Front-side releasing suspended structures made using bulk micromachining processes have the advantages of simplifying vacuum or hermetic packaging processes and reducing squeeze-film damping. This paper studies the effect of doping concentration on the etching rate (ER) of the (111) plane. The experimental results show that increasing the boron doping concentration (but to less than the self-stop etching concentration) significantly increases the ER of the (111) plane and the ER ratio of the (111) and (100) planes. This phenomenon is used to speed up the undercutting and release <110> oriented clamped–clamped beams, which can be used as piezoresistive sensitive elements. The etching depth when the microbeams have just been released and the silicon wedges under single beams, double beams and triple beams disappear is deduced and verified by experiments. This has a certain guiding significance for designing piezoresistive sensors.
With the rapid development of electronics, additive manufacturing of complex three-dimensional microscale metal and alloy structures has emerged as one of the future directions for advanced technologies. In this study, a localized electrochemical deposition technique was developed which enables the fabrication of microscale three-dimensional metal structures in an ambient environment. Notably, we investigated the effects of voltage, initial electrode gap, and electrolyte composition on the deposition of Cu-Ni alloy. Furthermore, we successfully fabricated Cu-Ni equiatomic micro-columns, providing possibilities for the micro/nanoscale fabrication of commercial K-Monel copper. Finally, based on these foundations, we successfully shaped overhanging structures with various angles as well as an "H" structure using a rotating cathode substrate, demonstrating their potential in the fabrication of Cu-Ni alloy micro components.
危险品化学品经营许可证（带存储）