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JOURNAL OF ALLOYS AND COMPOUNDS · 2024 · IF 5.8

Flexible multilayer MXene/Polyimide composite film with excellent electromagnetic interference shielding and photothermal conversion performance

Jinqiu Chen,Xingman Hu,Zhuguang Nie,Yang Feng,Shuhua Qi,Rumin Wang

The development of flexible, thin, multifunctional materials represents a strategic advancement for the creation of next-generation wearables that offer both electromagnetic shielding and thermal management. This study introduces the fabrication of a multilayer MXene/polyimide (MXene/PI) composite film , demonstrating significant electromagnetic shielding effectiveness (EMI SE) and photothermal conversion efficiency through a layer-by-layer casting technique. When the MXene content is 29.7 wt%, the alternating multilayer MXene/PI composite film can reach a high EMI SE of 23.3 dB at 0.26 mm thickness, and when the MXene content is 45.7 wt%, the EMI SE can reach a maximum of 40.7 dB, which has a significant advantage over other materials. This superior performance exceed that of alternative materials, owing to the multilayer MXene construction that magnifies electromagnetic wave reflection losses. Furthermore, the film displays a rapid and sensitive photothermal response under laser irradiation , achieving temperatures up to 93°C at a 0.5 W/cm 2 density. Impressively, at 0.4 W/cm 2 , it maintains a stable long-term saturation temperature over 40 cycles, showing its potential in applications such as photothermal sensors, personal heating, and muscle protection.

CAS / MDL: 127-19-5
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JOURNAL OF POWER SOURCES · 2025 · IF 7.9

High-temperature energy storage capability of flexible polyimide film incorporated with compatible covalent organic framework

Lianlian Chen,Dingyu Zheng,Fuxing Zhai,Lixin Xu,Huijian Ye

Polymer film with the intrinsic breakdown and processability demonstrates great potential for film capacitor. Nevertheless, it's constrained by the deteriorated evolution in dielectric reliability and energy loss of polymer film under the elevated temperature. In this work, an imine-based covalent organic framework COF-300 has been synthesized via Uribe-Romo method, and the high-temperature electric displacement of COF-300/fluorinated polyimide (FPI) composite is investigated based on the tailored compatible interface between imide macromolecular structure and imine-based COF-300 filler. The presence of porous configuration reduces the dielectric constant and dielectric loss of FPI composite. The large electric displacement is achieved due to the interfacial polarization in composite, resulting in the enhanced energy storage capability. The 0.1 wt% COF-300/FPI film exhibits an energy density of 11.6 J/cm 3 with a charge-discharge efficiency of 93.1 % at 625 MV/m. The interfacial interactions between the COF-300 and the PI skeleton contribute to the strong constraint for the orientation and relaxation of active dipoles, and thus the high-temperature migrations of charge carriers are alleviated effectively. The 0.1 wt% composite retains outstanding high-temperature energy capability at 150 °C, for example, the energy density of 8.6 J/cm 3 with efficiency of 91.2 % at 475 MV/m is achieved. The resultant FPI film with the enhanced high-temperature dielectric reliability paves the path for the application of polymer capacitor.

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JOURNAL OF POLYMER SCIENCE · 2025 ·Vol. 63 ·期 8 ·1891-1897 · IF 3.6

Fabrication of Heterocyclic Polyimide Films With High Thermal Stability and Low Coefficient of Thermal Expansion

WenJie Zhu,Muke Zhang,JianJun Zeng,Yufei Tang,Xin Li,Jinchao Li,Liang Chen,Qin Chen,Aibing Lu,Qianqian Liang,Yaping Zhang

The rapid development of flexible organic light-emitting diode displays has intensified the demand for polyimide (PI) films with enhanced thermal and mechanical properties. In this study, a dibenzimidazole diamine monomer is synthesized, and a series of PI films are fabricated with the molar ratio of diamine monomer adjusted to optimize film performance. The optimized PI-1 film exhibits a low coefficient of thermal expansion (5.0 ppm K −1 ), high glass transition temperature (452 °C) and 5% weight loss temperature (550 °C), improved tensile strength (168 MPa) and a modulus of elasticity (5.2 GPa) that meet the requirements for flexible display applications. The findings of this study provide valuable guidance for fabricating advanced PI films based on monomer composition and rational molecular structural design. Graphical

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Materials Today Advances · 2024 · IF 8.1

High-frequency 5G substrate: Low dielectric biphenyl polyimide with low CTE and high thermal stability

Heming Li,Panpeng Wei,Yongqi Wang,Qiushi Zhu,Xinming Wang,Weiguo Gao,Lin Tao,Ke Ma,Zhizhi Hu,Wei Chen

Polyimide (PI) faces new challenges in meeting the requirements of low coefficient of thermal expansion (CTE), low dielectric content/loss, and high thermal stability to be utilized effectively as a substrate for flexible electronic materials. At present research, the CTE of PI films can be reduced to around 5 ppm/K, with Tg > 420 °C. However, it is difficult to balance low CTE and high Tg at the same time, and reducing dielectric performance is even more difficult. This study focused on synthesizing four types of PI films (using BPDA as the dianhydride) by employing biphenyl structure diamines (PDA, BZD, DPT, DMP) with an increasing number of benzene rings. The improvement in CTE, dielectric properties, and thermal stability was observed with an increase in the number of benzene rings and a decrease in the number of imine rings in the PI horizontal structure. The Tetraphenylene PI-DMP exhibited values of ε and tanθ as 3.31 and 4.73 ‰ respectively under 10 GHz . Additionally, the biphenyl PI films demonstrated commendable thermal stability (Tg =  442°C ), outstanding mechanical properties (elastic modulus > 10 GPa ), and a low CTE ( 2 ppm/K within the temperature range of 50–300 °C, and close to the 3.6 ppm/K CTE of monocrystalline silicon). The low CTE, high thermal stability, and low dielectric properties that 5G flexible substrate materials need to be qualified are simultaneously reflected in this study. MS theoretical calculations were used to analyze the results. The excellent consistency with experimental results can promote the feasibility of MS theory in PI dielectric properties at high-frequency (10 Ghz). This innovative approach is anticipated to provide foldable chip fields with intrinsic biphenyl PI materials possessing low dielectric, low CTE, and high thermal stability.

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MACROMOLECULAR CHEMISTRY AND PHYSICS · 2024 ·Vol. 225 ·期 23 ·2400233 · IF 2.5

Highly Anti-Corrosive Performance of Poly(Vinylidene Fluoride-Hexafluoropropylene)/Boron Nitride Nanosheet/Polyimide Composite Coating

Lu Meng,Zexia Li,Weilong Wu,Bo Li,Zifeng Niu,Peng Wang,Jun Zhang,Chengchun Tang,Yanming Xue

Polyimide (PI) is one of the most important engineering plastics, but its stability in aqueous environments is insufficient, which limits its anti-corrosion efficiency. In this study, a novel P(VDF-HFP)/SMT-RS@BNNSs/PI composite coating is prepared by incorporating poly(vinylidene fluoride-hexafluoropropylene) (P(VDF-HFP)) and the exfoliated boron nitride nanosheets (BNNSs) which were highly co-functionalized with two kinds of materials of the rosin and the soy-maleic anhydride-tannic acid adhesive molecules (SMT-RS@BNNSs). The coatings are characterized in detail by using the XRD, FT-IR, XPS, and SEM technologies. Electrochemical impedance spectroscopy (EIS) and polarization curve tests further evaluated the corrosion resistance of the coating. As results, the obtained P(VDF-HFP)/SMT-RS@BNNSs/PI coating with good adhesion (grade 1) to the low-carbon steel plate displays a larger water contact angle of 93.10° compared to blank PI (75.5°) and SMT-RS@BNNSs/PI (83.2°). The dispersed distribution and interaction of SMT-RS@BNNSs can effectively reduce the phase separation between P(VDF-HFP) and PI. Even after soaking in electrolyte for 15 days, the impedance modulus, corrosion current, and corrosion voltage of the P(VDF-HFP)/SMT-RS@BNNSs/PI coating are 1.568 × 10 10 Ω cm 2 , 4.612 × 10 −12 A cm −2 , and 0.325 V, respectively. These properties are superior to those of the PI and SMT-RS@BNNSs/PI coatings. It is believed that the excellent anti-corrosive performance of this PI-based composite will broaden the application fields of PI materials.

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SEPARATION AND PURIFICATION TECHNOLOGY · 2024 · IF 8.1

Intrinsically microporous polyimide membranes with synergistic aromatic and alicyclic linking groups for efficient molecular separation

Shuang Guo,Chuanjie Fang,Jiaqi Li,Yongbing Zhuang,Liping Zhu

Polymers of intrinsic microporosity (PIMs) are widely recognized for having great potential in reforming membrane technology for molecular separation within organic solvents, due to their rich and appropriate pore structures with a size < 2 nm. However, the swelling in organic solvents has a significant effect on their pore structures due to the amorphous and linear nature, resulting in the permeability and selectivity performances of developed PIM membranes being far from ideal. In this work, we synthesized an advanced polyimide of intrinsic microporosity by integrating a Tröger’s base (TB) structure with an synergistic structure of aromatic (naphthalenediimide, NDI) and alicyclic (bicyclooctenediimide, BCODI) linking groups. The TB with a rigid and twisted structure was used to furnish a basis for inhibiting chain packing for high overall free volume. The ultra-rigid NDI units maintained such a tailored high free volume and provided superior solvent resistance. The relatively flexible and polar BCODI units promoted local chain mobility to tailor uniform pore size distribution and increased affinity for polar solvents. The innovative design fostered the formation of stable, uniform, and highly solvent-accessible intrinsic micropores. The prepared TFC membrane exhibited good organic solvent separation capabilities, achieving an ethanol permeance of 7.6 L m -2 h −1 bar −1 and a low molecular weight cut-off (MWCO) of approximately 470 Da. This work contributes significantly to the strategic design of PIMs for preparing high-performance membranes for realistic chemical-related separation application scenarios.

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Materials Today Physics · 2024 · IF 10

Lightweight and highly heat-resistant copolymerized polyimide foams for superior thermal insulation and acoustic absorption

Shuhuan Yun,Xianzhe Sheng,Zhenyu Xiong,Zhonglei Ma,Jianbing Qin,Guangcheng Zhang

The development of lightweight and highly heat-resistant polyimide foams (PIFs) remains a great challenge in areas of aerospace, military ships, transportation, and industries. Herein, a series of lightweight and highly thermal-resistant copolymerized PIFs are successfully fabricated by the “stepwise heating-holding” thermal foaming of the copolymerized polyester ammonium salts (C-PEAS), using 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (BTDA) and 2,3,3′,4′-biphenyl tetracarboxylic acid dianhydride (α-BPDA) as codianhydride, and p-phenylenediamine (PDA) as diamine. The introduction of α-BPDA increases the rigidity of PI molecule chains and foamability of C-PEAS, and significantly improves the heat resistance of PIFs. The resultant copolymerized PIFs exhibit ultra-low densities (<10 kg m −3 ), excellent heat resistance ( T g ranging from 351.2 °C to 405.6 °C), and high thermal stability. Moreover, they possess high flame retardancies (LOI>44 %) and low thermal conductivities (as low as 0.0463 W m −1  K −1 at 20 °C and no more than 0.0825 W m −1  K −1 at 200 °C), demonstrating their excellent thermal insulation properties in a wide temperature range. After the continuous heating at 200 °C for 40 min, the upper surface of PIFs present low average temperatures less than 60 °C. Additionally, the copolymerized PIFs exhibit remarkable acoustic properties with average acoustic absorption coefficients above 0.6 and noise reduction coefficients (NRC) above 0.3. Therefore, the lightweight and highly heat-resistant copolymerized PIFs show great application potentials in the extreme environments of aerospace, military ships, transportation, and industries.

CAS / MDL: 693-98-1
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INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH · 2024 · IF 3.8

Lightweight Porous Carbon Foams via Pyrolysis of Robust Polyimide Foams for Efficient Broadband Microwave Absorption

Cuiqing Zhou,Binbin Sun,Long Ni,Haichao Meng,Yinfu Luo,Mei Liang,Huawei Zou

The development of lightweight materials with ultrabroadband microwave absorption (MA) performance and excellent mechanical properties is significant for structural stealth electromagnetic wave-absorbing materials. Herein, the polyimide-derived carbon foams (CPIFs) were fabricated through a microsphere foaming method and a carbonization process for obtaining outstanding MA performance and mechanical property. The effects of carbonization temperature and prefoaming temperature on the pore size and MA property were investigated. The absorption bandwidth of CPIFs can reach an ultrabroadband absorption of 14 GHz, covering the whole X and Ku bands and most of the C band. The low-density CPIFs exhibited impressive compressive strength (0.47–0.64 MPa) and thermal insulation property with the thermal conductivity in the range of 0.061–0.104 W/m·K. The CPIFs’ lightweightedness, excellent MA, thermal insulation, and mechanical properties make them suitable to be used as a structural material with great application prospects in the fields of civil and military defense.

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COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING · 2025 · IF 8.9

Nano-/micron-scale synergistic toughening of carbon fiber/epoxy composites via interleaving co-polyimide film

Lili Zhang,Gong-qiu Peng,Deqi Jing,Ying-fen Wang,Shouchun Zhang

Carbon fiber/epoxy composites (CF/EP) are significant components of engineering materials in defense, aerospace and transportation field. Nevertheless, one of the main obstacles to improve mechanical strength of CF/EP is delamination. In this study, a kind of hydroxyl-functionalized block co-polyimide (BOH) filming as interleaves achieved multi-scale synergistic toughening, including reaction-induced phase separation structures at nano-scale and plastic deformation of BOH enrichment at micro-scale, which aims to improve the interlaminar fracture toughness of CF/EP composites effectively. As a result, mode I interlaminar toughness at initial (G IC-NL ) and at propagation (G IC-Prop ) of CF/EP laminates interleaved with 7 μm BOH film (CF-EP/BOH7) are increased by 126 % and 183 %, respectively. CF-EP/BOH7 laminates exhibit improvement of 206 % in mode II interlaminar toughness. This multi-scale toughening method initiates a new way for improving the interlaminar toughness of CF/EP composites.

CAS / MDL: 68-12-2 872-50-4
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Small · 2024 ·Vol. 20 ·期 44 ·2404104 · IF 13

Double-Phase-Networking Polyimide Hybrid Aerogel with Exceptional Dimensional Stability for Superior Thermal Protection System

Chun Liu,Mingkang Wang,Jing Wang,Guangyu Xu,Sizhao Zhang,Feng Ding

Polyimide aerogels have been extensively used in thermal protection domain because they possess a combination of intrinsic characteristics of aerogels and unique features of polyimide. However, polyimide aerogels still suffer significant thermally induced shrinkage at temperatures above 200 °C, restricting their application at high temperature. Here, a novel “double-phase-networking” strategy is proposed for fabricating a lightweight and mechanically robust polyimide hybrid aerogel by forming silica–zirconia-phase networking skeletons, which possess exceptional dimensional stability in high-temperature environments and superior thermal insulation. The rational mechanism responsible for the formation of double-phase-networking aerogel is further explained, generally attributing to chemical crosslinking reactions and supramolecular hydrogen bond interactions derived from the main chains of polyimide and silane/zirconia precursor/sol. The as-prepared aerogels exhibit excellent high-temperature (270 °C) dimensional stability (5.09% ± 0.16%), anti-thermal-shock properties, and low thermal conductivity. Moreover, the hydrophobic treatment provides aerogels high water resistance with water contact angle of 136.9°, further suggestive of low moisture content of 3.6% after exposure to 70 °C and 85% relative humidity for 64 h. The proposed solution for significantly enhancing high-temperature dimensional stability and thermal insulation provides a great supporting foundation for fabricating high-performance organic aerogels as thermal protection materials in aerospace.

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CHEMICAL ENGINEERING JOURNAL · 2025 · IF 13.2

Crown ether functionalized microporous polyimide membranes with hierarchical pore structure for enhanced Li+/Mg2+ separation

Zejun Song,Zhenggong Wang,Yanshao Yang,Jiaqi Zhang,Wangxi Fang,Jian Jin

Lithium, a highly sought-after element for various industries, is primarily sourced from salt-lake brines, where its extraction faces the critical challenge of separating Li + from high concentrations of Mg 2+ . In this work, we present a crown ether functionalized polymer membrane with a hierarchical pore structure, designed for highly selective Li + /Mg 2+ separation. By grafting 12-crown-4-ether onto a microporous polyimide, ether rings matching the size of Li + are incorporated within the interconnected intrinsic micropores, facilitating Li + permeation while restricting Mg 2+ transport. The addition of PEG4000 during membrane formation creates unconnected macropores, reducing effective membrane thickness while preventing pore linkages that could lead to Mg 2+ leakage. Consequently, the Li + permeation rate significantly increases from 0.0095nmol cm −1 s −1 to 0.257 nmol cm −1 s −1 , while Mg 2+ permeation remains low at 0.0014 nmol cm −1 s −1 , achieving a remarkable Li + /Mg 2+ selectivity of up to 184. This study offers a straightforward and efficient approach for developing Li + selective membranes for efficient lithium extraction.

CAS / MDL: 1122-58-3 25952-53-8
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ACS Applied Materials & Interfaces · 2024 · IF 8.3

Construction and Investigation of Novel Cross-Linked Fluorine-Containing Sulfonated Polyimide Membranes for VFB Application

Jun Long,Wenheng Huang,Huiting Li,Liang Chen,Jinchao Li,Jijun Chen,Aibing Lu,Yaping Zhang

Membrane with remarkable proton conductance and selectivity plays a key role in obtaining high vanadium flow battery (VFB) performance. In this work, the trade-off effect between proton conductance and vanadium ion blocking was overcome by the introduction of a cross-linking structure to prepare covalent cross-linked fluorine-containing sulfonated polyimide (CFSPI-PVA) membranes. Herein, the CFSPI-PVA-15 membrane possesses excellent comprehensive properties, including acceptable area resistance (0.21 Ω cm2), lower vanadium ion permeability (0.76 × 10–7 cm2 min–1), and remarkable proton selectivity (3.11 × 105 min cm–3) compared with the commercial Nafion 212 membrane. At the same time, the CFSPI-PVA-15 membrane exhibits higher coulomb efficiencies (97.26%–99.34%) and energy efficiencies (68.65%–88.11%) and a longer self-discharge duration (29.2 h) in contrast with the Nafion 212 membrane. Moreover, 500 cycles of the CFSPI-PVA-15 membrane at 160 mA cm–2 are also stably executed. The internal reasons for the improved chemical stability of the CFSPI-PVA-15 membrane are clarified from theoretical calculations with the mean square displacement value and fractional free volume. Therefore, the CFSPI-PVA-15 membrane exhibits great potential for application in VFB.

CAS / MDL: 108-39-4 1122-58-3
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