CHEMICAL PAPERS
·
2019
·Vol. 73
·期 8
·1863-1869
·
IF 1.246
Zhuang Huajian,Wang Chan,He Fufeng,Song Qijun
Brass is a metallic alloy that is made of copper and zinc and has a gold-like appearance. Tin coating could endorse the brass with yellowish up to silver-white color and improve its surface durability. In the present work, electroless plating of tin on the brass surface was investigated aiming to obtain a stable and controllable colored surface. In the presence of thiourea, the open circuit potential of brass (− 0.652 V) is more negative than that of tin (− 0.532 V), which makes the deposition of tin on brass feasible. The surface morphology and composition of the coatings were characterized by scanning electron microscope and energy dispersive spectrometer and the results indicated that a large number of tin clusters were formed on the brass surface. The amount of tin clusters determined the color of the coated surface, which can be facilely tuned by the plating time. The UV/Vis diffuse reflectance spectra were used for monitoring the changes of color at different plating time. The results show that there is a good linear correlation ( R 2 = 0.9948) between the absorbance and the plating time, which can be used to control the extent of tin plating on brass. Finally, the cross-cut test showed that the Sn particles were firmly coated on the brass substrate.
研究领域:
材料科学
·
电化学
✓ 已验证
产品关联
DOI
高影响因子
SOLID STATE SCIENCES
·
2024
·
IF 3.4
Liming Zhu,Dezhu Sun,Xuyang Li,Wei Liu,Jiaqiang Huang,Caihang Liang,Xiaokai Hu
Bismuth telluride and lead telluride are typical thermoelectric semiconductors that are metallized for electrical contacts before being assembled into devices. In this study, three iron-group metals of nickel cobalt iron, were chemically plated on n-type bismuth telluride as the prospective contact material for adhesion and barrier in soldering connection with copper. Aluminum was used as the sacrificial anode to ensure iron deposition. The sensitization in borohydride solution facilitated the subsequent plating of metals. The plating rates were determined by gravimetric method. The crystalline structure and morphology of films were characterized. Electrochemical polarizations were undertaken to compare the driving force among three plating reactions through the reduction of metallic cations and the oxidation of hypophosphite anions with the mixed potential theory. The heterojunction of bismuth telluride with copper was fabricated by reflow soldering with Sn 95 Sb 5 foil, and the interfacial resistivity was evaluated by multiple resistance measurements across the junction.
研究领域:
材料科学
·
电化学
·
热电学
✓ 已验证
DOI
高影响因子
LANGMUIR
·
2016
·
IF 3.993
Lei Zhao,Daqun Chen,Weihua Hu
Patterning metal films on various substrates is essentially important and yet challenging for developing a wide variety of innovative devices. We herein report a versatile approach to pattern metal (gold, silver, or copper) films on arbitrary substrates by using the bio-inspired polydopamine (PDA) thin film as a UV-sensitive adhesive layer for electroless deposition. The PDA film is able to be formed on virtually any solid surfaces under mild condition, and its rich catechol groups allow for electroless deposition of metal films with high adhesion stability. Upon UV irradiation, spatially selective oxidation of PDA film occurs and the local metal deposition is inhibited, thus facilitating successful patterning of metal films. Considering its versatility and simplicity, this strategy may demonstrate great applications in manufacturing various innovative devices.
研究领域:
材料科学
·
表面工程
·
纳米技术
✓ 已验证
产品关联
DOI
PubMed
高影响因子
ACS Applied Polymer Materials
·
2022
·
IF 4.855
Cheng-yuan Feng,Hai-jun Chen,Meng-yao Yang,Zhe-sheng Feng,Yan Wang
An economical and efficient strategy for fabricating high-performance metallic copper layers on polyphenylene sulfide (PPS) for high-frequency microwave applications via mussel-inspired surface modification and electroless copper plating (ECP) is illustrated in this paper. Through UV-induced surface modification of catechol (CA)/polyamine (PA), the modified PPS substrate is capable of adsorbing silver particles, which provides activation sites for subsequent ECP. The impact of CA/PA modification on the relationship between PPS and the deposited copper layer can be determined by water contact angle measurements, X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and tape peel tests. The involvement of CA/PA has successfully introduced the functional groups for chemical bonding on the PPS surface, which greatly improves the adhesion between the PPS and the deposited copper layer. Moreover, after 40 min of ECP, the produced copper layer exhibits good adhesion at the 5B level (according to the ASTM D3559) and an excellent conductivity of 0.37 S/m (approx. 62% of bulk copper). Meanwhile, the deposited copper layer also has good resistance to acid, alkali, and salt corrosion (less than 25 g/m2 per unit area weight loss after 60 h of corrosion). This approach opens up an efficient path for the surface metallization of PPS, which has a broad potential for application in high-frequency copper-clad laminates (CCLs).
研究领域:
材料科学
·
化学工程
✓ 已验证
产品关联
DOI
高影响因子
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
·
2021
·
IF 4.539
Dongxu Huang,Mingqi Huang,Deliang Sun,Bincan Liu,Rui Xuan,Jinshan Liu,Rong Sun,Jinhui Li,Guoping Zhang,Daquan Yu
The metallization of glass with high density and fine spacing possesses promising application in advanced package in 5 G. However, the adhesion strength between the copper and the smooth glass is still limited. In this paper, a feasible method is developed to prepare ZnO coating on the glass surface which served as an adhesive layer to provide a good anchors of copper layer by electroless copper plating. The results proved the adhesion strength of the copper layer is as high as 5B by grid adhesion test. Furthermore, diethoxy-methyl-(3, 3, 3-trifluoro-propyl)-silane was used to create an optional hydrophobic surface to accomplish a selective electroless copper plating pattern. The electroless copper plating is non-toxic, convenient, low economic cost and reliable and it is expected to realize promising application in system-in-package in the future.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
INTERNATIONAL JOURNAL OF HYDROGEN ENERGY
·
2021
·
IF 5.816
Anyin Chen,Liang Fu,Wenjun Xiang,Wei Wei,Dan Liu,Changlu Liu
It is essential to search highly active, steady and cheap non-noble electrocatalyst for hydrogen evolution reaction (HER). At present, nickel phosphides are extensively used in electrochemical hydrogen evolution due to its excellent stability and activity. Hence, we report a facile, effective and feasible strategy to synthesis of Ni 5 P 4 nanosheets/nanoparticles structure on carbon cloth, which was fabricated by electroless nickel plating on carbon cloth followed via straightforward thermal phosphidation treatment with NaH 2 PO 2 as phosphorus source. The as-prepared CC@Ni–P electrocatalyst exhibits HER activity with low overpotentials (93 mV vs. RHE) to attain current density 10 mA/cm 2 as well as small Tafel slope (58.2 mV/dec), which outperforms most nickel phosphides electrocatalysts. The excellent HER performance can be ascribed to the large electrochemically active surface area, and phosphorus-rich Ni 5 P 4 phase can supply further bridges sites of Ni and P. Significantly, as-prepared CC@Ni–P catalyst electrode exhibits no apparent HER activity decay after continuous stability test. Beyond that, the approach can be readily used to fabricate large size (5 × 5 cm) nickel phosphide electrocatalyst with excellent HER performance, which may be conducive to the proton exchange membrane (PEM) water electrolyser applications in future. This work opens an effective way to construct excellent performance transition-metal phosphides for HER.
研究领域:
材料科学
·
电化学
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2014
·
IF 5.9
Yu Chang,Chao Yang,Xin-Yao Zheng,Dong-Yu Wang,Zhen-Guo Yang
A novel patterning–adsorption–plating process to additively fabricate copper patterns is developed. Functional ink with ion-adsorption nanoparticles was inkjet printed on PET substrate to form the patterned adsorption film. Catalytic ion was adsorbed by amino groups in the adsorption film, and catalyzed the electroless plating of copper. The mercapto groups introduced to the film enhance the reliability of the patterns. Specific solvent used in the ink increase the surface roughness of the adsorption film, leading to a better adhesion of the patterns. The prepared copper patterns show excellent conductivity about the same with bulk copper and good adhesion on PET.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
·
2022
·
IF 5.518
Liying Qian,Duoduo He,Xiuhua Cao,Jun Huang,Junrong Li
Conductive fabric combines many advantages of fabric including durability, flexibility, and comfort, and has broad prospects in the field of wearable electronics. A multilayer silver deposition fabric with ultrahigh washability is prepared by combining 3 -mercaptopropytrimethoxysilane (MPTS) and N -acetyl- L -cysteine (NAC) in the fabrication process. Silver particles were deposited on polyester fabric (PETF) by electroless plating with glucose as a reducing agent. MPTS is grafted on PETF by condensation reaction to ensure that the first layer of silver is firmly deposited on the fabric. NAC with sulfhydryl and carboxyl groups is used as the binder between the next silver layers. NAC treatment of silver-plated fabric can not only eliminate the loosely attached silver particles on the fabric, but also increase the adhesion between the silver layers by sulfhydryl and carboxyl groups. The electrical resistance of the two-layer silver plated fabric (Ag 2 /M-PETF) is as low as 0.016 Ω sq −1 , which is only 2.06 Ω sq −1 after 500 washing cycles and 0.068 Ω sq −1 after 1000 friction cycles. Ag 2 /M-PETF also shows good hydrophobicity , mechanical properties and thermal stability.
研究领域:
材料科学
·
纺织工程
·
可穿戴电子技术
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2018
·
IF 8.097
Fu-Tao Zhang,Lu Xu,Jia-Hui Chen,Bo Zhao,Xian-Zhu Fu,Rong Sun,Qianwang Chen,Ching-Ping Wong
A new surface modification method is developed for electroless deposition of robust metal (copper, nickel, silver) layers on poly(dimethylsiloxane) (PDMS) substrate with strong adhesion. Under the synergies of the polydopamine (PDA), the plasma process enhances Ag+ reduction, and a thin Ag film is capable of tightly attaching to the PDMS surface, which catalyzes electroless deposition (ELD) to form robust metal layers on the PDMS surface with strong adhesion. Subsequently, a flexible and stretchable Cu-PDMS conductor is obtained through this method, showing excellent metallic conductivity of 1.2 × 107 S m–1, even at the longest stretch strain (700%). This process provides a successful strategy for obtaining good robust metal layers on PDMS and other polymer substrate surfaces with strong adhesion and conductivity.
研究领域:
材料科学
·
表面工程
✓ 已验证
DOI
高影响因子
ELECTROCHIMICA ACTA
·
2015
·
IF 4.504
Yu Chang,Yu Tao,Qun Zhang,Zhen-Guo Yang
A novel patterning-adsorption-plating process to additively fabricate conductive patterns and through-holes of double-sided flexible printed circuit is developed. Firstly, through-holes were drilled in substrate. Then ion-adsorption ink was dip-coated to form the adsorption film on the surfaces of substrate and through-holes. Mask was printed to expose the patterns and the through-holes. Afterwards, silver ion was selectively adsorbed to the exposed parts. Finally, after dissolving the mask, the patterns and the through-holes were metalized by electroless plating of copper. The ion-adsorption ink is composed of polysiloxane and solvent. The polysiloxane was prepared by hydrolyzing 3-aminopropyltriethoxy silane with 3-mercaptopropyltriethoxy silane together, thus the formed ion-adsorption film contains abundant amino and mercapto groups. Amino groups can adsorb silver ion by complexation. Mercapto groups increase the hydrophobicity of the adsorption film, improving the stability in alkaline solution. Special solvent used in the ink leads to the coarse adsorption film, so the mechanical anchor between the deposited copper and adsorption film is improved, resulting in a better adhesion. After 60 min plating, the copper patterns with 1.87 μm in thickness and 9.1 mΩ in square resistance was prepared, the adhesion can reach 5B. The prepared double-sided FPC shows high conductivity and adhesion, proving that PAP process possesses high potential in industrial production.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
MATERIALS & DESIGN
·
2018
·
IF 4.525
Li-Ping Wu,Ying-Zhan Li,Bi-Jia Wang,Zhi-Ping Mao,Hong Xu,Yi Zhong,Lin-Ping Zhang,Xiao-Feng Sui
Environmental-friendly cellulose-derived sponges were employed as porous templates to achieve uniform Ag deposition via a facile and economical electroless plating method. SEM and BET results confirmed an Ag layer was deposited on cellulose composite sponges without damaging the porous structure. XPS and XRD analysis demonstrated substantial interactions between porous substrates and Ag particles. When utilized as electromagnetic interference (EMI) shielding materials, a 3.2 mm thick silver-plated sponge exhibited a total shielding effectiveness ( SE total ) value of as high as 120.85 dB in the frequency range of 10–1500 MHz when the plating time was 120 min. Moreover, the conductive sponges displayed absorption-dominant mechanism to alleviate secondary radiation, making them promising candidates as high EMI shielding materials.
研究领域:
材料科学
·
环境科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
APPLIED SURFACE SCIENCE
·
2023
·
IF 6.7
Yuanming Chen,Shaorong Liang,Wei He,Shouxu Wang,Chong Wang,Zhuoming Du,Yongjie Du,Weiguo Yang,Binyun Liu,Yan Hong
A simple and chromium-free method for the metallization on engineering plastic polyamide-6 (PA6) by UV irradiation is proposed in this article. The surface graft polymers with specific adsorption activity are developed through one-step UV exposure operation, which captures Pd 2+ in the activation process. The chemisorption of Pd 2+ is further reduced into catalytic Pd 0 to enable the substrate with catalytic nucleus for conventional copper electroless deposition (ELD). The grafting layer and the deposited copper coating are characterized by Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, contact angle measurements, scanning electron microscopy, and X-ray diffraction. The results indicate that successful grafting occurs on PA6 after UV excitation. In addition, the as-deposited copper layer shows excellent conductive performance and high adhesion with the PA6 substrate. It’s expected that this emerging and feasible approach would have broad prospects for the metallization of plastic and offer significant value in the plating industry.
研究领域:
材料科学
·
表面工程
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）