CHEMICAL PAPERS
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2019
·Vol. 73
·期 8
·1863-1869
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IF 1.246
Zhuang Huajian,Wang Chan,He Fufeng,Song Qijun
Brass is a metallic alloy that is made of copper and zinc and has a gold-like appearance. Tin coating could endorse the brass with yellowish up to silver-white color and improve its surface durability. In the present work, electroless plating of tin on the brass surface was investigated aiming to obtain a stable and controllable colored surface. In the presence of thiourea, the open circuit potential of brass (− 0.652 V) is more negative than that of tin (− 0.532 V), which makes the deposition of tin on brass feasible. The surface morphology and composition of the coatings were characterized by scanning electron microscope and energy dispersive spectrometer and the results indicated that a large number of tin clusters were formed on the brass surface. The amount of tin clusters determined the color of the coated surface, which can be facilely tuned by the plating time. The UV/Vis diffuse reflectance spectra were used for monitoring the changes of color at different plating time. The results show that there is a good linear correlation ( R 2 = 0.9948) between the absorbance and the plating time, which can be used to control the extent of tin plating on brass. Finally, the cross-cut test showed that the Sn particles were firmly coated on the brass substrate.
研究领域:
材料科学
·
电化学
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产品关联
DOI
高影响因子
ANALYTICAL CHEMISTRY
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2024
·
IF 6.7
Chunjiao Qi,Jintao Chen,Yuhui Shang,Yu Yang,Kangyan Wang,Jinyang Chen
Point-of-care (POC) tests increasingly highlight the importance of portable, cost-effective, and visually quantitative detection of biomarkers. Herein, we developed a power-free and visual signal-readout POC sensor based on the target-triggered ultrafast gelation process. In the gelation process, the target triggered the cascade reaction catalyzed by oxidase and ferrous glycinate to produce carbon radicals that immediately initiated the rapid polymerization and cross-linking of acryloylated chondroitin sulfate and dimethylacrylamide. This highly efficient enzymatic polymerization process contributed to the ultrafast generation of chondroitin hydrogel within 1 min at 25 °C. The increase in viscosity of aqueous solution resulted from hydrogel formation was then visually measured according to the distance of solution migration on a tick-labeled pH test strip, which thus realized the quantification of a target. By utilizing glucose oxidase as an oxidase model during the gelation process, this POC sensor was successfully employed in the rapid quantitative detection of glucose without the need for any auxiliary instruments. Benefiting from the specificity and stability of the enzymatic polymerization reaction, the sensor exhibited excellent performance in the detection of glucose in clinical blood samples. Moreover, the sensor was further extended to uric acid detection and enabled accurate assay in clinical urine samples, which indicated the versatility and practicability of this sensor in the POC test.
研究领域:
生物化学
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医学诊断
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材料科学
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产品关联
DOI
PubMed
高影响因子
SOLID STATE SCIENCES
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2024
·
IF 3.4
Liming Zhu,Dezhu Sun,Xuyang Li,Wei Liu,Jiaqiang Huang,Caihang Liang,Xiaokai Hu
Bismuth telluride and lead telluride are typical thermoelectric semiconductors that are metallized for electrical contacts before being assembled into devices. In this study, three iron-group metals of nickel cobalt iron, were chemically plated on n-type bismuth telluride as the prospective contact material for adhesion and barrier in soldering connection with copper. Aluminum was used as the sacrificial anode to ensure iron deposition. The sensitization in borohydride solution facilitated the subsequent plating of metals. The plating rates were determined by gravimetric method. The crystalline structure and morphology of films were characterized. Electrochemical polarizations were undertaken to compare the driving force among three plating reactions through the reduction of metallic cations and the oxidation of hypophosphite anions with the mixed potential theory. The heterojunction of bismuth telluride with copper was fabricated by reflow soldering with Sn 95 Sb 5 foil, and the interfacial resistivity was evaluated by multiple resistance measurements across the junction.
研究领域:
材料科学
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电化学
·
热电学
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DOI
高影响因子
LANGMUIR
·
2016
·
IF 3.993
Lei Zhao,Daqun Chen,Weihua Hu
Patterning metal films on various substrates is essentially important and yet challenging for developing a wide variety of innovative devices. We herein report a versatile approach to pattern metal (gold, silver, or copper) films on arbitrary substrates by using the bio-inspired polydopamine (PDA) thin film as a UV-sensitive adhesive layer for electroless deposition. The PDA film is able to be formed on virtually any solid surfaces under mild condition, and its rich catechol groups allow for electroless deposition of metal films with high adhesion stability. Upon UV irradiation, spatially selective oxidation of PDA film occurs and the local metal deposition is inhibited, thus facilitating successful patterning of metal films. Considering its versatility and simplicity, this strategy may demonstrate great applications in manufacturing various innovative devices.
研究领域:
材料科学
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表面工程
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纳米技术
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产品关联
DOI
PubMed
高影响因子
ACS Applied Polymer Materials
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2022
·
IF 4.855
Cheng-yuan Feng,Hai-jun Chen,Meng-yao Yang,Zhe-sheng Feng,Yan Wang
An economical and efficient strategy for fabricating high-performance metallic copper layers on polyphenylene sulfide (PPS) for high-frequency microwave applications via mussel-inspired surface modification and electroless copper plating (ECP) is illustrated in this paper. Through UV-induced surface modification of catechol (CA)/polyamine (PA), the modified PPS substrate is capable of adsorbing silver particles, which provides activation sites for subsequent ECP. The impact of CA/PA modification on the relationship between PPS and the deposited copper layer can be determined by water contact angle measurements, X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and tape peel tests. The involvement of CA/PA has successfully introduced the functional groups for chemical bonding on the PPS surface, which greatly improves the adhesion between the PPS and the deposited copper layer. Moreover, after 40 min of ECP, the produced copper layer exhibits good adhesion at the 5B level (according to the ASTM D3559) and an excellent conductivity of 0.37 S/m (approx. 62% of bulk copper). Meanwhile, the deposited copper layer also has good resistance to acid, alkali, and salt corrosion (less than 25 g/m2 per unit area weight loss after 60 h of corrosion). This approach opens up an efficient path for the surface metallization of PPS, which has a broad potential for application in high-frequency copper-clad laminates (CCLs).
研究领域:
材料科学
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化学工程
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产品关联
DOI
高影响因子
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
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2021
·
IF 4.539
Dongxu Huang,Mingqi Huang,Deliang Sun,Bincan Liu,Rui Xuan,Jinshan Liu,Rong Sun,Jinhui Li,Guoping Zhang,Daquan Yu
The metallization of glass with high density and fine spacing possesses promising application in advanced package in 5 G. However, the adhesion strength between the copper and the smooth glass is still limited. In this paper, a feasible method is developed to prepare ZnO coating on the glass surface which served as an adhesive layer to provide a good anchors of copper layer by electroless copper plating. The results proved the adhesion strength of the copper layer is as high as 5B by grid adhesion test. Furthermore, diethoxy-methyl-(3, 3, 3-trifluoro-propyl)-silane was used to create an optional hydrophobic surface to accomplish a selective electroless copper plating pattern. The electroless copper plating is non-toxic, convenient, low economic cost and reliable and it is expected to realize promising application in system-in-package in the future.
研究领域:
材料科学
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电子工程
✓ 已验证
DOI
高影响因子
INTERNATIONAL JOURNAL OF HYDROGEN ENERGY
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2021
·
IF 5.816
Anyin Chen,Liang Fu,Wenjun Xiang,Wei Wei,Dan Liu,Changlu Liu
It is essential to search highly active, steady and cheap non-noble electrocatalyst for hydrogen evolution reaction (HER). At present, nickel phosphides are extensively used in electrochemical hydrogen evolution due to its excellent stability and activity. Hence, we report a facile, effective and feasible strategy to synthesis of Ni 5 P 4 nanosheets/nanoparticles structure on carbon cloth, which was fabricated by electroless nickel plating on carbon cloth followed via straightforward thermal phosphidation treatment with NaH 2 PO 2 as phosphorus source. The as-prepared CC@Ni–P electrocatalyst exhibits HER activity with low overpotentials (93 mV vs. RHE) to attain current density 10 mA/cm 2 as well as small Tafel slope (58.2 mV/dec), which outperforms most nickel phosphides electrocatalysts. The excellent HER performance can be ascribed to the large electrochemically active surface area, and phosphorus-rich Ni 5 P 4 phase can supply further bridges sites of Ni and P. Significantly, as-prepared CC@Ni–P catalyst electrode exhibits no apparent HER activity decay after continuous stability test. Beyond that, the approach can be readily used to fabricate large size (5 × 5 cm) nickel phosphide electrocatalyst with excellent HER performance, which may be conducive to the proton exchange membrane (PEM) water electrolyser applications in future. This work opens an effective way to construct excellent performance transition-metal phosphides for HER.
研究领域:
材料科学
·
电化学
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产品关联
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2014
·
IF 5.9
Yu Chang,Chao Yang,Xin-Yao Zheng,Dong-Yu Wang,Zhen-Guo Yang
A novel patterning–adsorption–plating process to additively fabricate copper patterns is developed. Functional ink with ion-adsorption nanoparticles was inkjet printed on PET substrate to form the patterned adsorption film. Catalytic ion was adsorbed by amino groups in the adsorption film, and catalyzed the electroless plating of copper. The mercapto groups introduced to the film enhance the reliability of the patterns. Specific solvent used in the ink increase the surface roughness of the adsorption film, leading to a better adhesion of the patterns. The prepared copper patterns show excellent conductivity about the same with bulk copper and good adhesion on PET.
研究领域:
材料科学
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电子工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
CELLULOSE
·
2018
·Vol. 25
·期 8
·4859-4870
·
IF 3.809
Zhang Chuanjie,Zhou Guangsheng,Rao Weida,Fan Lingling,Xu Weilin,Xu Jie
Abstract
Conductive fabrics have achieved significant attention in the field of wearable electronics. Herein, a novel and simple method was developed to fabricate nickel-coated cotton fabrics. Triazine groups were bonded onto the cotton fabrics through treating by cyanuric chloride solution to absorb silver ions and to form a catalytical layer on the fabrics, which could successfully initiate the subsequent electroless deposition (ELD) of nickel (Ni). The cyanuric chloride concentration and ELD time were optimized. Compared to conventional methods, superior conductivity as well as good adhesion was obtained because of the stable affinity of triazine groups to metals. The surface conductivity of the as-prepared Ni-coated fabrics was as high as 21.82 S cm −1 . The strain sensing properties of the Ni-coated fabrics were studied, demonstrating high sensitivity and rapid response. These attractive properties of the Ni-coated cotton fabrics suggest that the proposed method is expected to be used in the fabrication of wearable strain sensors. Graphical Abstract
研究领域:
材料科学
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纺织工程
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电子工程
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产品关联
DOI
高影响因子
MICROCHIMICA ACTA
·
2021
·Vol. 188
·期 11
·1-9
·
IF 5.833
Xia Yixuan,Ma Yuzhi,Wu Yuntao,Yi Yinhui,Lin Huiyu,Zhu Gangbing
A proof-of-principle concept for free-electrodeposited anodic stripping voltammetry (ASV) sensing of Cu 2+ is proposed by using Ti 3 C 2 T x MXene/carbon black (Ti 3 C 2 T x @CB) nanohybrids as electrode materials. Owing to the high adsorption and reduction capability of Ti 3 C 2 T x towards Cu 2+ , Ti 3 C 2 T x MXene enables Cu 2+ to be immobilized and self-reduced directly to form Cu 0 on the Ti 3 C 2 T x @CB electrode surface. As a result an oxidation peak current appears from the re-oxidation of Cu 0 via differential pulse voltammetry. Carbon black (CB) was introduced to prevent Ti 3 C 2 T x Mxene aggregation and improve the related electron transfer as well as enhance their surface area. After optimizing various conditions, a considerable low limit of detection (4.6 nM) and a wide linear range (0.01–15.0 μM) for Cu 2+ were achieved at the working potential from − 0.3 V to 0.0 V (vs SCE). Relative standard deviation (RSD) of eight individual Ti 3 C 2 T x @CB electrodes is 3.72%, and the recoveries from tap water sample and lake water sample were in the ranges of 97.0–108% and 104–107%, respectively. Graphical abstract
研究领域:
分析化学
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材料科学
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环境监测
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产品关联
DOI
PubMed
高影响因子
Nanomaterials
·
2019
·Vol. 9
·期 2
·185
·
IF 4.034
Junqi Tang,Quanhong Ou,Haichun Zhou,Limin Qi,Shiqing Man
A seed-mediated electroless deposition (SMED) approach for fabrication of large-area and uniform gold nanoparticle films as efficient and reproducible as surface-enhanced Raman scattering (SERS) substrates was presented. This approach involved a seeding pretreatment procedure and a subsequent growth step. The former referred to activation of polylysine-coated glass slides in gold seed solution, and the latter required a careful control of the reactant concentration and reaction time. With the aid of gold seeds and appropriate reaction conditions, a large-area and uniform nanofilm with evenly distributed gold nanoparticles (Au NPs) was formed on the surface of the substrates after adding a mixed solution containing ascorbic acid and trisodium citrate. The morphology of the Au nanofilm was examined by scanning electron microscopy. The size evolution of Au NPs on the surface of the substrates was analyzed in detail. The nanofilm substrate was prepared by reaction conditions of the seeded activation process: 10 mL ascorbic acid and trisodium citrate mixture and 30 min of soaking time, which exhibited an excellent uniformity and reproducibility of SERS enhancement with relative standard deviation (RSD) values of less than 8% (particularly, a RSD value of 3% can be reached for the optimized measurement). Compared to the common electroless deposition, the seed-mediated electroless deposition possessed inherent advantages in controllability, reproducibility, and economic benefit.Keywords:electroless deposition;nanoparticles;nanofilm;SERS;in situ chemical reduction
研究领域:
材料科学
·
分析化学
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产品关联
DOI
PubMed
高影响因子
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
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2022
·
IF 5.518
Liying Qian,Duoduo He,Xiuhua Cao,Jun Huang,Junrong Li
Conductive fabric combines many advantages of fabric including durability, flexibility, and comfort, and has broad prospects in the field of wearable electronics. A multilayer silver deposition fabric with ultrahigh washability is prepared by combining 3 -mercaptopropytrimethoxysilane (MPTS) and N -acetyl- L -cysteine (NAC) in the fabrication process. Silver particles were deposited on polyester fabric (PETF) by electroless plating with glucose as a reducing agent. MPTS is grafted on PETF by condensation reaction to ensure that the first layer of silver is firmly deposited on the fabric. NAC with sulfhydryl and carboxyl groups is used as the binder between the next silver layers. NAC treatment of silver-plated fabric can not only eliminate the loosely attached silver particles on the fabric, but also increase the adhesion between the silver layers by sulfhydryl and carboxyl groups. The electrical resistance of the two-layer silver plated fabric (Ag 2 /M-PETF) is as low as 0.016 Ω sq −1 , which is only 2.06 Ω sq −1 after 500 washing cycles and 0.068 Ω sq −1 after 1000 friction cycles. Ag 2 /M-PETF also shows good hydrophobicity , mechanical properties and thermal stability.
研究领域:
材料科学
·
纺织工程
·
可穿戴电子技术
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）