue of porosity in Cu-Cu joints by incorporating a liquid metal (LM) into a Cu nano/microparticle paste solder. The LM exhibits wettability and flowability , enabling it to spontaneously fill the pores in the Cu nano/microparticle structure and establish connections with the substrate surface. Moreover, the LM creates additional conductive pathways and reduces thermal resistance, resulting in enhanced electrical and thermal conductivities . The experimental thermal conductivity reached an impressive value of 342.68 W/(m·K), while the observed electrical resistivity was as low as 6.16 μΩ·cm. These findings demonstrate the positive effect of LM on Cu-Cu joints and offer a novel theoretical foundation for improving the electrical and mechanical properties of such joints.
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高影响因子
ENVIRONMENTAL SCIENCE & TECHNOLOGY
·
2023
·
IF 11.4
Xiangrui Wang,Wen-Xiong Wang
Cu-based nanoparticles (NPs) have been increasingly fabricated, and different Cu species (i.e., Cu+ and Cu2+) of these NPs are tuned to achieve differential physicochemical properties. Although ion release is one of the major toxic mechanisms of Cu-based NPs, differences in cytotoxicity between released Cu(I) and Cu(II) ions are largely unknown. In this study, the A549 cells exhibited a lower tolerance to Cu(I) compared with Cu(II) accumulation. Bioimaging of labile Cu(I) indicated that the change of the Cu(I) level upon CuO and Cu2O exposure displayed different trends. We then developed a novel method to selectively release Cu(I) and Cu(II) ions within the cells by designing CuxS shells for Cu2O and CuO NPs, respectively. This method confirmed that Cu(I) and Cu(II) exhibited different cytotoxicity mechanisms. Specifically, excess Cu(I) induced cell death through mitochondrial fragmentation, which further led to apoptosis, whereas Cu(II) resulted in cell cycle arrest at the S phase and induced reactive oxygen species generation. Cu(II) also led to mitochondrial fusion, which was likely due to the influence of the cell cycle. Our study first uncovered the difference between the cytotoxicity mechanisms of Cu(I) and Cu(II), which could be greatly beneficial for the green fabrication of engineered Cu-based NPs.
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DOI
PubMed
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2023
·Vol. 34
·期 23
·1-10
·
IF 2.8
Yuan Yulei,Zhang Minghui,Li Junjie,Liu Zhi-Quan
The application of wide bandgap semiconductor devices requires high-performance interconnect materials which have high thermal conductivity and high-temperature resistance. Among which, Cu nanoparticle paste sintering technology is regarded as an advanced alternative. However, Cu nanoparticles are easy to be oxidized, which needs an inert or vacuum atmosphere during the sintering process that restrict the practical application of Cu sintering technology. In this paper, a new type of Cu nanoparticle paste with antioxidation property was prepared by mixed commercial Cu nanoparticles (average diameter: 100 nm) treated by formic acid and reducing solvents containing 1-dodecanethiol. Based on the Cu nanoparticle paste, the pressure-assisted bonding at different bonding temperatures and times was carried out without using any protective atmosphere. A remarkable high shear strength of 55.06 MPa for Cu–Cu joints formed by sintering of Cu nanoparticle paste was achieved when sintered at 250 °C. The results of bonding experiment suggest that the proposed Cu nanoparticle paste has excellent antioxidation property and shows great application potential in high power electronic packaging.
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DOI
高影响因子
ACS Applied Materials & Interfaces
·
2021
·
IF 9.229
Yingying Zhong,Tiantian Wang,Zhiting Lao,Minglei Lu,Shan Liang,Xiping Cui,Qing-lan Li,Suqing Zhao
Herein, a Au-Au/IrO2 nanocomposite with tandem enzyme-mimicking activity was innovatively synthesized, which can show outstanding glucose oxidase (GOx)-like activity and peroxidase-like activity simultaneously under neutral conditions. Moreover, a Au-Au/IrO2@Cu(PABA) reactor was prepared via encapsulation of the Au-Au/IrO2 nanocomposite in a Cu(PABA) metal organic framework. The reactor not only exhibits excellent organic solvent stability, acid resistance, and reusability but also displays better cascade reaction catalytic efficiency (kcat/Km = 148.86 min–1 mM–1) than the natural free enzyme system (GOx/HRP) (kcat/Km = 98.20 min–1 mM–1) and Au-Au/IrO2 nanocomposite (kcat/Km = 135.24 min–1 mM–1). In addition, it is found that the reactor can catalyze glucose or dissolved oxygen to produce active oxygen species (ROS) including HO, 1O2, and O2–· through its enzyme-mimicking activity. Finally, the novel reactor was successfully used in organic dye degradation and antibacterial application. The results show that it can effectively degrade methyl orange, methylene blue, and rhodamine B, which all can reach a degradation rate of nearly 100% after interacting with Au-Au/IrO2@Cu (PABA) for 3.5 h. Furthermore, the reactor also exhibits excellent antibacterial activity, so as to achieve a complete bactericidal effect to Staphylococcus aureus and Escherichia coli at a concentration of 12.5 μg mL–1.
研究领域:
纳米材料
·
催化
·
环境科学
·
材料科学
·
生物技术
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DOI
PubMed
高影响因子
MATERIALS & DESIGN
·
2026
·
IF 8.2
Huijun Cao,Yiwei Cui,Yuncong Wang,Qinghua Li,Yichen Zhu,Zihao Long,Zhihao Zhang
Realizing Cu-Cu bonding with (111)-oriented nanotwinned Cu pillar bumps (Cu-bumps) is a key route to overcoming the limitations of Moore’s Law and enabling high-density 3D packaging. In this study, we optimized direct current electrodeposition and produced highly (111)-oriented nanotwinned Cu at a stirring speed of 1100 rpm. We then fabricated Cu-bumps and examined their deformation behavior before and after thermal aging under five bonding cycles with progressively increased compressive loading. In the as-electrodeposited state, the bump deformation was governed by a lamella-thickness-dependent transition between Type-II confined-layer slip and Type-III partial glide. Localized stresses at the bump head activated Type-II slip, thinning lamellae without inducing detwinning, whereas delayed activation of Type-III at the base led to detwinning. In comparison, thermal-aging-induced recovery reduced lattice friction and accelerated Type-III glide, leading to pronounced softening. The softened bump showed a marked reduction in compressive strength, potentially increasing the risk of tilting or bridging in fine-pitch interconnects. These results elucidate the mechanical response of (1 1 1)-oriented nanotwinned Cu bumps under repeated Cu-Cu thermocompression bonding and provide critical insights into identifying and mitigating failure risks in advanced 3D packaging.
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DOI
高影响因子
SEPARATION AND PURIFICATION TECHNOLOGY
·
2022
·
IF 9.136
Fei Yu,Xueting Bai,Mingxing Liang,Jie Ma
Considering the increasingly serious levels of antibiotic pollution, it is necessary to find new and efficient adsorbents. In this study, the adsorptive removal of a model quinolone antibiotic, ciprofloxacin (CIP), from wastewater is presented using a metal–organic framework (MOF)-derived carbon. HKUST-1-derived carbon (HDC-1100) was obtained by high-temperature carbonization of the HKUST-1 precursor at 1100 °C. HDC-1100 has a regular octahedron shape decorated with Cu/Cu 2 O particles and has a microporous and mesoporous structure with abundant oxygen-containing functional groups on the surface. Within 48 h, HDC-1100 could reach adsorption equilibrium for 30 mg·L -1 CIP, and the kinetic data were fitted with a pseudo-first-order model and a pseudo-second-order model. In this study, the maximum adsorption capacity of HDC-1100 for CIP was as high as 592 mg·g −1 . The high adsorption capacity is attributed mainly to metal–organic complexation, electrostatic interactions, and hydrogen bonding. Also, the effects of environmental factors, such as pH, ionic strength, and humic acid, on the adsorption capacity were considered. This study is significant for the treatment of high-concentration antibiotic-polluted wastewater.
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DOI
高影响因子
APPLIED SURFACE SCIENCE
·
2021
·
IF 6.707
Yulei Yuan,Houya Wu,Junjie Li,Pengli Zhu,Rong Sun
The development of WBG (wide bandgap) semiconductors has put forward higher requirements for packaging and interconnection technology. Cu sintering is widely considered as an advanced interconnection technology which can be used in high temperature and high power density service. In this paper, a new type of self-reducible Cu nanoparticle paste was proposed to solve the problems of easy oxidation and high sintering temperature of normal Cu nanoparticles. The proposed Cu paste was developed by mixing formic acid treated Cu nanoparticles, reducing solvents and MOD (metal organic decomposition) solutions. Based on the new type of self-reducible Cu nanoparticle paste, Cu-Cu bonding experiments were carried out with different bonding temperature and time, and a reliable Cu-Cu joint with a high shear strength of 52.01 MPa can be achieved at 250 °C under ambient condition, without any assistance of reducing or inert atmosphere. In addition, the MOD assisted self-reduction and sintering mechanism was proposed after shear strength testing, element composition analyzing, cross-sectional morphology and fracture structure observation, which can provide an effective theoretical support for the practical application of Cu-Cu bonding.
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DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2022
·Vol. 33
·期 7
·3576-3585
·
IF 2.779
Gao Yue,Xiao Yu-bo,Liu Zhi-Quan,Liu Yang,Sun Rong
Cu-Cu bonding is always conducted at high temperature and high pressure in reductive atmosphere to eliminate the influence caused by oxidation. Herein, a novel low-pressure sinterable Cu nanoparticle (Cu-NPs) paste was developed using Cu Metal Organic Decomposition (MOD) ink as solvent and surface modifier. The Cu MOD ink in paste introduced in Cu nanoparticle paste not only eliminated the surface oxidation of Cu-NPs, but also modified Cu-NPs with Cu atoms due to the thermal decomposition during sintering process. As a result, robust Cu sinter joints for die-attachment could be realized at a low pressure of 0.4 MPa in non-reductive nitrogen atmosphere. Using the paste with 20 wt.% Cuf addition in solvent, a relative high shear strength of 17.1 MPa could be achieved at 300 °C, which is about 3.8 times higher than that sintered without MOD ink (4.5 MPa). When bonding temperature rose to 350 °C, even higher shear strength over 20 MPa was obtained. The bonding strength was comparable to the traditional Pb-5Sn solder alloy, promising its industrial potential.
研究领域:
材料科学
·
电子工程
·
纳米技术
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DOI
高影响因子
危险品化学品经营许可证（带存储）