D2607620计算溶液所需的质量、体积或浓度。
SYLGARD® 170 灌封胶
有货
为什么选择此级别
，适用于对基线干扰要求严格的色谱和分析工作流程。
储存与运输
室温。常规运输 。请查阅批次 COA 获取详细规格。
质量文档
SDS、COA、产品数据表及规格说明书均可下载。可通过批号查询获取批次 COA。
文献证明
在色谱分析、有机合成和交叉偶联反应领域已被 0 篇同行评审文献引用。
概述
1EA=500g (part A)+500g (part B)
组成：Black liquid (part A), off-white liquid (part B), Viscosity: 3160 cPs (part A), 1110 cPs (part B)
特性
两部分：1：1 混合比例（预称重）。
低粘度。
室温或加热加速固化。
快速、通用的固化过程受温度控制。
中等导热率。
增强了在狭窄的空间和复杂的几何形状周围的流动性和填充性能。
在坚硬、刚性封装材料可能在热循环过程中造成损坏的应用中提供应力消除。
它可以考虑用于需要增加阻燃性和军用规格的应用。
如何使用
混合：SYLGARD® 170 灌封胶在双注射器涂抹器中提供，带有由 A 部分和 B 部分组成的静态混合器。将两种成分（预称重）在注射器涂抹器中以 1：1 比例混合，应充分混合直到混合物颜色均匀。建议使用真空除气。在 5-10 分钟内施加 10-20 mmHg 的残余压力将对材料充分除气。
固化：SYLGARD® 170 灌封胶应使用以下推荐的时间表之一进行固化：
25°C，24 小时或
70°C，25 分钟或
100°C，10 分钟。
大型部件和组件可能需要更长的时间才能达到固化温度。
某些化学药品、固化剂和增塑剂会抑制固化。这些包括：
有机锡化合物。
含有机锡催化剂的硅橡胶。
硫、多硫化物、聚砜和其他含硫物质。
胺、氨基甲酸酯、酰胺和叠氮化物。
对于大多数应用，硅橡胶型灌封胶应在 -45 至 200°C（-49 至 392°F）的温度范围内长时间运行。
应用
SYLGARD® 170 灌封胶适合用作密封剂或灌封材料。
潜在应用：
电源
连接器
传感器
工业控制
变压器
放大器
高压电阻包
继电器
说明
混合和脱泡——本品以1：1比例混合的双组分形式提供，十分适合生产环境，比例可根据生产工艺和点胶设备的不同而变化。大部分情况下不需要进行脱泡。表面处理准备——当应用需要粘结性时，有机硅灌封胶需要使用底漆。为了达到最好效果，底漆漆层应尽量打薄、均一，然后抹去。使用底漆后应让底漆在空气中彻底干燥，再使用有机硅灌封胶。底漆的详细使用说明参见各底漆说明书(information sheet)。
加工/固化——道康宁(Dow)有机硅灌封胶在经过充分混合后，可直接注入/点胶至需要固化的容器中进行固化。要格外小心，尽量减少空气的混入。如果可行，特别是灌封和密封的元件有许多微孔时，应尽量在真空条件下灌胶或点胶。如果无法采用这项工艺，灌入/点入有机硅灌封胶后元件应进行真空脱泡处理。道康宁有机硅灌封胶既可以在室温(25°C/77°F)下进行固化，也可以加热固化。室温固化的灌封胶也可以通过加热加速固化。产品选择表中列有每种产品理想的固化条件。
适用期和固化速度——固化反应起始于混合过程。起初的固化现象是粘度逐步增加，接着开始出现凝胶，然后转变为固体弹性体。适用期(Pot life)的定义是组分A和B（主剂与固化剂）混合后，粘度翻倍的时间。大小高度依赖于温度和应用。
适用温度范围——对于大多数应用而言，有机硅灌封胶可在-45至 200°C（-49至392°F）的温度范围内长期使用。然而，在低温段和高温段的条件下，材料在某些特殊应用中所呈现的性能表现会变得非常复杂，因此需要考虑额外因素。应针对特殊的极端环境进行充分检测。就低温性能而言，虽然可能耐受-55°C (-67°F)下的热循环，但需要验证部件/配件的性能。性能影响因素包括元器件配置和应力敏感性、冷却速率和持续时间以及之前所经历的温度史。在高温段条件下，固化硅胶弹性体的耐久度取决于时间和温度。如预期所料，温度越高，材料的耐用时间越短。
相容性——某些材料、化学品、固化剂及增塑剂会抑制有机硅胶的固化。最需要注意的材料：有机锡和其他有机金属化合物、含有机锡催化剂的硅胶、硫、多硫化物、聚砜或其他含硫材料、不饱和烃类增塑剂和一些助焊剂残留。如果对某些表面或材料是否会导致抑制固化存在疑问，建议先进行小规模的相容性测试以确定它们在特定应用中的适用性。如果在有疑问的表面和已固化的有机硅胶界面上存在液体或未固化的产品，则说明相容性不好，可能会抑制固化。
1EA= 500g (part A) + 500g (part B).
Form: Black liquid (part A), off-white liquid (part B), Viscosity: 3160 cPs (part A), 1110 cPs (part B)
Features:
Two-part: 1:1 mixing ratio (pre-weighed).
Low viscosity.
Room temperature or heat accelerated cure.
Rapid, versatile cure processing controlled by temperature.
Moderate thermal conductivity.
Enhanced flow and fill in narrow spaces and around complex geometries.
Provides stress relief in applications where hard, rigid encapsulants can cause damage during thermal cycling.
It can be considered for uses requiring added flame resistance and Mil Spec applications.
How to use
Mixing: SYLGARD® 170 Silicone Elastomer is supplied in a dual syringe applicator with the static mixer consisting of Part A and Part B. The two components pre-weighed with 1:1 mixing ratio in the syringe applicator should be thoroughly mixed until the mixture has a uniform color. Vacuum de-airing is recommended. A residual pressure of 10-20 mmHg applied for 5-10 minutes will sufficiently de-air the material.
Curing: SYLGARD® 170 Silicone Elastomer should be cured using one of the following recommended schedules:
24 hours at 25°C or
25 minutes at 70°C or
10 minutes at 100°C.
Large components and assemblies may require longer times in order to reach the curing temperature.
Certain chemicals, curing agents and plasticizers can inhibit cure. These include:
Organo-tin compounds.
Silicone rubber containing organo-tin catalysts.
Sulfur, polysulphides, polysulphones and other sulphur containing materials.
Amines, urethanes, amides and azides.
For most uses, silicone encapsulants should be operational over a temperature range of -45 to 200°C (-49 to 392°F) for long periods of time.
Application
SYLGARD® 170 Silicone Elastomer is suitable for use as an encapsulant or potting material.
Potential applications
Power supplies
Connectors
Sensors
Industrial controls
Transformers
Amplifiers
High voltage resistor packs
Relays
Preparation Note
MIXING AND DE-AIRING - These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. In most cases de-airing is not required. PREPARING SURFACES - In applications requiring adhesion, priming will be required for many of the silicone encapsulants. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.
PROCESSING/CURING - Thoroughly mixed Dow silicone encapsulants may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/ dispensed. Dow silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure. Ideal cure conditions for each product are given in the product selection table.
POT LIFE AND CURE RATE - Cure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to a solid elastomer. Pot life is defined as the time required for viscosity to double after Parts A and B (base and curing agent) are mixed and is highly temperature and application dependent.
USEFUL TEMPERATURE RANGES - For most uses, silicone encapsulants should be operational over a temperature range of -45 to 200°C (-49 to 392°F) for long periods of time. However, at both the low- and high temperature ends of the spectrum, behavior of the materials and performance in particular applications can become more complex and require additional considerations and should be adequately tested for the particular end use environment. For low-temperature performance, thermal cycling to conditions such as -55°C (-67°F) may be possible, but performance should be verified for your parts or assemblies. Factors that may influence performance are configuration and stress sensitivity of components, cooling rates and hold times, and prior temperature history. At the high temperature end, the durability of the cured silicone elastomer is time and temperature dependent. As expected, the higher the temperature, the shorter the time the material will remain useable.
COMPATIBILITY - Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure gels. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasticizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
规格
别名
SYLGARD® 170 有机硅弹性体 | SYLGARD® 170 灌封胶 | PDMS | 固化剂 | 硅树脂 | 硅橡胶 | 聚二甲基硅氧烷
英文别名
Polydimethylsiloxane, Silicone, PDMS, Silicone rubber, Curing agent
英文名称
SYLGARD® 170 silicone elastomer
储存条件
室温
运输条件
常规运输
法律信息
Sylgard is a registered trademark of The Dow Chemical Company or an affiliated company of Dow
名称和识别符
分子类型
聚合物
技术文档
常见问题
本产品应如何储存？
请于室温条件下保存。
本产品如何运输？
本产品按常温标准条件运输，无需温控包装。
如何获取批次专用COA？
每个订单都会随附分析证书（COA），您也可以从账户订单历史中下载。如需订购前的COA，请联系您的客户代表，或使用PDP上的"申请COA"按钮——我们将提供代表性批次的COA。
产品仅提供给经过验证的企业、机构和合格的专业人员用于研发。不适用于人类、动物、诊断或治疗。
Copyright © 2023至今 上海阿拉丁生化科技股份有限公司 保留所有权利。
危险品化学品经营许可证（带存储）