CHEMOSPHERE
·
2024
·
IF 8.1
Jia-Xin Dai,Yanshuang Yu,Le-Xing You,Hong-Lin Zhong,Yuan-Ping Li,Ai-Jun Wang,Jon Chorover,Ren-Wei Feng,Hend A. Alwathnani,Martin Herzberg,Christopher Rensing
Although the antimicrobial mechanisms of nanomaterials have been extensively investigated, bacterial defense mechanisms associated with AgNPs have not been fully elucidated. We here report that dissolved Ag + (>0.05 μg mL −1 ) displayed higher toxicity on cell growth of strain Cupriavidus metallidurans BS1 (GCA_003260185.2) in comparison to 2 and 20 nm AgNPs. The genes necessary for synthesis of distinct abundance and composition of extracellular polymeric substances (EPS) were induced in strain BS1 exposed to Ag stress. This resulted in 20.1% (Ag(I)-EPS) and 24.2% (2 nm AgNPs-EPS) of the C O band integrated intensities being converted into C-OH/C-O-C group vibrations and the Ag-O bond was formed between EPS and 20 nm AgNPs. Meanwhile, the expression of primary resistance genes of the cus, sil and cup operon encoding HME-RND-driven efflux systems as well as a P IB1 -type ATPase (CupA) were significantly induced after exposure to Ag(I), 2 and 20 nm AgNPs, respectively. Furthermore, distinct genes involved in biosynthesis pathways responsible for production of EPS were induced to relieve the toxicity of Ag(I), 2 nm and 20 nm AgNPs. This combined action is one potential reason why strain BS1 displayed distinct resistances in response to Ag(I) compared to 2 and 20 nm AgNPs. This work will help in understanding processes important in bacterial defensive mechanisms to AgNPs.
研究领域:
微生物学
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环境科学
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产品关联
DOI
PubMed
高影响因子
Materials Research Express
·
2024
·Vol. 11
·期 5
·055002
·
IF 1.8
Siqi Quan,Guoyou Gan,Xiang lei Yu,Xian jie Tang,Hu Sun,Zhuo Qian,Junpeng Li
The investigation of conductive silver pastes and inks has witnessed extensive research within the domain of printed electronics in recent years, primarily owing to the exceptional electrical conductivity and steadfastness intrinsic to silver. This paper introduces an approach for the fabrication of stable, cost-effective, and low-resistance conductive silver paste tailored for flexible printed circuits. This method facilitates the solidification of the conductive silver paste into a highly conductive silver film at a curing temperature of 250 °C. In the process of preparing the conductive silver paste, Ag flakes is subject to modification through the incorporation of Ag NPs, which are subsequently sintered at a low temperature curing setting. The sintering of Ag NPs serves to establish connections between adjacent particles of Ag flakes within the paste, thereby enhancing the conductivity and flexibility of the resulting conductive printed silver film. When the ratio of Ag NPs to Ag flakes is maintained at 10:90, the volume resistivity of the Ag NPs-modified film registers at 2.7 × 10−5 Ω.cm. This demonstrates a substantial 53.45% reduction in the volume resistivity of the conductive printed silver film modified with Ag NPs, compared to its Ag NPs-absent counterpart. Post 200 cyclic bending tests, it becomes evident that the resistance change rate in the Ag NPs-modified conductive printed silver film is a mere 12.5%, whereas the Ag NPs-modified silver film lacking Ag NPs displays a resistance change rate of 21.5%. This discrepancy underscores the capacity of Ag NPs-modified Ag flakes to fortify the bending resistance of the conductive printed silver film. Comprehensive data analysis substantiates that the improvements in electrical conductivity and bending resistance can be attributed to the superior bridging facilitated by the sintering process on the surface of the Ag NPs-modified Ag flakes.
研究领域:
材料科学
·
印刷电子技术
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产品关联
DOI
高影响因子
JOURNAL OF SEPARATION SCIENCE
·
2017
·Vol. 40
·期 24
·4857-4864
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IF 2.557
Zhongping Huang,Yueting Xu,Yilei Huang,Charles Liu,Kezhi Jiang,Lili Wang
A novel method based on direct analysis in real time integrated with mass spectrometry was established and applied into rapid determination of ginkgolic acids in Ginkgo biloba kernels and leaves. Instrument parameter settings were optimized to obtain the sensitive and accurate determination of ginkgolic acids. At the sample introduction speed of 0.2 mm/s, high intensity of [M–H] – ions for ginkgolic acids were observed in the negative ion mode by utilization of high-purity helium gas at 450°C. Two microliters of methanol extract of G. biloba kernels or leaves dropped on the surface of Quick-Strip module was analyzed after solvent evaporated to dryness. A series of standard solutions of ginkgolic acid 13:0 in the range of 2–50 mg/L were analyzed with a correlation coefficient r = 0.9981 and relative standard deviation ( n = 5) from 12.5 to 13.7%. The limit of detection was 0.5 mg/L. The results of direct analysis in real time-mass spectrometry were in agreement with those observed by thermochemolysis gas chromatography. The proposed method demonstrated significant potential in the application of the high-throughput screening and rapid analysis for ginkgolic acids in dietary supplements.
研究领域:
分析化学
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植物化学
✓ 已验证
DOI
PubMed
高影响因子
Materials Research Express
·
2020
·Vol. 7
·期 10
·105001
·
IF 1.929
Lin Tang,Guoyou Gan,Xianglei Yu,Chengbin Liu,Junhua Cheng
Due to the high conductivity and stability of silver, silver ink has been widely used in the field of printed electronics. However, since mechanical strain would cause the contact between key particles to be broken. Recently, higher requirements have been put on the bending resistance of silver paste. In this experiment, by preparing Ag NPs: Ag Flakes composite materials of 20:80 and 30:70 respectively, a new method for preparing stable modified flake silver powder is proposed, and the attachment and growth methods of Ag NPs reduced on micron flake silver powder is discussed. Flake silver powder, dispersant and reducing agent are added to the silver-ammonia complex, and the nano-silver particles are reduced on the flake silver powder by controlling the reaction conditions. When Ag+: Ag Flakes in the solution is 30:70, there is a clear interface between the silver particles and the silver flakes, and the size distribution range is between 10 and 100 nm; when Ag+: Ag Flakes is 20:80, the distance between the nano-silver particles and the silver plate crystal plane is about 0.222 nm and 0.260 nm, these spacings represent the (1–12) and (004) planes of Ag, respectively. The reduced silver particles grow on the surface of the silver sheet, the size is about 5 ∼ 60 nm, and form a sheet-point combination of shaped silver powder, which can be used to make conductive silver paste with cost and performance competitiveness. The reaction can be completed at room temperature (5 ∼ 25 °C) and atmospheric pressure (80 ∼ 100 kPa), the operation is simple, the reaction time is short, and it has a positive effect on the commercial production of printable highly conductive silver paste.
研究领域:
材料科学
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纳米技术
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电子材料
✓ 已验证
DOI
高影响因子
MATERIALS RESEARCH BULLETIN
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2018
·
IF 2.873
Zhuanni Yu,Mengmeng Xu,Qiang Wang,Xiaowei Sun,Jing Lan
An efficient semiconductor composite, silver/silver orthophosphate/silver bromide, was successfully synthesized by a facile one-step reduction and ion exchange process. Its crystal structure, morphology, optical property, surface element composition were characterized by X-ray diffraction, scanning electron microscopy, ultraviolet-visible diffuse reflectance spectrometer and X-ray photoelectron spectrometer. The effects of composite proportion and synthesis duration on performances of as-prepared photocatalysts were investigated, and the results showed that Br/P molar ratio of 3 and the synthesis duration of 4 h were the optimum conditions. The radical scavenging experiments indicated that the hole and superoxide radical were the main active species in this reaction system. The Ag/Ag 3 PO 4 /AgBr-3 presented excellent stability and recyclability, maintaining 92% of degradation efficiency after 5 cycles. The good photocatalysis performance could be attributed to the formation of the heterojunction between Ag and Ag 3 PO 4 /AgBr.
研究领域:
材料科学
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环境科学
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产品关联
DOI
高影响因子
CHEMICAL ENGINEERING JOURNAL
·
2025
·
IF 13.2
Jing Sun,Yalei Mei,Weiliang Bai,Li Han,Yuqiang Li,Yuzhong Gao,Ming-Fei Lang,Hongsheng Xue
Flexible sheet reference electrodes play a crucial role in both flexible electrochemical biosensors and electrophysiological monitoring. Enhancing electrode stability and extending continuous operational lifespan are key issues in the research of flexible sheet reference electrodes. In this study, a novel flexible Ag/AgCl sheet reference electrode was fabricated by semi-embedding nano-silver dendrites within a polydimethylsiloxane (PDMS) matrix. The flexible Dendritic Ag/AgCl quasi-reference electrodes showed comparable stability of open circuit potential to commercial glass reference electrodes, with a single continuous stable operation time exceeding 12 h and sustained stable operation for at least 30 days when operated continuously for 1 h per day. Additionally, the shelf life was significantly extended to at least 1 year. An in-depth exploration of its mechanism reveals that the embedding strategy plays a crucial role. It strengthens the tight connections between silver dendrites, forming a robust and stable conductive network that ensures rapid and stable charge transfer. Furthermore, the strong adhesion between silver dendrites and PDMS greatly enhances its mechanical durability. This electrode exhibits high practical value in electrophysiological monitoring such as electroencephalogram and electrocardiogram, as well as in flexible sensor applications for H 2 O 2 sensing in pleural effusions, opening new pathways for advancements in flexible wearable devices and biomedical sensor technologies.
研究领域:
生物医学工程
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材料科学
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传感器技术
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2014
·
IF 5.9
Yuyu Bu,Zhuoyuan Chen
Polyaniline/silver/silver phosphate (PANI/Ag/Ag3PO4) composite was prepared by in situ depositing silver phosphate (Ag3PO4) nanoparticles on the surface of polyaniline (PANI). The best photocatalytic Rhodamine B degradation performance is obtained by the 20 wt % PANI/Ag/Ag3PO4 composite, which is approximately 4 times higher than that of pure Ag3PO4. Meanwhile, the photocatalytic stability of Ag3PO4 is significantly improved by introducing PANI into the PANI/Ag/Ag3PO4 composite. The dramatic promotion of the photocatalytic degradation performance and the photocatalytic stability can be attributed to the formation of a heterojunction electric field between PANI and Ag3PO4, which is approximately 90 mV and points from Ag3PO4 to PANI. The existence of this electric field can dramatically enhance the separation efficiency of the photogenerated electron–hole pairs, accelerate the transfer of photogenerated holes from Ag3PO4 to PANI and therefore inhibit the self-oxidation of Ag3PO4.
研究领域:
材料科学
·
环境科学
✓ 已验证
DOI
PubMed
高影响因子
CRYSTENGCOMM
·
2025
·
IF 2.6
Yi-Chen Guo,Xiao-Gang Liao,Qi Wu,Yu-Xuan Hao,Zi-Hao Wang,Wen-Yan Zhang,Yao-Yu Wang
Enhancing the conductivity of silver paste is crucial for achieving high photoelectric conversion efficiency of heterojunction solar cells. In this work, 1-tetradecanol-coated Ag2O was used as a silver precursor, replacing nano-silver powder in the conventional silver paste. Low-temperature sintering (200 °C) was utilized to establish a conductive pathway between flaky and spherical silver powder, resulting in a low-cost, low-temperature cured silver paste. The effect of 1-tetradecanol content on Ag2O was investigated, focusing on the electrical conductivity, silver paste rheological properties and adhesion properties of low-temperature cured silver paste film layers. The results showed that the volume resistivity of the paste containing 1-tetradecanol (10 wt%)-coated Ag2O after sintering at 200 °C for 30 min was 7.44 × 10−5 Ω cm, which was 35% lower than that of pure silver powder paste, indicating a significant enhancement in electrical conductivity. Furthermore, rheological performance tests demonstrated that the incorporation of Ag2O was an effective route for enhancing the thixotropy, recovery, and stability of the paste. Meanwhile, an adhesion experiment demonstrated that silver pastes with introduced Ag2O (≥5 wt%) exhibited a robust bonding to the ITO substrate under low-temperature curing, with an ASTM grade of 5B.
研究领域:
材料科学
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能源技术
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产品关联
DOI
高影响因子
ACS Omega
·
2022
·
IF 4.132
Qingxin Liu,Yinglan Wu,Min Feng,Wanmin Chen,Zhiping Zheng
Silver complexes with proteinogenic amino acid ligands are of interest for biomedical and antimicrobial applications. In this work, we obtained {[Ag7(l-his)4](NO3)3·3H2O}0.2{[Ag8(l-his)4(H2O)2](NO3)4·3H2O}0.8 (1) and {[Ag7(d-his)4](NO3)3·3H2O}0.2{[Ag8(d-his)4(H2O)2](NO3)4·3H2O}0.8 (2), which represent the first example of any Ag-exclusive complex featuring a cluster-type core motif and with only proteinogenic amino acid ligands. Upon immersion into acetonitrile, an interesting single-crystal-to-single-crystal transformation occurred to produce a new cluster complex of the formula [Ag8(l-his)4(NO3)(H2O)](NO3)3 (3). Using a racemic mixture of histidine, the reaction under otherwise identical conditions led to the production of the second example of a three-dimensional (3D) network structured Ag-exclusive complex with only a proteinogenic amino acid ligand. Compared with other Ag–histidine complexes in the literature, the significance of reaction conditions, particularly the Ag/histidine ratio and pH of the reaction mixture, is revealed. Temperature-dependent emission of 1 and 2 at 440 nm characteristic of silver–philophilic interactions was also observed.
研究领域:
无机化学
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生物医学
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材料科学
✓ 已验证
DOI
高影响因子
JOURNAL OF ELECTRONIC MATERIALS
·
2019
·Vol. 48
·期 5
·2745-2753
·
IF 1.676
Zhan Haijiao,Guo Jiayu,Shen Jiali,Wang Xiaorong,Fan Zhonghua,Guo Bing,Liu Wei,Shen Hangyan
Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μ m to 1.5 μ m and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × 10 −6 Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance.
研究领域:
材料科学
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纳米技术
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电子工程
·
应用化学
·
先进制造
✓ 已验证
DOI
高影响因子
MICROELECTRONICS RELIABILITY
·
2022
·
IF 1.418
Hao Liu,Jiahao Liu,Shaoan Wang,Zezhu Jin,Shuyan Zhu,Rui Ma,Weiwei Zhang,Jianqiang Wang,Jin Li,Chengliang Song,Shuye Zhang,Hongtao Chen
The morphology and content of the silver fillers, resin matrix composition and curing process could significantly affect performance properties of electrically conductive adhesives (ECAs). In this study, the effects of silver nano-particles (NPs) and nano-wires (NWs) were studied on the properties of ECAs, which are under the same curing and aging conditions varied with three kinds of fillers: the mixture of silver micro flakes and NPs at a mass ratio of 17:3, the mixture of silver micro flakes and NWs at a mass ratio of 19:1, and the pure silver micro flakes as the reference sample. Results show that silver NPs might cause the deterioration of electrical conductivity and thermal conductivity in ECAs with the filler weight fraction of 70 wt%, because segregation of silver NPs might increase the average distance between silver micro flakes; but silver NPs could improve the performance properties of ECAs at a filler loading of 85 wt% especially after 200 °C aging. Silver NWs could reduce bulk resistivity of ECAs with the filler weight fraction of 70 wt% from 2.5 × 10 −3 Ω·cm to 1.8 × 10 −4 Ω·cm. In addition, thermal conductivity and shear strength of ECAs seemed irrelevant to the filler morphology but only correlated positively and negatively with filler loading ratio respectively.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2019
·Vol. 30
·期 6
·5526-5535
·
IF 2.195
Yang Fan,Hu Bo,Peng Ye,Hang Chunjin,Chen Hongtao,Lee Changwoo,Wei Jun,Li Mingyu
A silver (Ag) composite paste was fabricated based on Ag nanoparticles (NPs) and Ag microflakes (MFs). Robust interconnections were achieved after sintering in the temperature range of 150–225 °C. The shear strengths of the Ag MF + NP joints before and after thermal shock from − 50 to 150 °C for 1000 cycles were 155.7 ± 14.5 MPa and 78.4 ± 20.8 Mpa, respectively. The results show that the Ag composite paste not only has similar sintering properties to the Ag NP pastes but also exhibited superior mechanical reliability due to the addition of the Ag MFs. In addition, the sintered properties of different Ag pastes were discussed in terms of the coating organics, thermal behaviour and microstructure. The fracture modes after the shearing tests were analysed in detail. The Ag composite paste provides a potential solution for high-temperature applications.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子