COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
·
2026
·
IF 5.4
Yun Tan,Yijun Liu,Kerui Huang,Qinglong Yu,Wanlin Han,Baoshu Chen,Longfei Yi
Fiber-assisted fabrication of Polyimide/MXene composite aerogel with lightness. • Excellent thermal insulation that enables infrared camouflage and fire protection. • Outstanding mechanical resilience and superior EMI SE (68.5 dB). • Reliable pressure sensing capability to accurately detecting human motion. Fabricating polymer aerogels that merge high electrical conductivity, mechanical elasticity, and enduring stability is a critical yet demanding objective. In this work, lightweight polyimide (PI)/MXene composite aerogels were synthesized through a straightforward, sustainable method utilizing PI fiber-assisted freeze-drying and subsequent thermal imidization. The resulting aerogels possess a unique segregated architecture, providing exceptional electrical conductivity alongside superior electromagnetic interference (EMI) shielding (reaching 68.5 dB). Owing to their mechanical resilience and high conductivity, these aerogels function as dependable piezoresistive sensors for detecting human activity and physical signals, which can accurately detect pressures as low as 0.04 kPa (at 0.5% strain). Furthermore, their porous nature and minimal thermal conductivity ensure efficient heat insulation, making them promising for thermal regulation and fire safety applications. Overall, this study presents a scalable fabrication strategy and promotes the advancement of multifunctional aerogels for next-generation flexible electronic devices. Download: Download high-res image (194KB) Download: Download full-size image Fiber-assisted fabrication of Polyimide/MXene aerogels that has integrated EMI shielding with thermal insulation for wearable piezoresistive sensing
✓ 已验证
产品关联
DOI
高影响因子
ADVANCED FUNCTIONAL MATERIALS
·
2026
·
IF 19.9
Yulin Li,Fen Zhao,Jianqiao Zhao,Heng Xu,Zhaoshi Yu,Yao Wang,Yi Shen,Jiangnan Dai,Guoli Tu
Surface metallization of polyimide (PI) films is essential for constructing conductive electrodes and interconnects in flexible electronics, directly determining device integration and reliability. However, the high inertness and low surface energy of PI necessitate complex pretreatment in conventional vacuum deposition, incurring high costs and substrate damage, while wet etching faces environmental burdens and poor compatibility, both failing to meet large-scale manufacturing demands. Inspired by the stable coordination of histidine in Nereis jaws, a coordination-directed molecular design strategy is proposed. By introducing nitrogen-containing heterocyclic units into PI molecular chains, intrinsic metal anchoring sites are constructed, enabling direct film metallization without destructive adhesion-promoting surface pretreatments. This process integrates with photolithography, printing, and direct writing for cross-scale controllable metallization, fabricating planar wiring and vertical interconnect access (VIA) structures for 3D high-density integration. The metallized PI films with azaindole-bearing diamine moieties achieve the highest 5B-grade adhesion and exhibit excellent environmental stability, tolerating repeated bending, high-temperature exposure, and ultrasonic impact. Commercial PI surface metallization can be achieved with minimal functional monomers and is directly compatible with electronic soldering and device integration. This strategy overcomes the trade-off between interfacial adhesion and substrate integrity, providing a viable pathway for scalable flexible electronics manufacturing.
✓ 已验证
产品关联
DOI
高影响因子
POLYMER
·
2025
·
IF 4.5
Chunying Min,Yaxiang Su,Hongyu Liang,Xuezhong Zhang
Conventional polyimides (PI) suffer significant mass loss and performance degradation under prolonged high temperature exposure, limiting their utility in extreme thermal environments. This study employs a molecular-level design strategy to synthesize carborane-containing polyimide copolymer (BMCB/PI) via copolymerization of 1,7-bis(aminophenyl)- meta -carborane (BMCB) with 4,4′-oxydiphthalic anhydride (ODPA) and the flexible diamine 1,4-bis(4-aminophenoxy)benzene (TPE-Q). The 30BMCB/PI film demonstrates remarkable improvements in thermomechanical properties ( T d5 % = 552.6 °C, Young's modulus = 2.17 GPa) compared to pure PI (494.6 °C, 1.63 GPa). Moreover, its unique high-temperature resistance mechanism enables an ultrahigh char yield ( R w ) of 65.9 % at 800 °C in air, indicating exceptional thermal stability. Notably, the 30BMCB/PI film also exhibited particularly excellent tribological properties, with a 54 % reduction in specific wear rate under dry sliding conditions compared to pure PI. It can maintain excellent tribological properties even in high-temperature (100–400 °C) environments. This study achieves synergistic enhancement of thermal stability, mechanical properties, and tribological performance in polyimide materials through covalent incorporation of carborane structural units into the polyimide backbone, providing novel insights for designing high-performance polymers for high-temperature tribological applications.
✓ 已验证
产品关联
DOI
高影响因子
POLYMER BULLETIN
·
2020
·Vol. 78
·期 8
·4183-4204
·
IF 2.014
Yu Hailin,Xia Yifan,Zhang Hanwen,Wang Yinghan
A novel series of sulfonated polyimide (SPI)/polyvinyl alcohol (PVA) composite membranes applied in vanadium redox flow battery (VRFB) is prepared and characterized in this work. With the hydrophilicity and good barrier of PVA, the composite membranes exhibit better hydrolysis stability and vanadium ion resistance than normal SPIs with five-membered rings. In VRFB single-cell tests, because of the highest proton selectivity, the SPI5/PVA5 composite membrane shows lower self-discharge rate, higher coulombic efficiency, and energy efficiency (EE) (79.5% vs 77.8% at 30 mA cm −2 ) than that of Nafion117. Besides, the composite membranes present stable performances up to 100 cycles without significant decline in EE.
研究领域:
材料科学
·
电化学
·
能源存储
·
高分子化学
·
膜科学与技术
✓ 已验证
DOI
高影响因子
JOURNAL OF POWER SOURCES
·
2022
·
IF 9.794
Yuhong Ma,Yu Jiao,Yichao Yan,Wei Chen,Yaoyao Li,Mingjie Zhou,Dongjiang Chen,Jun Zhu
Solid polymer electrolytes drastically enhance the operational safety of Li metal battery by eliminating the flammable liquid electrolyte, but still suffer from low ionic conductivity and inferior thermostability. Herein, we tack this issue by strengthening the polyvinylidene fluoride matrix with lithiophilic polyimide . The actively conjugated carbonyl groups in polyimide polymer backbone with Li + -conductivity feature accelerate the ion conduction, accordingly improving the ionic conductivity up to 4.1 × 10 −4 S cm −1 . With the polyimide solid electrolyte , lithium symmetrical battery shows a stable operation without obvious dendrite growth over 300 h at 0.17 mA cm −2 , effectively uniformizing the Li + deposition at the electrolyte/anode interface. The LiFePO 4 cell based on the polyimide electrolyte delivers a high discharge capacity of 126 mAh g −1 at 25 °C with a capacity retention of 86% after 500 cycles at 0.15 mA cm −2 . In addition, polyimide chain with high thermostability owns affinity to polyvinylidene fluoride with an adsorption energy of 0.1 eV, giving rise to 35% enhancement in mechanical strength and 68% reduction in thermal shrinkage at 300 °C as compared with pure polyvinylidene fluoride electrolyte. This design allows a promising route for enhancing the safety operation of polymer electrolyte and promoting ionic transfer by reconstructing the polymer architecture .
研究领域:
材料科学
·
电化学
·
能源存储
·
高分子化学
·
电池技术
✓ 已验证
DOI
高影响因子
RSC Advances
·
2015
·Vol. 5
·期 25
·19315-19320
·
IF 3.84
Jianwen Xia,Guoping Zhang,Libo Deng,Haipeng Yang,Rong Sun,Ching-Ping Wong
A novel core–shell structure of Al2O3 nanoparticles (NPs) attached on poly(amic acid) (PAA) fiber has been successfully developed by facile coaxial electrospinning technology for the first time. The as-prepared PAA fiber went through imidization to prepare the Al2O3@polyimide (Al2O3@PI) film. The resultant films with different Al2O3 contents are characterized by scanning electron microscopy, Fourier transform infrared spectroscopy, thermal gravimetric analysis, and dynamical mechanical analysis. The results indicated that the Al2O3 NPs could uniformly decorate the surface of fibers with a diameter of about 1 μm, which enhanced the thermal and mechanical properties of the fiber-based films. In particular, the flexible film with a high content of Al2O3 of 59.3 wt% presents a high storage modulus (2.11 GPa) and excellent thermal stability (474 °C at 5% mass loss) as well as superior in plane thermal conductivity of 9.66 W m−1 K−1. Finally, compared with pure PI film, the Al2O3@PI fiber-based film exhibits excellent thermal transfer ability in light emitting diode packaging. Therefore, the novel Al2O3@PI fiber-based film with integrated properties of insulation, thermal conductivity and flexibility can be used for wearable electronics and power devices.
研究领域:
材料科学
·
高分子材料
·
纳米复合材料
·
热管理材料
·
柔性电子学
✓ 已验证
DOI
高影响因子
POLYMER
·
2026
·
IF 5.1
Xiaojie Jiang,Binzhe Tan,Dongya Guo,Jun Zheng,Yiduan Lou,Yu Lin
Two-dimensional MXene materials have exhibited considerable promise for electromagnetic interference (EMI) shielding due to their excellent electrical conductivity. However, achieving excellent mechanical properties and high EMI shielding effectiveness (SE) simultaneously in such composite materials with the lowest content of MXene remains a continuing challenge. Herein, delignified wood (DW) aerogel with porous structure was obtained by the sodium chlorite method, and the ternary composite film of polyimide (PI)/MXene/DW was fabricated by sequential vacuum impregnation of MXene and polyamide acid solution, followed by hot pressing and thermal imidization. The introduction of PI significantly improves the mechanical properties of the composite film, exhibiting the tensile strength and modulus of 88.97 MPa and 2.93 GPa, respectively. The composite film exhibits the EMI SE of 15.2 dB in the X-band range with the MXene content of only 7 wt% and the thickness of 0.3 mm, corresponding to a high SE/ t of 50.7 dB/mm. Moreover, the composite film shows stable EMI shielding performance even after exposing in a variety of harsh environments and good flame retardancy properties. Therefore, the resulting composite film exhibits excellent EMI shielding and flame retardancy performance, which provides the potential applications in aerospace and related fields.
✓ 已验证
DOI
高影响因子
MACROMOLECULAR RAPID COMMUNICATIONS
·
2023
·Vol. 44
·期 12
·2200956
·
IF 4.6
Weikai Sun,Minhao Yang,Kun Peng,Yaqin Fu
The ever increasing demand for high-speed communication at high frequency promotes the rapid development of low-dielectric polymer films. Aromatic polyimide (PI) has been widely used as the main dielectrics in the flexible circuit board due to its excellent dielectric, mechanical, and thermal properties. Nevertheless, the dielectric constant of PI films at a high frequency range (several GHz) is relatively high and cannot satisfy the requirement of high-frequency communication. On this basis, a hyper-crosslinked polymer (HCP) and fabricated all-organic HCP/PI composite films through a physical blending method is synthesized. The porous structure of HCP is helpful to reduce the dielectric constant of PI matrix. The effects of HCP loadings on the dielectric, mechanical, and thermal properties of HCP/PI composite films are systematically investigated. The dielectric constants of the composite films can be reduced to 1.6–1.8 in the frequency range of 8.2–9.6 GHz when the HCP content reached 10 wt.%. The proposed method in this work is simple and effective to reduce the dielectric constant of PI and can be easily extended to other organic component-filled PI systems.
✓ 已验证
产品关联
DOI
PubMed
高影响因子
JOURNAL OF ALLOYS AND COMPOUNDS
·
2023
·
IF 6.2
Na Chu,Chunjia Luo,Xushuai Chen,Liuxin Li,Chaobo Liang,Min Chao,Luke Yan
With the development of electronic products to miniaturization and high frequency, high-performance flexible electromagnetic interference (EMI) shielding materials are urgently needed to deal with electromagnetic pollution. Two-dimensional transition metal carbide/polyimide (Ti 3 C 2 T x MXene/PI) films were synthesized by in situ polymerization and a simple scratch method in this paper. The Ti 3 C 2 T x MXene nanosheets give the films good EMI shielding effectiveness (SE) and electrical conductivity . Specifically, the film with a thickness of 0.11 mm (Ti 3 C 2 T x content of 30 wt%) exhibits an EMI SE of 34.73 dB and a specific EMI SE (SE/thickness) of 315.73 dB/mm in the frequency range of 8.2–12.4 GHz (X-band). In addition, the films have a tensile strength of 67.58 MPa, and a high decomposition temperature of 510 ℃ in N 2 atmosphere. Therefore, we believe that the prepared Ti 3 C 2 T x /PI films with good comprehensive performance have enormous potential in the field of lightweight and flexible EMI shielding materials.
✓ 已验证
产品关联
DOI
高影响因子
Journal of Materials Chemistry A
·
2023
·Vol. 11
·期 18
·9931-9941
·
IF 11.9
He Huang,Xiaojie Yan,Xiangyu Jin,Can Wu,Yiwu Pan,Hebing Wang,Chuncheng Zhu,Changqing Hong,Wenbo Han,Xinghong Zhang
The booming aerospace industry presents significant challenges for lightweight and flexible thermal protective materials for spacecraft and related apparatus. Despite polyimide aerogels being potential candidates with outstanding thermostability, their low strength and instability at ultra-high temperatures limit their practical applications. We report a lightweight composite interlocked by a dual polyimide network and a 3D quartz fiber felt, with attractive flexibility, excellent thermostability, long-term thermal insulation under both static and dynamic conditions, as well as superior flame retardancy and hydrophobicity. The robustness of the composite was endowed by the embedment of linear polyimide, which strengthened the felt and chemically bonded with the network polyimide. The resulting composite with a density of 0.147 g cm−3 exhibited low thermal conductivity (0.036 W m−1 K−1), reversible bending and compressive behaviors (strains of 15% and 60%, respectively), high pyrolysis temperature in air (445 °C), sustainable thermal insulation at 300–400 °C, and even 30 min-insulation at 1200 °C with a space-saving thickness (8 mm). These integrated performances made the composite promising for wide-temperature thermal protection where both efficient thermal insulation and flexibility are demanded.
✓ 已验证
产品关联
DOI
高影响因子
IET Nanodielectrics
·
2022
·Vol. 6
·期 3
·76-85
·
IF 0
Xiaodi Dong,Baoquan Wan,Lin Qiu,Ming-Sheng Zheng,Jiefeng Gao,Jun-Wei Zha
A series of high-performance linear and cross-linked polyimide (PI) aerogels with different molecular structures have been successfully synthesised using the freeze-drying process. In this study, the comprehensive regulation of microstructure, thermodynamic, thermal insulation and dielectric properties of PI aerogels are achieved by controlling the rigid/flexible structure and composition of polymerised monomers. The increase in rigidity of PI molecular structure could promote the formation of denser pores, which is beneficial to improve the thermodynamic and thermal insulation properties of aerogels. Notably, the cross-linked PI aerogel prepared by introducing cross-linking agent (tris(4-aminophenyl) amine, [TPA]) into linear PI exhibits high thermal stability ( T d 5% > 560°C), excellent ultralow permittivity ( ε r = 1.31, f = 10 6 Hz) and good thermal insulation property ( k = 0.056 W/m · K). This innovative strategy promotes the wider application of the cross-linked polyimide aerogel in the field of integrated circuits and aerospace exploration.
✓ 已验证
产品关联
DOI
POLYMER ENGINEERING AND SCIENCE
·
2022
·Vol. 63
·期 2
·562-573
·
IF 2.573
Ai Ping Zhang,Xin Kang Li,Hai Lan Lin,Zhao Xin Zhang,Shang Ke Yang,Xun Tao Zhang,Liu Xin Xiao,Jun Bian,Dai Qiang Chen
Polyimide (PI) dielectric nanocomposites containing functional nanofillers based on layered structure (single-layer: BT@Al 2 O 3 @PI, double-layer: PI/BT@Al 2 O 3 @PI, three-layer: PI/BT@Al 2 O 3 @PI/PI) were designed and prepared by using PI as matrix, barium titanate (BT)@alumina (Al 2 O 3 ) as nanofillers through in-situ polymerization compounding technology. FTIR tests indicated that PI and PI dielectric nanocomposites have been synthesized successfully. The molecular mass of BaTiO 3 @Al 2 O 3 @PAA oligomer was higher than that of pure PAA when BT and Al 2 O 3 nanofillers were incorporated simultaneously, as verified by GPC and intrinsic viscosity tests. XRD analysis showed that the addition of nanofillers destroyed the order of PI molecular structure and reduced the arrangement density of PI molecular chains. Both FESEM and HRTEM observations showed that the nanofillers were homogeneously dispersed in the PI matrix, contributing to the property improvements of PI dielectric nanocomposites. TGA results indicated that adding nanofillers improved the thermal stability and heat resistance of PI dielectric nanocomposites. The dielectric constant of PI/BT@Al 2 O 3 @PI double-layer nanocomposites was between the single-layer nanocomposites and pure PI. Due to the effective medium theory, the dielectric constant of three-layer PI/BT@Al 2 O 3 @PI/PI nanocomposites containing 5 wt% BT@Al 2 O 3 reached 5.43. This work can be expected to provide an effective strategy to fabricate PI dielectric nanocomposite films for energy storage applications.
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）