计算溶液所需的质量、体积或浓度。
,适用于对基线干扰要求严格的色谱和分析工作流程。
室温。 。请查阅批次 COA 获取详细规格。
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在色谱分析、有机合成和交叉偶联反应领域已被 0 篇同行评审文献引用。
应用
在电子应用中可作为精确清洁地蚀刻钽、氮化钽和氧化钽薄膜和防蚀涂层的蚀刻溶液。
Description
Etchant solution for precise, clean etching of tantalum, tantalum nitride, and tantalum oxide thin films and resists in electronics applications
Preparation instructions
Etch times vary depending on material type (Ta, TaN, or Ta2O5) and purity.Dilute with water or lower the temperature to achieve a lower etch rate. Adding 1 part water to 2 parts etchant or reducing the temperature 10 °C will approximately reduce the etch rate by 50%.Parts to be etched should be placed in etchant solution with mild to moderate mechanical agitation.Tantalum Etchants contain hydrofluoric acid and will attack silicon oxides, titanium, nickel, aluminum, and chromium.Gold would be the ideal etch stop. You might also succeed with tungstenRinse with Deionized water.
H290: 可能腐蚀金属
H314: 造成严重的皮肤灼伤和眼睛损伤
H331: 吸入会中毒
H300+H310: 吞咽或皮肤接触致命
P262: 不要进入眼睛、皮肤或衣服。
P280: 戴防护手套/穿防护服/戴防护眼罩/戴防护面具。
P303+P361+P353: 如皮肤(或头发)沾染:立即脱掉所有沾染的衣服。用水清洗皮肤/淋浴。
P403+P233: 存放在通风良好的地方。保持容器密闭。
P301+P310+P330: 如果吞咽:漱口。立即致电中毒中心/医生。