The rapid development of the 5G communication technology requires the improvement of the thermal stability and dielectric performance of high-frequency copper clad laminates (CCL). A cyclic olefin copolymer (COC) resin was added to the original 1,2-polybutadienes (PB)/styrene ethylene butylene styrene (SEBS) binary resin system to construct a PB/SEBS/COC ternary polyolefin system with optimized dielectric properties, mechanical properties, and water absorption. Glass fiber cloths (GFCs) and SiO2were used to fill the resin matrix so to reduce the thermal expansion coefficient (CTE) and enhance the mechanical strength of the composites. It was found that the CTE of polyolefin/GFCs/SiO2composite laminates decreased with the increase of SiO2loading at first, which was attributed to the strong interfacial interaction restricting the segmental motion of polymer chains between filler and matrix. It was obvious that the addition of COC and SiO2had an effect on the porosity, as shown in the SEM graph, which influenced the dielectric loss (Df) of the composites directly. When the weight of SiO2accounted for 40% of the total mass of the composites, the laminates exhibited the best comprehensive performance. Their CTE and Dfwere reduced by 63.3% and 22.0%, respectively, and their bending strength increased by 2136.1% compared with that of the substrates without COC and SiO2. These substrates have a great application prospect in the field of hydrocarbon resin-based CCL.Keywords:polymer-based composites;substrate materials;dielectric properties;fillers
Dielectric materials play a crucial role in 5G communication technological applications such as printed circuit board (PCB) high-frequency substrate materials. Unfortunately, the fabrication of desirable dielectric performance in organic–inorganic composites is a great challenge because of lack of good interfacial compatibility and uniform dispersion between fillers and polymer. In this work, silicon dioxide (SiO 2 ) was synchronously functionalized by γ-methacryloxypropyltrimethoxysilane (MPS, s-SiO 2 ) and 1,2-polybutadiene (PB, v-SiO 2 ), which were then used as fillers to fabricate the s-SiO 2 /polyolefin or v-SiO 2 /polyolefin laminates. All the v-SiO 2 /polyolefin laminates exhibited better dielectric, thermal and mechanical properties than those of s-SiO 2 /polyolefin laminates under the same filler content. Specially, the 50 wt% v-SiO 2 /polyolefin laminate displays a low dielectric constant (3.42) and loss (3.55 × 10 -3 ) at 10 GHz. Meanwhile, it also shows good stability of dielectric properties in a wide range of high-frequency. This work is conducive to develop laminates with superior dielectric properties and apply to PCB high-frequency substrate field.
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