APPLIED SURFACE SCIENCE
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2015
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IF 2.711
Jiyun Zheng,Guogang Shu,Wei Wang,Qiulin Li,Wei Liu
Surface quality improvement by Cu activation and oxidation roughening process was studied during electroless coating Cu on boron carbide (B 4 C) particles. The surface morphology was characterized by scanning electron microscope (SEM) and the phase identification was determined by X-ray diffraction (XRD) analysis. Two aspects concluding surface activation and surface roughening were investigated to understand the effect of each on Cu coating. Cu activation process increased surface activity of B 4 C by pre-deposition Cu nano-crystals, which was effective and cost-saving when compared with conventional Pd activation method. The influence of activation pH on electroless Cu coating was discussed and a moderate pH 12 is suitable for Cu deposition. Surface roughening process availably promoted wettability of B 4 C particles with aqueous solution. Etched pits were formed on B 4 C surface and resulted in fresh surface exposed after oxidization roughening process, which was beneficial for Cu bonding and coating on B 4 C surface.
研究领域:
材料科学
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表面工程
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Polymer Materials
·
2022
·
IF 4.855
Cheng-yuan Feng,Hai-jun Chen,Meng-yao Yang,Zhe-sheng Feng,Yan Wang
An economical and efficient strategy for fabricating high-performance metallic copper layers on polyphenylene sulfide (PPS) for high-frequency microwave applications via mussel-inspired surface modification and electroless copper plating (ECP) is illustrated in this paper. Through UV-induced surface modification of catechol (CA)/polyamine (PA), the modified PPS substrate is capable of adsorbing silver particles, which provides activation sites for subsequent ECP. The impact of CA/PA modification on the relationship between PPS and the deposited copper layer can be determined by water contact angle measurements, X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and tape peel tests. The involvement of CA/PA has successfully introduced the functional groups for chemical bonding on the PPS surface, which greatly improves the adhesion between the PPS and the deposited copper layer. Moreover, after 40 min of ECP, the produced copper layer exhibits good adhesion at the 5B level (according to the ASTM D3559) and an excellent conductivity of 0.37 S/m (approx. 62% of bulk copper). Meanwhile, the deposited copper layer also has good resistance to acid, alkali, and salt corrosion (less than 25 g/m2 per unit area weight loss after 60 h of corrosion). This approach opens up an efficient path for the surface metallization of PPS, which has a broad potential for application in high-frequency copper-clad laminates (CCLs).
研究领域:
材料科学
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化学工程
✓ 已验证
产品关联
DOI
高影响因子
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
·
2021
·
IF 4.539
Dongxu Huang,Mingqi Huang,Deliang Sun,Bincan Liu,Rui Xuan,Jinshan Liu,Rong Sun,Jinhui Li,Guoping Zhang,Daquan Yu
The metallization of glass with high density and fine spacing possesses promising application in advanced package in 5 G. However, the adhesion strength between the copper and the smooth glass is still limited. In this paper, a feasible method is developed to prepare ZnO coating on the glass surface which served as an adhesive layer to provide a good anchors of copper layer by electroless copper plating. The results proved the adhesion strength of the copper layer is as high as 5B by grid adhesion test. Furthermore, diethoxy-methyl-(3, 3, 3-trifluoro-propyl)-silane was used to create an optional hydrophobic surface to accomplish a selective electroless copper plating pattern. The electroless copper plating is non-toxic, convenient, low economic cost and reliable and it is expected to realize promising application in system-in-package in the future.
研究领域:
材料科学
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电子工程
✓ 已验证
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2025
·
IF 8.2
Zhao-Yun Wang,Li-Xin Yu,Yu-Qing Feng,Lei Jin,Jia-Qiang Yang,Yi Zhao,Tao Song,DongPing Zhan,Daquan Yu,Fang-Zu Yang,Shi-Gang Sun
Leveler is the key additive for achieving microvia void-free filling in the high-density integration of electronic components for miniaturization, lightweighting, and intelligent development of electronic devices. Traditional organic levelers are mostly quaternary ammonium salts and nitrogen-containing heterocyclic compounds. In this study, thiosemicarbazide (TA) and 1-phenyl 2-thiourea (PTA), which are the thioamino compounds with different substituents of amino and phenyl, are used for the first time as levelers for microvia filling in an acidic copper sulfate bath of Cu electroplating (Cu-EP). The results demonstrate that only the PTA, when used as the leveler in combination with poly(ethylene glycol) (PEG) as the suppressor and bis(sodium sulfopropyl)-disulfide (SPS) as the accelerator, can achieve microvia void-free filling. Chronopotentiometric analyses reveal that both TA and PTA accelerate the reduction of cupric ions. The accelerator of SPS with TA synergistically enhances accelerating effect, while with PTA, it behaves with competitive adsorption to weaken this effect. The suppressor of PEG can cooperate with PTA to show a strong inhibiting effect on cupric ion reduction but presents competitive adsorption with TA, weakening the inhibiting effect of PEG. Under such complex interactions of these additives, it has been found that only the combination of PTA, SPS, and PEG exhibits convection-dependent adsorption behavior, which results in a more negative reduction potential of cupric ions at the mouth of the microvia than that at the bottom of the microvia, indicating a theoretical feasibility of achieving microvia void-free filling. Cyclic voltammetry experiments further demonstrate that the PTA can accelerate the reduction of cupric ions, but this acceleration effect is weakened by SPS due to competitive adsorption. PTA synergizes with PEG to greatly enhance the inhibiting effect on cupric ions reduction. According to electrochemical properties and interactions of the additives, the essence of the PTA-based acidic Cu sulfate bath for achieving microvia void-free filling is elucidated through electroplating simulations. When the three additives coexist, the adsorption coverage of PTA–PEG gradually decreases from the mouth to the bottom. As PTA–PEG exhibits a synergistic inhibition effect, such a gradient significantly inhibits Cu deposition at the mouth; simultaneously, the adsorption coverage of SPS, which behaves with an accelerating effect, gradually increases from the mouth to the bottom, facilitating the reduction of cupric ions at the bottom. The dual gradient effects enable the microvia void-free filling.
研究领域:
材料科学
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电化学
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电子器件
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表面工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
ACS Applied Materials & Interfaces
·
2014
·
IF 5.9
Yu Chang,Chao Yang,Xin-Yao Zheng,Dong-Yu Wang,Zhen-Guo Yang
A novel patterning–adsorption–plating process to additively fabricate copper patterns is developed. Functional ink with ion-adsorption nanoparticles was inkjet printed on PET substrate to form the patterned adsorption film. Catalytic ion was adsorbed by amino groups in the adsorption film, and catalyzed the electroless plating of copper. The mercapto groups introduced to the film enhance the reliability of the patterns. Specific solvent used in the ink increase the surface roughness of the adsorption film, leading to a better adhesion of the patterns. The prepared copper patterns show excellent conductivity about the same with bulk copper and good adhesion on PET.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
NEW JOURNAL OF CHEMISTRY
·
2025
·
IF 2.5
Mingjie Li,Xuesong Peng,Jie Jiang,Yaqiang Li,Fan Meng,Youzheng Wu,Maozhong An,Ruopeng Li,Penghui Ren,Peixia Yang
The void-free blind microvia copper electroplating process is a key technology in HDI PCB manufacturing. This work systematically studied the influence of the Acid Blue 1 (AB1) leveler on blind microvia filling. AB1 exhibits excellent suppression during electroplating, with its effect strengthening as the AB1 concentration increases. Chronopotentiometry was used to study the interaction among AB1, SPS, and PEG. There is a synergistic suppressing interaction between the new leveler AB1 and suppressor PEG, while there is competition between AB1 and accelerator SPS. During electrodeposition, AB1 can adsorb on the copper substrate to reduce active sites and suppress copper electrodeposition, based on theoretical studies and in situ infrared spectroscopy. At the optimized electroplating process, void-free microvia filling is achieved with 20 mg L−1 AB1 and successive electroplating confirms the stability of AB1. Based on diffusion differences among additives and the competition between AB1 and SPS, a gradient competitive adsorption superfilling mechanism was proposed to illustrate the filling process of the AB1–SPS–PEG system. AB1 is beneficial to improving flatness and lowering surface roughness of the copper layer, which is conducive to reducing signal losses during high-frequency transmission. Additionally, AB1 can modulate the preferential formation of Cu(111) and Cu(200) and facilitate grain refinement.
研究领域:
材料科学
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电化学工程
✓ 已验证
产品关联
DOI
高影响因子
APPLIED SURFACE SCIENCE
·
2025
·
IF 6.9
Qiao Ding,Ning Li,Bo Wu,Qing Cheng,Qi Zhao,Tong Liu,Rui Wang,Deyu Li
In this study, SO 2 was used to chemically modify the commonly used leveling agent polydimethyldiallylammonium (PD) in through-hole electroplating, resulting in a more effective leveling agent, PDS, which improved the throwing power (TP), leading to through-hole circuit boards with better metal coverage in difficult-to-reach areas. Furthermore, theoretical and experimental studies were conducted to understand how the −SO 2 structure influences the leveling ability of the leveling agent. The study demonstrates that the −SO 2 -modified additive significantly enhances the copper plating process, resulting in thicker and more uniform deposits in through-holes, which are critical for ensuring high-quality circuit boards.Additionally, this study elucidates the mechanism of action of the leveling agent on the copper surface, providing theoretical support for the development of copper plating leveling agents. The leveling ability differences between the leveling agents PD and PDS were investigated using Cyclic Voltammetry, constant current method, and Electrochemical Impedance Spectroscopy. Additionally, the optimal concentrations of the additives were determined. Quantum chemical calculations were employed to analyze the electrostatic potential, HOMO/LUMO orbitals, and differential charge density on the Cu (111) surface for both leveling agents. These theoretical analyses provided insights into the reasons behind the differing leveling abilities of the two agents.
研究领域:
材料科学
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电化学
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理论化学
✓ 已验证
产品关联
DOI
高影响因子
ELECTROCHIMICA ACTA
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2015
·
IF 4.504
Yu Chang,Yu Tao,Qun Zhang,Zhen-Guo Yang
A novel patterning-adsorption-plating process to additively fabricate conductive patterns and through-holes of double-sided flexible printed circuit is developed. Firstly, through-holes were drilled in substrate. Then ion-adsorption ink was dip-coated to form the adsorption film on the surfaces of substrate and through-holes. Mask was printed to expose the patterns and the through-holes. Afterwards, silver ion was selectively adsorbed to the exposed parts. Finally, after dissolving the mask, the patterns and the through-holes were metalized by electroless plating of copper. The ion-adsorption ink is composed of polysiloxane and solvent. The polysiloxane was prepared by hydrolyzing 3-aminopropyltriethoxy silane with 3-mercaptopropyltriethoxy silane together, thus the formed ion-adsorption film contains abundant amino and mercapto groups. Amino groups can adsorb silver ion by complexation. Mercapto groups increase the hydrophobicity of the adsorption film, improving the stability in alkaline solution. Special solvent used in the ink leads to the coarse adsorption film, so the mechanical anchor between the deposited copper and adsorption film is improved, resulting in a better adhesion. After 60 min plating, the copper patterns with 1.87 μm in thickness and 9.1 mΩ in square resistance was prepared, the adhesion can reach 5B. The prepared double-sided FPC shows high conductivity and adhesion, proving that PAP process possesses high potential in industrial production.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
APPLIED SURFACE SCIENCE
·
2023
·
IF 6.7
Yuanming Chen,Shaorong Liang,Wei He,Shouxu Wang,Chong Wang,Zhuoming Du,Yongjie Du,Weiguo Yang,Binyun Liu,Yan Hong
A simple and chromium-free method for the metallization on engineering plastic polyamide-6 (PA6) by UV irradiation is proposed in this article. The surface graft polymers with specific adsorption activity are developed through one-step UV exposure operation, which captures Pd 2+ in the activation process. The chemisorption of Pd 2+ is further reduced into catalytic Pd 0 to enable the substrate with catalytic nucleus for conventional copper electroless deposition (ELD). The grafting layer and the deposited copper coating are characterized by Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, contact angle measurements, scanning electron microscopy, and X-ray diffraction. The results indicate that successful grafting occurs on PA6 after UV excitation. In addition, the as-deposited copper layer shows excellent conductive performance and high adhesion with the PA6 substrate. It’s expected that this emerging and feasible approach would have broad prospects for the metallization of plastic and offer significant value in the plating industry.
研究领域:
材料科学
·
表面工程
✓ 已验证
产品关联
DOI
高影响因子
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
·
2024
·
IF 4.9
Jifan Yang,Yuxuan Yang,Fei Long,Xuan Li,Fei Sun,Chenhao Qian,Xinyu Yan,Tong Zhou,Lei Liu
AlN ceramic is the potential substrate for high-performance printed circuit board with the rapid development of electronic industry due to the superior thermal and electrical property, while its metallization still faces the issues of thermal stress and weak interface bonding with existing technology. Herein, a convenient design is proposed to achieve the Cu deposition on the surface of AlN substrate, the TiO 2 containing photocatalytic intermediate layer is prefabricated on AlN substrate with silica and titania mixed sol, and induces the autocatalytic deposition of electroless copper plating under ultraviolet irradiation. Compared with Cu deposition with Pd activation treatment, the bonding strength between Cu layer and AlN substrate is significantly enhanced with the intermediate layer, this is ascribed to the formed nano-porous microstructure of the sintered intermediate layer facilitating the penetration of plating bath, and the mechanical anchoring effect derived from the interlocking microstructure between Cu layer and intermediate layer contributes to the improved bonding strength. This new method realizes the metallization of AlN ceramic with high interfacial bonding strength and low cost compared with the traditional joining technology, and provides a potential reference for the surface metallization of inert material.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY
·
2023
·
IF 6.1
Lei Jin,Zhao-Yun Wang,Zhuan-Yun Cai,Jia-Qiang Yang,An-Ni Zheng,Fang-Zu Yang,De-Yin Wu,Dongping Zhan
In this work, we develop a novel 1-(2-Pyridylazo)-2-naphthol (PAN)-based acidic sulfate copper electronic electroplating process for compact, homogeneous and conformal copper thickening of through hole (TH). The adsorption characteristics, electrochemical properties and the interaction mechanisms of three additives (PEG, SPS and PAN) are studied in detail. Scanning electron microscope (SEM) and optical microscope (OM) reveal that PAN can make the copper coating in fine grains and high throwing power of 90.35% in TH without an overhang phenomenon. Theoretical calculations illustrate that the binding energies between additive molecules and copper surface decrease in the order: PAN > SPS > PEG . Cyclic voltammetry experiments at rotating rates of 1200 and 200 r/min prove that PAN itself can accelerate and weakly suppress copper electrodeposition at the center and mouth of TH, respectively. PAN behaves respectively the synergistic and antagonistic effects with PEG at the mouth and center of TH, and the weakly synergistic effects with SPS both at the mouth and center of TH. The addition of PAN to the virgin make-up solution (VMS) containing PEG and SPS causes decreasing the relative electric charge (Δ Q ) at high and low rotating rates from 18.52 ± 0.08% to 8.25 ± 0.05%, which satisfies the closer copper electronic electroplating rate at the center and mouth of TH. The effective and complicated synergistic effects of the additives PEG, SPS and PAN can achieve compact, homogeneous and conformal copper thickening of TH.
研究领域:
材料科学
·
电化学工程
✓ 已验证
产品关联
DOI
高影响因子
ELECTROCHIMICA ACTA
·
2025
·
IF 5.6
Zhao-Yun Wang,Lei Jin,Jia-Qiang Yang,Yi Zhao,Tao Song,DongPing Zhan,Da-quan Yu,Fang-Zu Yang,Shi-Gang Sun
The uniform thickening of high aspect ratio (AR) through-holes (HAR-TH, AR: 10–12:1) by Cu electronic plating (Cu-EP) is essential in printed circuit boards fabrication, and is often accomplished with organic levelers and at low current densities (6–15 mA/cm 2 ). Nevertheless, the organic levelers are often unstable and the Cu-EP at low current densities presents low production efficiency. In this study, we demonstrate that inorganic compound sodium azide (SAD) can act as a novel leveler in acidic Cu-EP for achieving uniform thickening of HAR-THs (AR: 12:1) even at a high current density of 20 mA/cm 2 . The throwing power using SAD for HAR-THs (AR: 12:1) thickening reaches as high as 94.7 %. Galvanostatic measurements and cyclic voltammetry tests on Pt rotating disk electrode (Pt-RDE) reveal that the competitive adsorption among the three additives of SAD, PEG and SPS occurs only at high rotating rate, referring to a strong inhibition of cupric ions reduction at violent convection area of the HAR-THs mouth. In situ FTIR spectroscopy analyses combined with DFT theoretical calculations illustrate that the synergistic effect of SAD and PEG is manifested by the formation of a PEG-SAD co-adsorption layer. The key to achieving uniform thickening lies in the difference in competitive adsorption abilities between the PEG-SAD co-adsorbed layer and SPS at both mouth and middle part of the HAR-THs. The PEG-SAD co-adsorption layer occupies all active sites of the HAR-THs mouth, preventing SPS from adsorption and thus reducing Cu deposition rate. However, the SPS firmly occupies active sites of middle part of the HAR-THs, facilitating to maintain a consistent Cu deposition rate inside the HAR-THs, consequently achieving uniform Cu thickening of the HAR-THs.
研究领域:
材料科学
·
电化学工程
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）