COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
·
2015
·
IF 3.071
Jianwen Xia,Jinhui Li,Guoping Zhang,Xiaoliang Zeng,Fangfang Niu,Haipeng Yang,Rong Sun,ChingPing Wong
Bismaleimide–triazine (BT) resins have received a great deal of attention in microelectronics due to its excellent thermal stability and good retention of mechanical properties. Thereafter, developing BT based composites with high mechanical strength , thermal conductivity and dielectric property simultaneously are highly desirable. In this study, one hybrid fiber of Al 2 O 3 nanoparticle (200 nm) supported on polyimide fiber (Al 2 O 3 @PI) with core–shell structure was introduced into BT resin to prepare promising Al 2 O 3 @PI–BT composite. The results indicated that the resultant composites possessed high Young’s modulus of 4.06 GPa, low dielectric constant (3.38–3.50, 100 kHz) and dielectric loss (0.0102–0.0107, 100 kHz). The Al 2 O 3 @PI hybrid film was also conductive to improve thermal stability ( T d5% up to 371 °C), in-plane thermal conductivity (increased by 295% compared to that of the pure BT resin). Furthermore, the Al 2 O 3 @PI–BT composite were employed to fabricate a printed circuit substrate, on which a frequency “flasher” circuit and electrical components worked well.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
ACS Applied Polymer Materials
·
2022
·
IF 4.855
Xingxu Gao,Lei Sheng,Menglin Li,Xin Xie,Ling Yang,Yun Gong,Min Cao,Yaozong Bai,Haoyu Dong,Gaojun Liu,Tao Wang,Xianli Huang,Jianping He
Commercial polyolefin separators often cause explosions and thermal runaways in lithium-ion batteries due to their poor thermal stability. Therefore, various polymer separators with high thermal stability have attracted the attention of researchers. In this paper, a kind of special nano-TiO2/Polyimide (TiO2@PI) composite separator was prepared by adding nano-TiO2 particles with certain content to the PAA solution before electrospinning. It is found that the added TiO2 ceramic particles greatly improve the flame retardant performance of the separator, and at the same time, they inhibit lithium dendrites and prevent the internal short circuit of the battery. As a result, the TiO2@PI nanofiber separator (5.0-TiO2@PI) prepared by a spinning solution with a TiO2 concentration of 5.0 wt % is formed by connecting spherical beads with a diameter of about 500 nm, which greatly inhibits lithium dendrites. It has better properties, such as electrolyte uptake (721%) and ionic conductivity (2.52 mS cm–1). The LiCoO2/Li battery based on 5.0-TiO2@PI nanofiber separator has a higher discharge capacity even at a current density of 4 C, which is better than that of PE separator. The use of this 5.0-TiO2@PI nanofiber separator has enlightening significance for the safety of high energy density batteries.
研究领域:
材料科学
·
能源技术
✓ 已验证
DOI
高影响因子
Small
·
2026
·
IF 11.8
Weihao Xu,Zixuan Wang,Menglong Xu,Runlin Chen,Yurou Guo,Jun Wang
Rationally coupling nanoscale material design with macroscopic architecture is crucial for achieving lightweight absorbers with broadband and strong electromagnetic (EM) wave attenuation. Herein, multiscale-engineered polyimide (PI)/MXene/Ni aerogels integrating magnetic Ni nanochains, dielectric MXene sheets, and anisotropic porous architectures are reported. Ni nanochains with controlled morphology were synthesized via NaOH-assisted hydrazine reduction, while directional freezing enabled the fabrication of random, parallel, and normal aerogel architectures. The normal-aligned PI/MXene/Ni aerogel exhibits a remarkable minimum reflection loss (RL min ) of −72.42 dB at 2.8 mm. Guided by a genetic-algorithm optimization, tri-layer assemblies further expand the effective absorption bandwidth (EAB) to 8.4 GHz while maintaining an outstanding RL min of −61.69 dB. The superior absorption originates from synergistic dielectric–magnetic–structural losses, including interfacial polarization, ohmic/eddy-current dissipation, and gradient impedance matching enabled by the layered porous framework. Beyond EM attenuation, the aerogels feature ultralow density, high compressive strength, enhanced hydrophobicity, intrinsic flame retardancy, and low thermal conductivity, providing effective infrared stealth and thermal protection. This work demonstrates a multiscale design strategy to create multifunctional, broadband EM absorbers for demanding electronic and aerospace environments.
✓ 已验证
产品关联
DOI
高影响因子
POLYMER
·
2026
·
IF 5.1
Wanying Zhang,Yongjian Zhu,Yiyong Chen,Chengbin Zou,Feng Dou,Dezhi Zhan,Hao Zhong,Jinru Li,Shilong Zhong,Rui Chen,Yanyu Gao,Cheng Wang,Xudong Chen
Polyimides are widely used in the manufacture of flexible copper-clad laminates because of their excellent thermal stability, mechanical properties, and solvent resistance. However, copper-clad laminates based on fully aromatic polyimide substrates suffer from electronic signal propagation delay and signal loss during operation, issues that become particularly pronounced under high-frequency signal transmission. Additionally, the traditional subtractive process used to fabricate copper-clad circuits on polyimide film surfaces has significant drawbacks, including high energy consumption and environmental pollution. Therefore, developing low-dielectric polyimides and additive manufacturing methods for flexible copper-clad laminates remains a major challenge. Here, controllable regulation of segment sequence structure and segment length in silicon-oxygen polyimide was achieved through a stepwise polymerization strategy. The resulting block polyimide exhibits excellent comprehensive performance, with a dielectric constant as low as 2.76 and an initial thermal decomposition temperature of 489 °C. By combining laser direct writing with additive patterning, controllable copper metallization based on a silver seed layer was successfully achieved on the surface of the block polyimide films. The copper wires, composed of cubic-phase copper nanoparticles with grain sizes of 70-90 nm, display high-resolution edge definition and excellent mechanical stability. This synergistic approach, integrating controllable polymer synthesis with surface metal patterning, provides an effective alternative method for manufacturing high-performance flexible electronic devices.
✓ 已验证
产品关联
DOI
高影响因子
SEPARATION AND PURIFICATION TECHNOLOGY
·
2026
·
IF 9.1
Xinwu Zhu,Qing Su,Zhimei Wei,Xiaojun Wang,Jie Yang
“Process first, strengthen later” strategy for polyimide filtration membranes • NIPS-assisted wet spinning constructs hierarchical porous nanofiber structure • 99.4% PM 0.3 filtration efficiency with low pressure drop of 98.6 Pa • S to -SO 2 - conversion enhances Tg (248.3 °C) and T 5 % (479.5 °C) • P-OPSI membrane maintains stable performance up to 450 °C High temperature industrial flue gas containing PM 0.3 particles poses serious environmental and health risks, making the development of polymer filtration membranes that combine processability, thermal stability, and high filtration efficiency a key challenge. This work propose a strategy of “processing first, then strengthening”, utilizing the dual function of sulfide ( S ) groups: their conformational flexibility can improve solubility and solution processability during membrane preparation, while their oxidizability allows them to be converted into highly thermally stable sulfone (-SO 2 -) groups through mild conversion reactions after synthesis without damaging the formed nanofiber structure. Firstly, soluble sulfide containing polyimide resin (PSI) was synthesized, and then processed into a component level porous nanofiber membrane (P-PSI) through non-solvent induced phase separation (NIPS) assisted wet spinning. Subsequently, through mild liquid-phase oxidation treatment, the S group was selectively converted into sulfone (-SO 2 -) groups without damaging the nanofiber structure, resulting in the formation of an oxidized porous PSI membrane (P-OPSI). The resulting P-OPSI membrane exhibits high specific surface area (76.1 m 2 /g), large surface pore size (25.3 nm), and high porosity (38.5%). It achieves a PM 0.3 filtration efficiency of 99.4% at wind speed of 0.53 m/s, with low pressure drop of 98.6 Pa and quality factor of 0.052 Pa −1 . Crucially, the P-OPSI membrane demonstrates significantly enhanced thermal properties, with glass transition temperature of 248.3 °C and 5% thermal weight loss temperature of 479.5 °C. This work establishes that the S to -SO₂- conversion strategy offers powerful and universal approach for designing high-performance polymer membranes for harsh high-temperature particle control. Download: Download high-res image (322KB) Download: Download full-size image
✓ 已验证
DOI
高影响因子
ACS Applied Polymer Materials
·
2026
·
IF 5.2
Hou Tianqi,Liu Xiuli,Liu Xiaowei
Advances in semiconductor materials have placed increasingly
stringent
demands on the reliability of packaging materials for electronic devices.
However, the smooth surface of copper foils and the inherent limitations
of the molecular structure of polyimide (PI) lead to poor interfacial
adhesion between PI and copper foil, thereby posing significant challenges
to packaging reliability. Herein, a chain-end functionalization strategy
is proposed to enhance the interfacial adhesion between PI and copper
foils through the covalent modification of PI with 2-aminobenzimidazole
(2-AB) and 4-(trimethoxysilyl)aniline (4-TMSA). The siloxane and benzimidazole
moieties in the functionalized materials synergistically form covalent
bonds between molecular chain ends and the copper surface, increasing
interactions at the heterogeneous interface. Simulation results reveal
that the chain-end modified groups preferentially migrate toward the
copper region, increasing the interaction range between the molecular
segments and the copper surface. This chain-end functionalization
confers a high peel strength of 0.280 N/mm, a high glass transition
temperature of 381.4 ° C, and a high AC breakdown strength of
345.11 kV/mm, improving the reliability of the packaging material.
✓ 已验证
DOI
高影响因子
POLYMER ENGINEERING AND SCIENCE
·
2026
·
IF 3.6
Yujie You,Kun Peng,Qinhao Wu,Kehan Qu,Yaqin Fu,Yinsong Si
Polyimide (PI) composites with simultaneous low dielectric constant ( D k ) and dissipation factor ( D f ) are highly desirable for high-frequency communications. Conventional porous or hollow silica (SiO 2 ) fillers effectively reduce the dielectric constant but often suffer from incomplete removal of internal silanol groups and require pore-sealing processes, which compromise dielectric performance and increase processing complexity. Herein, mesoporous foam silica (MFS) with an interconnected mesoporous structure was methyl-modified to remove the silanol groups (Si OH) from both the outer and inner surface. The obtained internally methyl-modified porous silica (MFSM) retaining amount of air was then dispersed into a polyamic acid (PAA) solution to fabricate PI/MFSM composite films. Owing to the improved compatibility between MFSM and PI, together with reduced polar groups in MFSM, the resulting PI/MFSM composite films simultaneously exhibit a low D k of 2.324 and a low D f of 0.0097 at 10 GHz, along with experimental D k values well matched with the theoretical predictions. Besides, the PI/MFSM composites also demonstrate an outstanding thermal stability ( T d5% = 573°C, T max = 603°C), a much lower coefficient of thermal expansion (CTE = 26.9 ppm/°C) matched with copper substrates, a good tensile strength (29.5 MPa) and breakdown strength (96.7 kV/mm), and a high MFSM loadings of up to 45.31 vol%. This work provides a feasible structural design strategy for developing low-dielectric PI composites for high-frequency communication applications. Highlights Internal polar (Si OH) groups in MFSM are efficiently removed by methylation. Air introduced by MFSM effectively lowers the D k of PI/MFSM composites. Uniform MFSM dispersion in PI preserves composite flexibility.
✓ 已验证
DOI
高影响因子
AICHE JOURNAL
·
2026
·
IF 4.4
Sheng Yuan,Jingqi Fu,Tao Yu,Zhiheng Li,Hanze Ma,Shilin Guo,Quan Zhao,Lixuan Liu,Yuao Dong,Teng Liu,Guangwei He,Zhongyi Jiang
Mixed matrix membranes (MMMs), combining the processability of polymers with the separation performance of fillers, have attracted significant attention for industrial gas separations. Nevertheless, achieving a uniformly distributed, highly connected filler phase remains a major obstacle, limiting the separation performance enhancement of MMMs. Herein, we report a family of preformed covalent organic framework (COF) network-based MMMs, which are fabricated by preforming a continuous COF network followed by infiltration of a polyimide matrix. This preforming-filler-network (PFN) method constructs a three-dimensional (3D) interconnected transport scaffold within the membrane. This unique structure eliminates filler agglomeration, a key challenge that has not been resolved by conventional MMM fabrication methods. Consequently, the membranes achieve a 707.7% enhancement in H 2 permeability (to 366.7 Barrer) and a 121.7% increase in H 2 /CH 4 separation factor (to 100.2) compared to pristine polyimide membranes. The COF-network MMM also exhibits excellent stability and plasticization resistance, further highlighting its potential for real-world hydrogen purification.
✓ 已验证
DOI
高影响因子
ACS Applied Polymer Materials
·
2026
·
IF 5.2
Haoyu Qi,Yongbin Zhao,Aihua Chen
Sufficient chain entanglements are essential for high-quality fiber membranes via electrospinning. This often requires high polymer concentrations, which result in excessively viscous solutions, hindering processability. Herein, we report a nonsolvent-assisted strategy to enhance chain entanglement and enable electrospinning to form bead-free fiber membranes at low concentrations of poly(amic acid) (PAA), the precursor of polyimide (PI). By incorporating nonsolvents into PAA solutions, binary solvent systems were constructed, which induce polymer chain contraction and strengthen intermolecular interactions, thereby facilitating entanglement networks. Thus, bead-free fiber membranes can be obtained at lower concentrations in an expanded electrospinning window of the PAA solutions. The minimum concentration required for bead-free fibers decreased from 16 wt % in pure DMF to 10 wt % in a binary solvent containing 43% nonsolvent. Increasing the proportion of nonsolvent also leads to an increase in average fiber diameters. The resulting PI fiber membranes exhibited substantially improved mechanical properties, especially in terms of toughness. Furthermore, the PI fiber membranes demonstrated an excellent oil–water separation performance. This work provides an efficient and scalable solvent-based strategy for facilitating the electrospinning of high-performance polymeric membranes with tailored properties.
✓ 已验证
DOI
高影响因子
ACS Applied Nano Materials
·
2026
·
IF 5.8
Yulin Huang,Chao Shan,Xiuyuan Wei,Xiaohua Huang
Mixed-matrix membranes (MMMs) have attracted considerable attention for gas separation because nanoscale engineering of filler structure and polymer/filler interfaces can improve overall separation performance. In this study, a monomer, 4,4′-diamino-4″-dibenzofuran-triphenylamine (DATPA), was synthesized, and a noncoplanar copolyimide was subsequently prepared using DATPA, 9,9-bis(4-amino-3-fluorophenyl)fluorene (FFDA), and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA). MMMs were then fabricated by solution blending using Noria as a nanoporous organic cage filler and the copolyimide as the matrix. Owing to the intrinsic subnanometer cavities of Noria and the resulting nanoscale transport features introduced into the membrane structure, the incorporation of Noria significantly enhanced gas separation performance. At a Noria loading of 9 wt %, the permeabilities of He, CO2, O2, and N2 increased by 96%, 134%, 57%, and 41%, respectively, compared with the pure polyimide membrane. Furthermore, at a 6 wt % loading, the ideal selectivities for He/N2 and CO2/N2 reached 77.9 and 26.0, corresponding to improvements of 42% and 57%, respectively. These results demonstrate that nanoporous organic cage incorporation is an effective strategy for tuning membrane microstructure and improving gas separation performance.
✓ 已验证
DOI
高影响因子
Chemical Science
·
2026
·
IF 8.1
Zhengyu Wei,Lingzhe Meng,Xue Qin,Wei Han,Xuelin Gong,Yiting Shi,Faheem Naseem,Wei Wei
Organic electrodes suffer from poor active site accessibility, sluggish charge transport, and structural degradation upon cycling, limiting their practical application for energy storage. To address these challenges, this work elucidates a precise electronic and structural modulation strategy for polyimides (PI) via polyoxometalate (POM) hybridization. The key advancement lies in the multiple regulatory effects imparted by POM, enabling the construction of novel hybrid electrodes for highperformance SIBs. Specifically, the covalently anchored phosphomolybdic acid (PMo12 ) clusters disrupt π-π stacking to expose abundant active C=O sites and serve as an electron-withdrawing modulators to lower the LUMO level, thereby enhancing Na + uptake and transport kinetics. Simultaneously, they function as an electron-buffering reservoir to dissipate charge accumulation during discharge, preventing structural degradation of the PI matrix. This multi-scale synergy endows the PI-PMo 12 anode with significantly improved reversible capacity, rate capability, and cycling stability, offering a promising molecular engineering strategy for developing organic-inorganic hybrid electrodes in next-generation energy storage systems.
✓ 已验证
DOI
PubMed
高影响因子
ACS Applied Engineering Materials
·
2026
·
IF 3.5
Li Zeyu,Qian Jianfeng,Shi Shun,Ma Jiaojiao,Guo Haiquan
Negative-type photosensitive polyimides (n-PSPI) for advanced packaging currently suffer from low resolution, high processing costs, and environmental issues due to organic solvent development, while water-developable alternatives often compromise performance by introducing polar groups or additives into the main chain. Here, we report a side-chain engineering approach for polyamide ester (PAE) precursors that simultaneously incorporates photosensitive methacrylate groups and water-soluble tertiary amine salts. Optimizing the side-chain ratio (DMEA/HEMA = 7:3) yields a dissolution rate contrast of 3.42 μm/min and enables 5 μm line/space patterning using 2.38 wt % TMAH aqueous developer. The hybrid side chains are completely eliminated during thermal imidization (confirmed by FT-IR), preserving the pristine polyimide backbone properties: T d5% > 530 ° C, T g ≈ 265 ° C, tensile strength >120 MPa, and low dielectric constant ( D k ≈ 3.32 at 1 MHz, 3.25 at 10 GHz) with dissipation factor <0.006. This strategy overcomes the trade-off between water developability and performance, offering a practical route to high-resolution, high-performance photosensitive polyimides for next-generation semiconductor packaging.
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）