RSC Advances
·
2016
·Vol. 6
·期 30
·25302-25310
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IF 3.289
Nafeesa Mushtaq,Guofei Chen,Lala Rukh Sidra,Xingzhong Fang
To investigate the asymmetric effect of the naphthalimide moiety on the thermal, mechanical, optical properties and water uptake of polyimides (PIs), two novel asymmetric diamines, 4-(4-aminophenoxy)-N-amino-1,8-naphthalimide 3 and 4-(4-aminophenoxy)-N-(4-aminophenyl)-1,8-naphthalimide 4 were synthesized. Two series of PIs 5b–e and 6a–e were prepared from diamines 3 and 4 by solution polymerization method, respectively. The resulting polyimides demonstrated good solubility, high glass transition temperature (Tg) of 311–421 °C and good thermal stability based on the 5% weight loss temperature (T5%) of 435–563 °C in nitrogen. These PIs also exhibited good mechanical properties with tensile strengths of 107.3–172.2 MPa, tensile moduli of 2.8–4.9 GPa, and elongations at break of 2.9–9.1%. The water uptake of PIs was in the range of 0.33–1.96%. The polyimides displayed UV-vis absorption maxima and an intense fluorescent intensity in the range of 361–371 and 480–700 nm, respectively.
研究领域:
材料科学
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化学工程
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DOI
高影响因子
EUROPEAN POLYMER JOURNAL
·
2024
·
IF 5.8
Xingwang Lai,Shan Huang,Jialin Zhang,Xialei Lv,Fangfang Niu,Jinhui Li
Photosensitive Solder resist (SR) materials require a high glass transition temperature ( T g > 170 °C) and a coefficient of thermal expansion matching that of copper (CTE≈17 ppm/°C) to meet the demands of manufacturing processes and application reliability. However, the commonly used epoxy resin in SR materials exhibits insufficient mechanical and thermal properties, failing to meet these requirements adequately. To address this issue, alkali-soluble photosensitive poly (amic ester) (PAE) materials were synthesized. By grafting a low-temperature curing accelerator, 6-([1,1′-biphenyl]–4-yl)–4-chloroquinoline (NQL), onto the hydroxyl groups of the PAE, the resultant grafted PAE resin was blended with an alkali-soluble photosensitive modified epoxy resin (APE) to enhance the mechanical and thermal properties of the SR composite. Research indicates that due to the low-temperature curing effect and electrostatic interactions of NQL, SR-2 (with a 10% PAE addition) exhibits a T g of 183 °C and a CTE of 16 ppm/°C, while SR-3 (with a 30% PAE addition) achieves a T g of 204 °C and a CTE of 20 ppm/°C. Furthermore, with the PAE addition of 5%, the lithography quality of SR is enhanced, enabling SR-1 to achieve a pattern resolution of up to 40 μm. The modification method involving PSPI blending has been shown to enhance the thermal stability, dimensional stability, and lithographic performance of SR, indicating significant potential applications in solder resist materials.
研究领域:
材料科学
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电子工程
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DOI
高影响因子
POLYMER
·
2020
·
IF 4.231
Haoji Lao,Nafeesa Mushtaq,Guofei Chen,Hongyu Jiang,Yang Jiao,Anjiang Zhang,Xingzhong Fang
Two series of optically transparent polyamide-imides (PAIs) were prepared by copolymerization of trimelletic acid chloride (TMAc), p -phthaloyl chloride (TPC), 2,2′-bis(trifluoromethyl)-[1,1′-biphenyl]-4,4′-diamine (TFDB) and 4,4’-(9-fluorenylidene) diamine (FDA). These series of PAIs displayed high glass transition temperatures ( T g s) ranging from 340 to 441 °C, 5% weight loss temperatures ( T 5% s) in nitrogen with 459–505 °C, and low coefficient of thermal expansion (CTE) of 21–56 ppm/K, which greatly affected by the feed ratio of rigid TPC units and cardo diamine in the polymer main chain. The transmittances at 500 nm (T 500nm ) of the PAI films were found in the range of 70.0–87.7%, All polymers demonstrated good organosolubility and mechanical properties with tensile strengths of 77–146 MPa, tensile moduli of 2.9–5.8 GPa and elongations at break of 2.9–8.2%. PAI-7-8 presented the best combination of high T g of 401 °C and high tensile modulus of 5.0 GPa, low CTE value of 24 ppm/K, and high transparency (T 500nm ) of 87.2%.
研究领域:
聚合物科学
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材料科学
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化学工程
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高影响因子
THERMOCHIMICA ACTA
·
2023
·
IF 3.5
Yongchen Zhu,Jianwei Zhang,Weidong He
5-Amino-1H-tetrazole (5-ATZ), an environmentally friendly energy-containing material for new propellants, is gradually applied in high-energy propellants and its ionic salt compounds have received wide attention. This study focused on investigating the interaction mechanism of guanidinium-5-aminotetrazole (GA) and nitrocellulose (NC) by kinetic methods and TG-DSC-FTIR analysis. DSC and TG experiments indicated that there was a certain interaction during the pyrolysis process of NC and GA. Comparing the kinetic models of NC and peak 3 in NC-GA, it can be found that the addition of GA mainly affected the m-value and contribution in the second step B→C, and the mechanism function changed from F n to C n,m. TG-DSC-FTIR experiments indicated that the initial decomposition product of NC, NO 2 , participated in the thermal decomposition process of GA, and the two reacted chemically to form CO, N 2 O, which made NO 2 unable to completely oxidize the skeleton of NC to produce CH 2 O, HCOOH.
研究领域:
化学
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材料科学
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能源与推进剂研究
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DOI
高影响因子
JOURNAL OF POLYMER SCIENCE
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2024
·
IF 3.9
Nafeesa Mushtaq,Jinglei Xing,Xiaohong Li,Guofei Chen,Xingzhong Fang
Colorless polyimide (CPI), a heat-resistant polymer being widely used in optoelectrical devices, has attracted worldwide attention. Polyamide-imides due to the incorporation of amide groups into the CPI chains enhance the polymer performance by improving the thermal dimensional stability and excellent mechanical properties without sacrificing the optical transparency. In this article, CPI films PI-(1-3) are synthesized from one-step polymerization of 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) and cyclopentanone bis-spironorbornane tetracarboxylic dianhydride (CpODA) with amide-containing diamine N , N ′-(2,2′-bis(trifluoromethyl)-[1,1′-biphenyl]-4,4′-diyl)bis(4-aminobenzamide) (AB-TFDB) and bis(trifluoromethyl)benzidine (TFDB). In comparison, by adjusting the ratio of imide and amide groups in the repeating unit, PI-(4-5) are prepared from copolymerization of terephthaloyl chloride (TPC), 6FDA, and CpODA with TFDB diamine. PI-(1-5) with 90% transmittance in the visible region tailored the excellent thermal and mechanical properties. Particularly, PI-3 exhibited a high glass transition temperature of 412°C, a coefficient of thermal expansion of 20.8 ppm/K, a tensile strength of 128 MPa, and an elastic modulus of 5.4 GPa. The results also concluded that irrespective of the polyamide-imide synthesis strategy, CPI films with similar amide-to-imide ratio in polymer chain demonstrated comparable optical, thermal, and mechanical properties. Graphical
研究领域:
材料科学
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高分子化学
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DOI
高影响因子
Polymer Chemistry
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2023
·
IF 4.6
Tong Zhou,Yu-Ting Guo,Chun Yang,Xian-Bin Meng,Fusheng Du,Zichen Li
A new bicyclic lactone, 2,5,7-trioxabicyclo[2.2.2]octan-6-one (TOB), was synthesized by direct condensation reaction of glycerol and glyoxylic acid. The ring-opening polymerization (ROP) of TOB and its copolymerization with lactide (LA) under different conditions were systematically investigated. Both acid and base could catalyze the ROP of TOB, but only oligomers were obtained in low yields. Three discrete oligomers (O1, O2, and O3) of TOB were separated and characterized, confirming that the high crystallinity and poor solubility of PTOB in the polymerization media caused the low monomer conversion and low molar mass of PTOB. Copolymerization of LA and TOB was investigated with benzyl alcohol as the initiator and 1,5,7-triazabicyclo[4.4.0]dec-5-ene (TBD) as the catalyst. It was confirmed that LA was consumed very quickly to form PLA, followed by slow incorporation of TOB into the formed PLA chains. By varying the feed ratios of LA to TOB, a series of random copolymers with the incorporation ratio of TOB up to 49 mol% were obtained. These copolymers exhibited high glass transition temperatures (Tg) up to 100 oC. The TBD-catalyzed copolymerization mechanism was revealed to be a base-catalyzed transesterification of PLA and TOB. Finally, PLA-co-PTOB with variable Tg could thus be simply prepared by direct transesterification of PLA with TOB in the presence of TBD.
研究领域:
材料科学
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高分子化学
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DOI
高影响因子
COMPOSITES PART B-ENGINEERING
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2025
·
IF 14.2
Yining Wang,Yu Deng,Qiming Wang,Jingyi Cheng,Mingyuan Ma,Hailong Li,Cheng Liu,Xigao Jian,Yousi Chen
Interfacial engineering plays a pivotal role in tailoring interfacial interactions and governing the performance of carbon fiber reinforced thermoplastic composites. However, constructing a tunable and robust interfacial architecture without the aid of inorganic fillers remains a significant challenge. In this study, we propose an interfacial design strategy based on a binary water-soluble poly(amic acid) salt (PAA) system. By exploiting the disparity in glass transition temperatures (Tg) and segmental mobility between the two components, an interfacial film with a hierarchical microstructure is induced on the carbon fiber surface. During hot-press processing, this film evolves into a morphologically complex interface exhibiting phase-separated characteristics, which substantially improves interfacial wettability, mechanical interlocking, and interfacial adhesion strength. When applied to two representative thermoplastic matrices, PEI and PEEK, the resulting composites exhibit systematic enhancements in flexural strength, interlaminar shear strength, and high-temperature mechanical performance, demonstrating the broad applicability of this approach. Further investigations reveal that these composites not only possess excellent structural integrity but also exhibit superior wear resistance, electromagnetic shielding capability, and rapid Joule-heating-based deicing responsiveness. These multifunctional properties highlight the potential of this system for integrated structural-functional applications. The morphology-driven, filler-free interfacial engineering paradigm presented herein offers a scalable and generalizable platform for the development of high-performance composite materials.
研究领域:
材料科学
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高分子科学
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复合材料工程
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表面工程
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纳米技术
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DOI
高影响因子
JOURNAL OF APPLIED POLYMER SCIENCE
·
2019
·Vol. 137
·期 18
·48634
·
IF 2.188
Guoqiang Wang,Yin Liang,Min Jiang,Qiang Zhang,Rui Wang,Honghua Wang,Guangyuan Zhou
The purpose of this study was to enhance the glass-transition temperature of poly(butylene 2,5-thiophenedicarboxylate) (PBTF). A series of poly(butylene- co -1,4-cyclohexanedimethylene 2,5-thiophenedicarboxylate)s (PBCTFs) were synthesized from 2,5-thiophenedicarboxylic acid, 1,4-cyclohexanedimethanol (CHDM), and 1,4-butanediol. CHDM can increase the chain rigidity and lead the β relaxation temperature shift to lower temperature. Consequently, PBCTFs showed not only the high glass-transition temperature, but also high elongations at break. PBTF was a crystalline polyester. However, differential scanning calorimetry and wide-angle X-ray diffraction results suggested PBCTFs were amorphous polyesters. Thermogravimetric analysis results indicated the thermal stability of copolyesters was gradually enhanced with increasing the CHDM content. When the CHDM content was 95 mol %, PBCTF95 exhibited high glass-transition temperature (69.2 °C), tensile strength (44.4 MPa), and elongation at break (205%). © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137 , 48634.
研究领域:
材料科学
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高分子化学
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DOI
高影响因子
POLYMER BULLETIN
·
2022
·Vol. 80
·期 9
·10457-10471
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IF 2.843
Wei Junji,Duan Yajun,Wang Hao,Hui Jizhuang,Qi Jiamin
Nowadays, the rapid development of industrial technology is putting a great demand for high-performance epoxy resin. Traditional bisphenol A epoxy resin (DGEBA) is facing great challenges from both the perspective of human health and the needs of cost reduction under the background of oil resources shortage. Therefore, it’s important to find appropriate substitutes for DGEBA. In this paper, a trifunctional epoxy resin (DPA-E) was prepared using a simple two-step method with diphenolic acid and epichlorohydrin. It was interesting that the DPA-E, cured by 3,3′-dimethyl-4,4′-diaminodicyclohexylmethane (DMDC), showed the similar properties as DGEBA except for curing temperature, glass transition temperature, and thermal expansion properties. The gel temperature for DPA-E/DMDC was as low as 29 ℃, which was obtained from curing kinetic study. Even for curing temperature of DPA-E/DMDC was also relatively low ( T p = 83 ℃). Even so, the glass transition temperature of this system was as high as 239 ℃, which was 24% higher than that of DGEBA/DMDC ( T g = 193 ℃). Furthermore, DPA-E/DMDC showed a lower thermal expansion coefficient, especially at elevated temperature (> 150 ℃). Therefore, this kind of new epoxy resin might have a very hopeful future in many important areas including aerospace and microelectronics.
研究领域:
材料科学
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化学工程
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DOI
高影响因子
Molecular Catalysis
·
2023
·
IF 4.6
Tiantian Zhang,Jiacheng Xu,Yan Sun,Shiyu Fang,Zuliang Wu,Erhao Gao,Jiali Zhu,Wei Wang,Lianxin Dai,Weihua Liu,Buhe Zhang,Junwei Zhang,Shuiliang Yao,Jing Li
Nano-Au has a good catalytic activity for CO oxidation, but its catalytic mechanism is still not clear. Here, CO oxidation on Au 2 O 3 and its thermal decomposition products were studied using thermogravimetric-mass spectrometry (TG-MS) and operando diffuse reflectance infrared Fourier transform spectroscopy-mass spectrometry (DRIFTS-MS) to explore the key active components of Au catalyst for CO oxidation. The TG-MS results showed that Au 2 O 3 decomposed to AuO at 210 °C and Au at 375 °C and was oxidized to form Au oxide above 375 °C. When Au 2 O 3 decomposed into Au x O y (x>y) above 210 °C, the CO oxidation activity obviously increased. Au atoms in the Au-Au system serve as electron donor and CO adsorption sites. Au atom is oxidized to AuO by the O atom from O 2 decomposition following the Epling-Xu decomposition mechanism. A schematic diagram of the key components of Au 2 O 3 catalysts during CO oxidation was proposed based on TG-MS and operando DRIFTS-MS analysis results.
研究领域:
催化化学
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材料科学
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DOI
高影响因子
RSC Advances
·
2018
·Vol. 8
·期 23
·12870-12878
·
IF 2.936
Li Tan,Hailong Li,Mengru Liu
In this study, CMC–LDH beads were prepared and characterized using SEM, FTIR and TG analysis. The beads were applied for the removal of Cr(VI) from aqueous solution. The effects of adsorbent dosage, initial pH and initial concentration of Cr(VI) solution on Cr(VI) uptake were investigated in detail. Moreover, adsorption isotherms and adsorption kinetic models were employed to analyze the adsorption process, and a preliminary study of the reusability of the adsorbent was performed. The experimental results showed that the CMC–LDH beads could remove Cr(VI) from aqueous solution efficiently. When the initial concentration of the Cr(VI) solution was 100 mg L−1 and the adsorbent dosage was 12 g L−1, the removal efficiency of Cr(VI) reached 96.2%. After the CMC–LDH beads were reused 10 times, the removal efficiency of Cr(VI) still remained at 89.6%.
研究领域:
环境科学
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材料科学
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化学工程
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产品关联
DOI
PubMed
高影响因子
POLYMER
·
2025
·
IF 4.5
Junji Wei,Zeyue Zhang,Zexing Zhang,Runlin Lu,Jinbiao Pang,Shifeng Yuan,Liang Fang,Li Duan,Jian Liu
For decades, high-performance epoxy resins have been pivotal in advancing high-temperature electronic materials. Conventional epoxy resins tend to soften and deform under high-temperature conditions, which compromises their structural stability and fails to meet the stringent thermal reliability requirements of high-temperature processes and equipment. Regarding this, this study presented two new kinds of fluorene-based epoxy monomers bisphenol fluorene epoxy resin (BFEP), isopropyl bisphenol fluorene epoxy resin (IBFEP) and a novel curing agent (1,3-bis(4-aminophenyl) adamantane, AMA) derived from adamantane. The two monomers were cured with two hardeners, 4,4-diaminodiphenyl sulfone (DDS) and AMA, respectively. The DDS cured resins showed high glass transition temperature (BFEP/DDS, 236 °C; IBFEP/DDS, 209 °C), excellent storage modulus, good thermal stability ( T d5% >395 °C) and dimensional stability, low water absorption and good adhesion. However, the dielectric constant (κ) of those two resins were relatively high, e.g. 4.6 was for BFEP/DDS, 4.23 was for IBFEP/DDS at 10 MHz. Compared with DDS system, both resins exhibited a lower glass transition temperature ( T g ) after cured by AMA. However, the latters also possessed a notably high storage modulus at room temperature (RT) (BFEP/AMA, 4420 MPa; IBFEP/AMA, 4630 MPa), lower dielectric constant (BFEP/AMA, 4.05; IBFEP/AMA, 3.74 at 10 MHz), better adhesion and thermal conductivity. In summary, the two kinds of fluorene-based epoxy resins cured with different curing agents exhibited different performance characteristics. The performance of AMA cured epoxy resin exhibited more balanced behaviors due to its excellent rigid and hollow structure, which could be suitable for high- T g PCB substrate materials.
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高影响因子
危险品化学品经营许可证（带存储）