Journal of Energy Storage
·
2024
·
IF 8.9
Peng Gong,Pan Guo,Fei Liu
Organic phase change materials (PCMs), particularly paraffin (PA), are renowned for their substantial latent heat storage capacities. Despite this advantage, their practical application is often hampered by inherent drawbacks such as inadequate leakage resistance , low thermal conductivity , and inefficient photothermal conversion. This study introduces a novel fabrication technique for phase change composites (PCCs) that involves electroplating a nanostructured Cu film onto fiber-structured carbon felts, thereby creating a thermally conductive scaffold for the PCMs . The thermal conductivity of the resulting CuF@PA composite was significantly improved to 1.3 Wm^-1 K^-1, which is 6.5 times higher than that of pure PA. Furthermore, the incorporation of a Cu nanostructure within the composite significantly bolsters its leakage resistance and photothermal conversion efficiency. The CuF@PA composite also boasts a high phase transition enthalpy of 167.1 Jg^-1, showcasing its superior energy storage capability. These findings suggest that the synergistic combination of carbon felt and nano Cu film offers a promising solution to overcome the limitations of traditional PCMs. The developed PCC demonstrates significant promise for diverse applications including solar thermal energy storage and advanced thermal management.
研究领域:
材料科学
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能源工程
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DOI
高影响因子
ECS Journal of Solid State Science and Technology
·
2024
·Vol. 13
·期 5
·054001
·
IF 1.8
Changxin Dong,Xinhuan Niu,Jianghao Liu,Ni Zhan,Yida Zou,Chao He,Xinjie Li,Fu Luo,Yunhui Shi,Jiabao Cheng
For Ruthenium (Ru)-based copper (Cu) interconnects Cu film chemical mechanical polishing (CMP), it is crucial to select appropriate pH regulators in the slurry to ensure the chemical reactions and maintain the stability of the polishing chemical environment. In this study, the effects of inorganic pH regulator KOH, organic pH regulator diethanolamine (DEA), and 2-amino-2-methyl-1-propanol (AMP) on CMP and slurry properties of Cu film were compared. It was found when using AMP as a pH regulator, the Cu/Ru removal rate selectivity (RRS) can reach 598:1, the surface roughness of Cu film decreased to 0.76 nm, and the slurry can remain stable for at least 7 d. The performance order of the three pH regulators is AMP>KOH>DEA. Meanwhile, through experimental results and test analysis, it has been confirmed that AMP can also play a multifunctional role as a complexing agent, dispersant, and surfactant. Therefore, AMP can replace KOH as a new pH regulator in weak alkaline slurries. This result plays an important role in guiding the selection of organic pH regulators in the optimization of Cu film CMP slurry.
研究领域:
材料科学
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化学工程
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DOI
高影响因子
LANGMUIR
·
2016
·
IF 3.993
Wen Xu,Tao Wang
Cu(II) complex ink consisting of copper formate (Cuf) and a primary alkylamine could yield highly conductive copper films at low heating temperatures without a reducing atmosphere. A synergetic effect of the blended alkylamines on the formation of conductive films was observed. It was found that blending two types of amines with different alkyl chain lengths as ligands could improve the conductivity of copper films, compared with using one of these amines alone. The decomposition mechanism of the Cuf–amine complex and the role of amines with different alkyl chain lengths were investigated. It was found that the decrease in the decomposition temperature and the formation of copper films were attributed to the activating effect and capping effect of the amine, and these two effects were dependent on the alkyl chain length. The relative intensity of the dual effects determined the decomposition rate of the complex and the nucleation and growth of particles. The use of blended amines with different alkyl chain lengths as ligands could balance the two effects and lead to appropriate nucleation and growth rates, so that densely packed copper films with low resistivity could be obtained at low heating temperature in a short time. The Cuf–butylamine–octylamine (Cuf–butyl–octyl) ink with 1:1 molar ratio of the amines showed the best performance. The understanding of the synergetic effect could provide guidance to the design of copper complex inks to control the morphology of the films.
研究领域:
材料科学
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化学工程
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DOI
PubMed
高影响因子
RSC Advances
·
2017
·Vol. 7
·期 15
·9316-9320
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IF 3.108
Li-Long Jiang,Xiangzhou Zeng,Mengkai Li,Man-Qing Wang,Tong-Yu Su,Xiao-Chun Tian,Jing Tang
We synthesized a HKUST-1 metal–organic framework (MOF) on indium tin oxide (ITO) using an electrodeposited Cu film. The electrodeposited Cu/ITO was used as a source of Cu ions, which were linked with benzene-1,3,5-tricarboxylic acid on the ITO surface to form HKUST-1. Synthesized HKUST-1/ITO was characterized by X-ray diffraction (XRD), Raman spectroscopy and scanning electron microscopy (SEM), which showed that the morphology of the HKUST-1 framework was nearly octahedral. Our results also revealed that the growth of HKUST-1 depended on the potential and synthesis time used. This method can be applied to fabricate ordered patterns of HKUST-1 on ITO substrates, offering a new way to grow MOFs on many other kinds of conductive substrates.
研究领域:
材料科学
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电化学
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产品关联
DOI
高影响因子
Plasma Processes and Polymers
·
2020
·Vol. 17
·期 8
·2000034
·
IF 3.065
Tao Wang,Li Lv,Liping Shi,Baohong Tong,Xingquan Zhang,Guotao Zhang,Jingquan Liu
This study presents the microplasma direct writing of copper film in the open air using a novel copper powder electrode. The powder electrode acted as a high-voltage electrode and the precursor source. The deposition process is realized through ion sputtering of the powder in the microplasma. The bombarded copper nanoparticles were deposited and accumulated on a silicon substrate. The deposited film is composed of copper nanoparticles with sizes in the range from tens to hundreds of nanometers, and its electrical conductivity could reach 3.96 × 10 5 S/m. The morphologies, chemical compositions and electrical property of the thin film can be adjusted by changing the input current, and maskless film deposition with different micropatterns can be achieved by direct microplasma scanning.
研究领域:
材料科学
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物理学
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DOI
高影响因子
TRIBOLOGY INTERNATIONAL
·
2024
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IF 6.1
Changxin Dong,Xinhuan Niu,Chao He,Xinjie Li,Zheng Wu,Jiahui Li,Bin Hu,Yunhui Shi,Jiabao Cheng,Xiaodong Luan
For copper (Cu) interconnection chemical mechanical polishing (CMP) process, the Cu film slurry follows the principles of high efficiency, environmentally friendly and low cost. In this study, hydroxyethylene diphosphonic acid (HEDP), amino-trimethylene phosphonic acid (ATMP) and ethylenediamine etramethylenephosphonic acid (EDTMP) were used as green inhibitors to study the effects of organic compounds rich in two, three and four phosphate functional groups on the corrosion inhibition properties of Cu films. The results indicated that the Cu film material removal rate (MRR) of HEDP reaches 5879 A/min and the surface roughness (Sq) is 0.85 nm, superior to the other two inhibitors. Through mechanical action analysis, electrochemical experiment, UV-Visible, X-ray photoelectron spectroscopy (XPS) test analysis and theoretical calculation, it was observed that three inhibitors could not only form stable complexes with Cu, which have the effect of corrosion inhibition, but also play a lubricating role of surfactant, and simplify the composition of slurry, and the inhibition efficiency order of them is HEDP > ATMP > EDTMP.
研究领域:
材料科学
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电化学
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理论计算
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DOI
高影响因子
CHEMICAL ENGINEERING JOURNAL
·
2022
·
IF 16.744
Hui Zhao,Yinsen Huang,Yichen Han,Jin Yun,Xinlong Wang,Liang Jin,Yaping Zheng,Lixin Chen
Lightweight porous conductive polymer composite materials (CPCs) are up-and-coming electromagnetic interference (EMI) shielding materials. However, fair-sized thickness (>1 mm) and limited thermal conductivity hinder their application in modern integrated and miniaturized electronics. Herein, flexible bidirectional differential porous carbon fillers (C-fillers)/polyether sulfone (PES)/Cu (PCPES/Cu) composite films are fabricated via phase inversion technology followed by magnetron sputtering process. The bidirectional differential structure features with a top porous C-fillers/PES (PCPES) film and a bottom sputtering highly-conductive Cu thin layer. The PCPES film possesses hierarchical pore structure that is derived from mass transfer between solvent and nonsolvent. Owing to the bidirectional differential structure, an “absorption-reflection-reabsorption” shielding process is created to strengthen EMI shielding performance and relieve secondary microwave reflection in PCPES/Cu composite film. Its shielding effectiveness is as high as 59.7 dB, and specific SE/t is up to 6982.5 dB cm 2 g −1 . Notably, the reflection coefficient falls to 0.73, below other shielding materials with similar thickness. Further, the Cu thin layer can construct effective transmission channel of phonons in the plane direction, allowing thermal conductivity enhancement. The flexible lightweight EMI shielding composite films with satisfied thermal conductivity have extensive application prospects, such as aerospace, wearable electronics, and portable electronics.
研究领域:
材料科学
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电子工程
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产品关联
DOI
高影响因子
JOURNAL OF INORGANIC BIOCHEMISTRY
·
2021
·
IF 4.155
Hui Chong,Gaomin Zhang,Yaohang Wu,Bin Xu,Guoxiu Wang,Chengyin Wang
Addition of D-Asp in the electrochemical deposition process of Bismuth film resulted the generation of a new diffraction peak in X-ray diffraction (XRD) spectrum. This phenomenon was not observed in the situation of L-Asp. The new diffraction peak might suggest D-Asp could result in the generation of a specific Bismuth structure. Enantioselective recognition of D- and L-Asp can be realized based on this new XRD peak. The limit of detection was determined to be 3.5 × 10 −8 and 1.7 × 10 −8 mol L −1 for D- and L-Asp, respectively. The XRD spectra of electrodeposited Copper films fabricated in the presence of D- or L-Asp showed different lattice plane diffraction peak intensity ratios. The reason was believed to be chirality induced different binding capabilities of Asp enantiomers that influenced Copper film growth. Therefore, the combination of electrochemical deposition using Copper as metal source and XRD technology can be used to achieve enantioselective recognition of Asp. The limit of detection for D- and L-Asp were determined to be 1.5 × 10 −10 and 1.2 × 10 −11 mol L −1 , respectively.
研究领域:
分析化学
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材料科学
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产品关联
DOI
PubMed
高影响因子
Nanomaterials
·
2023
·Vol. 13
·期 9
·1479
·
IF 5.3
Wenxiang Lu,Lu Ma,Shengchen Ke,Rouxi Zhang,Weijian Zhu,Linling Qin,Shaolong Wu
Photoelectrochemical (PEC) sensors show great potential for the detection of heavy metal ions because of their low background noise, high sensitivity, and ease of integration. However, the detection limit is relatively high for hexavalent chromium (Cr(VI)) monitoring in addition to the requirement of an external bias. Herein, a CuO film is readily synthesized as the photoactive material via reactive sputtering and thermal annealing in the construction of a PEC sensing photocathode for Cr(VI) monitoring. A different mechanism (i.e., Signal-Weakening PEC sensing) is confirmed by examining the electrochemical impedance and photocurrent response of different CuO film photoelectrodes prepared with the same conditions in contact with various solutions containing concentration-varying Cr(VI) for different durations. The detection of Cr(VI) is successfully achieved with the Signal-Weakening PEC response; a drop of photocathode signal with an increasing Cr(VI) concentration from the steric hindrance effect of the in situ formed Cr(OH)3precipitates. The photocurrent of the optimized CuO film photocathode linearly declines as the concentration of Cr(VI) increases from 0.08 to 20 µM, with a detection limit down to 2.8 nM (Signal/Noise = 3) and a fitted sensitivity of 4.22 µA·μM−1. Moreover, this proposed sensing route shows operation simplicity, satisfactory selectivity, and reproducibility.Keywords:self-powered sensing;signal weakening;photoelectrochemical sensor;hexavalent chromium;CuO film
研究领域:
环境科学
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材料科学
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产品关联
DOI
PubMed
高影响因子
JOURNAL OF POWER SOURCES
·
2016
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IF 6.333
Jinlian Bi,Liyong Yao,Jianping Ao,Shoushuai Gao,Guozhong Sun,Qing He,Zhiqiang Zhou,Yun Sun,Yi Zhang
The issues of rough surface morphology and the incorporated additives of the electro-deposited Cu layers, which exists in electrodeposition-based processes, is one of the major obstacles to improve the efficiency of Cu(In,Ga)Se 2 (CIGSe) and Cu 2 ZnSnSe 4 (CZTSe) solar cells. In this study, the pulse current electro-deposition method is employed to deposit smooth Cu film on Mo substrate in CuSO 4 solution without any additives. Grain size of the deposited Cu film is decreased by high cathode polarization successfully. And the concentration polarization , which results from high pulse current density, is controlled successfully by adjusting the pulse frequency. Flat Cu film with smooth surface and compact structure is deposited as pulse current density @ 62.5 mA cm −2 , pulse frequency @100,000 Hz, and duty cycle @ 25%. CIGSe and CZTSe absorber films with flat surface and uniform elemental distribution are prepared by selenizing the stacking metal layers electro-deposited by pulse current method. Finally, the CIGSe and CZTSe solar cells with conversion efficiency of 10.39% and 7.83% respectively are fabricated based on the smooth Cu films, which are better than the solar cells fabricated by the rough Cu film deposited by direct current electro-deposition method.
研究领域:
材料科学
·
可再生能源
·
电化学
✓ 已验证
DOI
高影响因子
TALANTA
·
2014
·
IF 3.511
Xinxin Xiao,Meng’en Wang,Hui Li,Yichuan Pan,Pengchao Si
A kind of dealloyed nanoporous gold (NPG)/ultrathin CuO film nanohybrid for non-enzymatic glucose sensing has been prepared by a simple, in-situ, time-saving and controllable two-step electrodeposition. The three-dimensional and bicontinuous nanoporous structure of the nanocomposites have been characterized by scanning electron microscope (SEM) and transmission electron microscopy (TEM), and the electrochemical tests have been estimated by cyclic voltammetry and single potential step chronoamperometry (SPSC). The optimal NPG/CuO electrode exhibits great electrocatalytic activity towards glucose oxidation and also shows obvious linear response to glucose up to 12 mM with a high sensitivity of 374.0 µA cm −2 mM −1 and a good detection limit of 2.8 µM ( S / N =3), as well as strong tolerance against chloride poisoning and interference of ascorbic acid and uric acid .
研究领域:
生物医学工程
·
材料科学
✓ 已验证
产品关联
DOI
PubMed
高影响因子
THIN SOLID FILMS
·
2024
·
IF 2
Silin Han,Chongyang Li,Yuhang Chen,Yunwen Wu,Ming Li,Tao Hang
In this paper, the changes in microstructure and conductivity of the films before and after thermal and laser annealing are observed, which corresponds to various combinations of crystallite sizes and impurity densities. The results show that the impurities promote grain boundary migration at larger initial crystallite sizes, which contradicts previous reports. This is because the rate of grain growth is determined by the driving force and resistance to grain growth, the former provided by the energy of grain boundaries and the impurities outside the nanograin boundaries, and the latter by the impurities enriched within the boundaries. Additionally, laser annealing is more effective than thermal annealing in stimulating impurity diffusion, resulting in a reduced influence of impurities on grain growth.
研究领域:
材料科学
·
冶金学
·
薄膜技术
·
固体物理
✓ 已验证
DOI
高影响因子