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ACS Applied Polymer Materials · 2023 · IF 5

Designing Interfacial Reaction for BN@Si/Poly(phenylene oxide) Composites with Simultaneous Improved Thermal Conductivity and Dielectric Properties

Yi Liu,Ling Yuan Liao,Wen Hong Ruan,Ming Qiu Zhang,Li Weihao

With the soaring development of device integration, miniaturization, and high frequency, electric devices have put forward synchronous and urgent requirements for thermal management composites with insulation, high thermal conductivity (TC), and low dielectric properties. However, due to phonon scattering and interfacial polarization, these performance requirements are difficult to meet simultaneously. In this work, based on the principles of interfacial engineering, hexagonal boron nitride (BN) was functionalized with methylvinyldimethoxysilane (MVDMS), and poly(phenylene oxide) (PPO) was modified by methacrylic anhydride. Owing to the introduction of reactive groups, the reaction between modified BN (BN@Si) and modified PPO (MPPO) in the mixing process enhances the interfacial forces, improves filler dispersions, and helps to reduce phonon scattering and interfacial polarization. The resulting polymer composites have a high TC of 5.21 W/(m K) at 70 wt % filler loading, 20.7 times than that of the pure MPPO resin, low dielectric loss of 0.00252, and high thermal stability. It is shown that interfacial regulation is crucial for BN@Si/poly(phenylene oxide) composites. The obtained composites hold great potential as thermal management materials for 5G electronic devices.

研究领域: 材料科学 · 复合材料 · 热管理 · 电子工程
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JOURNAL OF THE EUROPEAN CERAMIC SOCIETY · 2025 ·Vol. 46 ·期 6 ·118078 · IF 6.2

Bonding characteristics, electrical and microwave/terahertz dielectric properties of novel low-permittivity Li2CuP2O7 pyrophosphate ceramic for Sub-6G band applications

Xiangyu Xu,Wei Du,Xinwei Liu,Xu Zhou,Haitao Wu,Zhanbai Feng,Yuping Zhang

In this study, a novel low-permittivity Li 2 CuP 2 O 7 pyrophosphate ceramic with a monoclinic structure (space group C 2/ c ) was fabricated via solid-state reaction. The highest density was observed in Li 2 CuP 2 O 7 ceramic at 750 °C, leading to optimal dielectric properties: ε r = 4.81, Q×f = 65,826 GHz, and τ f = −25.89 ppm/°C. Lattice vibration characteristics were investigated via Raman and FT-IR spectroscopy, while the optical bandgap was determined through UV-Vis spectroscopy. Electrical properties were examined, and the migration mechanism of ions within this structure was further investigated. The P-V-L theory and the atomistic modelling results are in mutual agreement, collectively elucidating the relationship between structure and performance. The terahertz frequency response was also evaluated. Finally, a 5G-compatible patch antenna was developed using Li 2 CuP 2 O 7 ceramic, thereby validating its practical application potential in advanced communication systems.

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JOURNAL OF POLYMER SCIENCE · 2025 · IF 3.6

Double-Layer Architecture for Improving Mechanical and Dielectric Properties in Low-Dielectric Porous Polyimide Composites

Panpan Zhang,Ke Zhang,Ting Du,Shuliang Dou,Jiupeng Zhao,Yao Li

The high dielectric constant inherent to traditional polyimides (PIs) limits their ability to meet the demands of high-frequency circuit boards. The challenge of reducing this dielectric constant, while simultaneously preserving or enhancing the material's overall performance, is of critical theoretical and practical significance for advancing the use of PIs in the 5G communication sector. In this study, fluorinated graphene/polyimide (FG/PI) was employed as a reinforcing layer to fabricate a double-layer structure that enhances the mechanical and breakdown properties of low-dielectric PIs. PI porous composite films were developed using a layer-by-layer coating method, and their dielectric, mechanical, and thermal properties were investigated. The resulting double-layer PI films exhibited low dielectric constants and robust comprehensive performance. Specifically, the dielectric constants of the three films, PI-1, PI-2, and PI-3, were 2.01, 1.90, and 1.70, respectively, with corresponding tensile strengths of 42.69 MPa, 37.54 MPa, and 24.41 MPa, and breakdown strengths of 180.75 kV mm −1 , 138.70 kV mm −1 , and 89.77 kV mm −1 . These results underscore the importance of multi-layer structural designs in enhancing the breakdown resistance and mechanical properties of porous films, which are critical for the practical application of low-dielectric porous PI materials. Graphical The preparation process and properties of double-layer polyimide films.

CAS / MDL: 2421-28-5
研究领域: 材料科学 · 电气工程 · 高分子复合材料 · 纳米技术 · 通信技术
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EUROPEAN POLYMER JOURNAL · 2025 · IF 6.3

Design and synthesis of low dielectric constant polyimides based on fluorinated diamines with twisted triphenylmethane units and bulky side chains

Shu-Xiao Wang,Jia-Xin Li,Shan-Yuan Zhong,Qing Liao,Mei-Jin Lin

With the rapid advancement of 5G communication technology, the development of novel low-dielectric constant polyimides (PIs) as interlayer dielectric materials has become a key area of research. However, the development of fluorinated diamines with simple synthetic routes remains a challenge. In this study, a facile and efficient one-step synthetic strategy was employed to construct three novel fluorinated diamines with fully non-planar and twisted structures. The influence of fluorine content and different bulky side groups on the dielectric, thermal, and optical properties of the PIs based on these diamines was investigated. Notably, the increase in fluorine content and structural non-planarity significantly enhanced the dielectric properties and moisture resistance. Among the synthesized PIs, FPOPF-6FDA exhibited the most favorable performance, with a low dielectric constant ( D k  = 2.20 @ 10 8  Hz), low dissipation factor ( D f  = 0.00755 @ 10 8 Hz), low water absorption ( W A  = 0.89 %), and high hydrophobicity ( WC A  = 93.90°). Moreover, the non-planar and twisted fluorinated diamines did not compromise the thermal stability ( T d5  > 500 °C, T g  = 250.87–340.13 °C), optical transparency ( T 500  > 85.90 %), or solubility in organic solvents of these PIs. This work provides valuable insights into the molecular design and cost-effective synthesis of high-performance low-dielectric PIs.

研究领域: 材料科学 · 高分子化学 · 电子材料 · 介电材料 · 有机合成
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CHEMICAL ENGINEERING JOURNAL · 2022 · IF 16.744

Flexible nanocomposite paper with superior fire retardance, mechanical properties and electrical insulation by engineering ultralong hydroxyapatite nanowires and aramid nanofibers

Zhong-Yi Wang,Ying-Jie Zhu,Yu-Qiao Chen,Han-Ping Yu,Zhi-Chao Xiong

With the increasing popularity of modern electronic devices in the fifth-generation (5G) era, high-performance and high-safety electrically insulating materials with good mechanical flexibility and strength, high thermal stability and fire resistance are urgently needed. Herein, we report a highly flexible, thermally stable, and fire-retardant nanocomposite paper with high dielectric breakdown strength and mechanical strength by synergistically integrating one-dimensional ultralong hydroxyapatite (HAP) nanowires and aramid nanofibers (ANFs) through the vacuum-assisted filtration process. The as-prepared HAP/ANF nanocomposite paper has a nanowire/nanofiber networked framework and a layered structure, and exhibits high tensile strength (73.5 MPa), fracture strain (7.4 %), folding durability (1396 times under a loading weight of 9.8 N), excellent flexibility, and good processibility. Notably, the HAP/ANF nanocomposite paper has a superior dielectric breakdown strength (92.4 kV mm −1 ), high thermal stability and flame retardancy in comparison with the commercial Nomex T410 electrical insulation paper. The multifunctional HAP/ANF nanocomposite paper is promising for applications in miniaturized and flexible electronic devices, high-voltage electrical insulation equipments, and fire-retardant and high-temperature fields.

CAS / MDL: 67-68-5 112-80-1
研究领域: 材料科学 · 电气工程 · 纳米技术 · 消防安全工程
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JOURNAL OF THE EUROPEAN CERAMIC SOCIETY · 2023 · IF 5.7

Simultaneously enhanced thermal conductivity and dielectric properties of borosilicate glass-based LTCC with AlN and h-BN additions

Shuquan Yang,Lan Zhang,Meihui Xiao,Lin Chen,Jun Sun,Jianjun Ding,Xiaoxiao Li,Yi Gong,Kang Zheng,Xian Zhang,Xingyou Tian

Microwave devices with reduced dielectric loss and electronic components with increased integration density necessitate the higher performance of electronic packaging materials. The h-BN/AlN/CaCO 3 -MgO-B 2 O 3 -SiO 2 -Li 2 CO 3 glass composites were prepared via tape-casting and then sintered by pressureless and hot-pressing, respectively. The thermal conductivity of pressureless sintered composite was increased to 6.55 W/(m·K) by incorporating 3 wt% h-BN, and the thermal expansion of 4.47 ppm/K was achieved along with low dielectric constant of 5.76 and dielectric loss of 7.02 × 10 −4 at 24 GHz. In contrast, the hot-pressing sintered composite containing 4 wt% h-BN exhibited higher thermal conductivity of 10.3 W/(m·K) and lower dielectric loss of 4.77 × 10 −4 . The microstructure characterization indicated the construction of heat conduction networks, and XRD analysis illustrated the formation of crystallization in the glass. Such low-temperature co-fired ceramic (LTCC) with high thermal conductivity and low dielectric loss would be a promising candidate for electronic packaging and 5G communication applications.

研究领域: 材料科学 · 电子工程 · 陶瓷工程 · 通信技术
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JOURNAL OF ALLOYS AND COMPOUNDS · 2023 · IF 6.2

Lightweight carbon fiber hybrid film for high-efficiency electromagnetic interference shielding and electro/photo-thermal conversion applications

Senpeng Ning,Mingjie Wang,Shilu Luo,Gui Yang,Yuezhan Feng,Fengmei Su,Youxin Ji,Chuntai Liu

Enormous electromagnetic pollutions emerge with the rapid development of electronic technique, high-performance electromagnetic interference (EMI) shielding composites are greatly desired to protect human and precision instruments from electromagnetic interference. Here we fabricated a lightweight, porous carbon fiber felt/Ag/polydimethylsiloxane (CFF/Ag/PDMS) composite film via electroless plating and dip-coating method. The obtained homogenously distributed Ag nanoparticles on the surface of carbon fibers and the porous structure of CFF endow the film with excellent electrical conductivity and superior EMI shielding effectiveness (EMI SE). The maximum electrical conductivity and EMI SE value of the composite film with a thickness of 0.21 mm reach 540.9 S/cm and 105 dB at 8.2–12.4 GHz (X-band), respectively. Benefitting from the encapsulation of PDMS, the composite film exhibits outstanding corrosion resistance and oxidation resistance . Particularly, the composite film also exhibits excellent electro/photo-thermal conversion effect with outstanding heating controllability, cyclic stability, which shows great potential in 5 G communication technology and thermal management.

CAS / MDL: 7761-88-8
研究领域: 材料科学 · 电磁工程 · 纳米技术 · 热管理
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ACS Applied Polymer Materials · 2025 · IF 4.7

An Additively Manufactured Bionic Forest-like 3D Al2O3/Epoxy Architecture with Extraordinarily High Thermal Conductivity

Jingyi Chen,Ruyue Su,Xiaotong Chen,Rujie He

With the critical requirements for the heat dissipation of 5G electronics, highly thermally conductive ceramic/polymer composites are commonly utilized due to their high thermal conductivity, good electrical insulation, and superior processability properties. The shift from conventional two-dimensional (2D) planar structures to three-dimensional (3D) structures is currently the primary focus of enhancing the thermal characteristics. In this study, enlightened by the forest cooling principle of the urban edge, bionic forest-like 3D Al2O3 structures (3D-A) were designed by topological optimization algorithms as a theoretical basis and prepared by vat photopolymerization (VPP) additive manufacturing. After sintering and compositing with epoxy, a bionic forest-like 3D Al2O3/epoxy (3D-AE) composite architecture was obtained successfully. The 3D-AE architecture achieved an extraordinarily high thermal conductivity of 15.76 Wm1–K–1 when the ceramic filler was 40 vol %, representing a remarkable 7778.2% improvement compared to neat epoxy. Besides, a high-power light-emitting diode (LED) with the 3D-AE architecture as a cooling substrate was set together concurrently to investigate the heat dissipation capability. Finite element analysis and infrared thermal imaging further validated the superior heat dissipation capabilities of 3D-AE. From this study, a quick and efficient technique for designing and creating 3D ceramic/polymer composite structures with high thermal conductivity was put forth by integrating topology optimization theory with biomimetic concepts and additive manufacturing.

CAS / MDL: 13048-33-4 15625-89-5
研究领域: 材料科学 · 机械工程 · 电子散热 · 增材制造 · 复合材料 · 热管理
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ACS Applied Electronic Materials · 2025 · IF 4.7

Flexible Composite Films of Modified Carbon Nanotubes/MXene-Aramid Nanofibers with Electromagnetic Interference Shielding and Electrical Heating Performance

Yu-Han Wang,Wen-Hao Geng,Yue-Xin Wang,Ze-Long Bao,Xuan-Chen Liu,Jing-Yi Feng,Wen-Yi Sun,Wei-Wei Cao,Hong-Zhang Geng

Motivated by the advancement of 5G communication technology, electronic devices encounter the challenge of performance fluctuations when exposed to multiband electromagnetic radiation and subjected to temperature variations. Aiming at the problem of limited performance of single-component materials, this paper proposes a design strategy for synergistically enhanced composite films. Through the collaborative action of multiple components and modulation of multidimensional architectures, the performance limitations of functional materials are overcome. Caffeic acid (CA) is employed to modify the surface of multiwalled carbon nanotubes (MWCNTs), and a three-dimensional interconnected conductive network is assembled with MXene nanosheets. Through the hydrogen-bond interfacial strengthening effect, combined with aramid nanofibers (ANF) as the matrix, CA-MWCNTs/MXene-ANF composite films are prepared. This composite film retains excellent mechanical properties with a tensile strength of 49.5 MPa and an elongation at break of 6.4%, exhibits an electromagnetic shielding effectiveness of 46 dB in the X-band, and possess a rapid electrothermal response capability, achieving a temperature increase from room temperature (25 °C) to 169 °C within 10 s when powered by a low voltage of 3 V. It overcomes the performance limitations resulting from the nonuniform dispersion of conventional fillers and poor interfacial adhesion. These advantages endow it with significant potential in diverse fields such as smart wearables, aerospace engineering, flexible electronics, and medical applications.

CAS / MDL: 67-68-5
研究领域: 材料科学 · 纳米技术 · 电磁兼容 · 聚合物复合材料 · 柔性电子
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COMPOSITES PART B-ENGINEERING · 2022 · IF 11.322

Cost-effective graphite felt and phosphorous flame retardant with extremely high electromagnetic shielding

Zhenting Yin,Wei Cai,Jingyi Lu,Bin Yu,Bibo Wang,Lei Song,Yuan Hu

With the advent of the 5G era, preparing conductive polymers to accomplish electromagnetic interference (EMI) shielding, mechanical enhancement, and flame retardancy are of vital importance. Graphite felt (GF) acts as a three-dimensional structure and organophosphorus derivatives containing different valences work as a flame retardant to form a novel EP composite. With GF incorporated into EP, EMI shielding effectiveness (SE) achieves around 60 dB, and absorption is dominated in the X band (8.2–12.4 GHz). Meanwhile, GF could exert a fiber reinforcement effect to enhance the mechanical properties of EP composites, tensile strength and impact strength of EP/GF are increased by 19.1% and 64.2%, respectively. However, owing to the “wick effect” of GF, 20 wt% DOPO-PEPA is added to acquire flame-retardant EP composites. Herein, a potential strategy broadens applications of EP composites in the high-end field and is provided to prepare polymer composites .

研究领域: 材料科学 · 电气工程 · 复合材料
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JOURNAL OF MATERIALS SCIENCE · 2022 ·Vol. 57 ·期 2 ·1156-1173 · IF 4.682

Functionalized mesoporous silica liquid crystal epoxy resin composite: an ideal low-dielectric hydrophobic material

Feng Zhiqiang,Liu Xiaohong,Zhang Wenchao,Zeng Juanjuan,Liu Jiaming,Chen Bifang,Lin Jiaming,Tan Liqin,Liang Liyan

The field of microelectronic devices and 5G communication has an increasing demand for polymer composites with low dielectric constant, low dielectric loss, and good hydrophobicity. However, traditional polymer composites cannot simultaneously satisfy them, which severely hinders their application. In this work, a liquid crystal epoxy resin (LCE 4 ) consisted of a flexible chain and rigid mesogenic unit was prepared and cured with methylhexahydrophthalic anhydride (MHHPA). And the mechanism of the curing reaction and the phase structure of the liquid crystal epoxy resins were investigated. In addition, dielectric hydrophobic liquid crystal epoxy nanometer composite materials were successfully prepared with functionalized mesoporous silica (SBA-15) as a filler. The results showed that pure LCE 4 exhibited excellent dielectric properties and thermal stability. Compared with pure LCE 4 , the composite material for SBA-15 modified with KH560 displayed lower dielectric constant, lower dielectric loss, higher glass transition temperature, and better hydrophobicity. For example, with a 0.5 wt% SBA-15, the dielectric constant and dielectric loss of the composite material were as low as (2.35, 0.025) compared with pure LCE 4 (3.25, 0.036) that was reduced by 24.7% and 31%. In addition, the glass transition temperature and water contact angle are increased by 16 °C and 14°, respectively. Composites also showed good thermal stability and mechanical properties. The reasons may mainly be derived from the internal structure of LCE 4 , the effective modification of mesoporous SBA-15 by KH560, and the excellent dispersion of organic and inorganic phases. Graphical abstract

研究领域: 材料科学 · 高分子化学 · 电气工程 · 纳米技术
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JOURNAL OF THE AMERICAN CERAMIC SOCIETY · 2023 ·Vol. 107 ·期 2 ·704-718 · IF 3.9

Novel microwave dielectric ceramics based on CaO–MoO3–La2O3 pseudo-ternary phase diagram and the design of patch antenna

Jian Bao,Wei Du,Haitao Wu,Zhenxing Yue

In this study, two novel microwave dielectric ceramics were designed and synthesized using the solid-state reaction method based on the CaO–MoO 3 –La 2 O 3 pseudo-ternary phase diagram. The X-ray diffraction (XRD) patterns and Rietveld refinement results indicate that pure phase microwave dielectric ceramics (CaLa 2 (MoO 4 ) 4 and Ca 3 MoO 6 ) can be produced with CaO, MoO 3 , La 2 O 3 ratios of 1, 1, 4, and 3, 1, 0, respectively. CaLa 2 (MoO 4 ) 4 shows the potential value for application in Low Temperature Co-fired Ceramic technology. In addition, the Phillips–van Vechten–Levine theory, infrared reflectance spectrum, and THz time-domain spectrum are used further to study the structure-property relationship of the two ceramics. Finally, a 5G patch antenna used in Sub-6 GHz communication technology was successfully designed and manufactured. The study of the relationship between chemical bonds and dielectric properties of the two ceramics, along with the development of the patch antenna, establishes a foundation for scientific research and practical applications in related ceramic systems.

研究领域: 材料科学 · 陶瓷 · 电磁工程 · 电信
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