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CORROSION SCIENCE · 2016 · IF 5.154

In situ click-assembling monolayers on copper surface with enhanced corrosion resistance

Yinzhe Yu,Yizhen Wang,Jin Li,Daquan Zhang,Lixin Gao

The self-assembled monolayer (SAMs) of 2-(1-tosyl-1H-1,2,3-triazol-4- yl ) propan-2-ol (TTP) was in-situ assembled on copper surface via click chemistry reaction between 2, 2-dimethylethynyl carbinol (MBY) and tosyl azide (TA). The electrochemical results indicate that the click-assembled TTP film can strongly suppress the corrosion reaction of copper in 3   wt.% NaCl and its protection efficiency is 93.6%. Polarization curves show that TTP SAMs is an anodic passivation type inhibitor. The adsorption of TTP molecules on Cu 2 O (0 0 1) surface is in the flat orientation of the nearby triazole ring and O atoms.

研究领域: 材料科学 · 电化学
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APPLIED SURFACE SCIENCE · 2020 · IF 6.182

Biomimetic metal surfaces inspired by lotus and reed leaves for manipulation of microdroplets or fluids

Hanpeng Gao,Yan Liu,Guoyong Wang,Shuyi Li,Zhiwu Han,Luquan Ren

Smart surfaces that can manipulate droplets or fluids have attracted intense attention because of their essential application prospects. However, it is still a challenge to obtain multifunctional integrated metal platforms that can simultaneously manipulate water/oil droplets and water/oil fluids. Here, inspired by the structure and wettability of natural reed leaves and lotus leaves, dual biomimetic platforms with switchable and anisotropic/isotropic wettability were prepared on copper by laser processing, chemical etching, and mixed thiols modification. The wettability of the integrated platforms can respond to the change of external pH value and reversibly switch between superhydrophobicity and underwater superoleophobicity. The areas of “reed leaf” structure and “lotus leaf” structure on the biomimetic platform have anisotropic and isotropic wettability, respectively. Significantly, by rationally designing the distribution of bionic structures, the dual biomimetic platforms can simultaneously manipulate water/oil droplets and water/oil fluids. This work not only provides advanced integrated biomimetic platforms and interesting design strategies, but also has important reference value in the development of new metal microfluidic devices.

CAS / MDL: 112-55-0
研究领域: 材料科学 · 生物学
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INTERNATIONAL JOURNAL OF THERMAL SCIENCES · 2022 · IF 4.779

Experimental study on the pool boiling performance of a highly self-dispersion TiO2 nanofluid on copper surface

Tao Wen,Jielin Luo,Kai Jiao,Lin Lu

Enhancing heat transfer performance of pool boiling is attractive in practical applications, while the utilization of nanofluid is regarded as an effective approach. However, existing knowledge of boiling enhancement with nanofluid is still limited in terms of the influences of its type, concentration, deposition and boiling time. In this paper, the pool boiling performance of a highly self-dispersion TiO 2 nanofluid with mass concentration from 0.0001% to 0.1% was experimentally investigated and compared with Al 2 O 3 and ZnO nanofluid. The effect of boiling-induced deposition layer was studied by means of repeatability test, wettability test and macro/micro morphology test. Results indicated that a super-hydrophilic micro-porous deposition layer formed on nanofluid boiling surface and led to nearly twice higher CHF than distilled water, and nanofluid itself had negligible influence on CHF enhancement. Increasing concentration of nanofluid led to occasional falling off of the deposition on surface and resulted in complicated and unpredictable boiling performance. Nanofluid type and concentration had limited influence on CHF, whose value kept around 1800 kW/m 2 . 0.0001% TiO 2 and Al 2 O 3 nanofluids had similar boiling curves, but ZnO nanofluid exhibited lower heat transfer coefficient . Finally, a novel criterion to predict the occurrence of film boiling in advance was proposed based on wall superheat change rate threshold. The present study will contribute to design guidance and security control of nanofluid-based pool boiling device.

CAS / MDL: 1314-13-2
研究领域: 工程热物理 · 材料科学
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COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS · 2023 · IF 5.2

Fabrication of biomimetic laser etched superwetting copper surfaces for highly improved mist collection efficiency

Yitong Pang,Guoying Mei,Fengyi Wang,Ao Fu,Zhiguang Guo

Water scarcity has become a serious global issue due to frequent global climate extremes such as warming, storms, floods and droughts. Developing highly efficient water-harvesting materials to collect freshwater from mist is a potential solution to solving the issue. Herein, a series of superwetting copper materials with excellent mist collecting efficiencies were successfully prepared via facile etching, modification, laser-scanning and plating methods. The sample surfaces showed unique wettability and structure characteristics that numbers of hydrophilic humps were regularly arrayed and embed into the superhydrophobic surface with nanorod structures. The surface structure, chemical composition of the superwetting copper materials were investigated by Fourier transform infrared spectroscopy (FT-IR), X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS), respectively. Excellent mist collection efficiency of the fabricated superwetting copper materials was verified by mist collection tests. In addition, the enhancing mechanism of mist collecting behavior on the superwetting copper surface was analyzed. The excellent mist collecting performance of the prepared surfaces exhibited promising potential to achieve mist collecting materials.

CAS / MDL: 2885-00-9
研究领域: 材料科学 · 环境科学
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COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS · 2024 · IF 4.9

Improving the interfacial bonding strength of a silane anticorrosion film on copper surfaces using small-molecule corrosion inhibitors

Min Yu,Xiang Gao,Kanglu Feng,Juan Qiu,Chunchao Chen,Kangwei Gongsun,Changming Bu,Qing Zang,Zhaoyu Mao,Houyi Ma

The weak binding ability of silane to copper surfaces restricts its use in copper anticorrosion. In this study, the P–OH groups in etidronic acid (HEDP) were utilized to establish chemical bonds with copper and to react with 3-mercaptopropyltrimethoxysilane (PropS-SH), serving as a bridging mechanism to enhance the anchoring of silane onto copper surfaces. Moreover, the presence of HEDP promoted the condensation of silane, leading to the formation of a denser and thicker film with outstanding corrosion resistance. SEM results indicated that the thickness of the PropS-SH/HEDP film was about 125 nm, and defects at the copper–film interface were repaired. Electrochemical tests demonstrated that the PropS-SH/HEDP film exhibited remarkable corrosion resistance, achieving an anticorrosion efficiency of 99.95 %. Immersion testing showed that the PropS-SH/HEDP film was capable of withstanding immersion in a 3.5 wt% NaCl solution for 10 days, displaying a durability 5 times greater than that of the standalone silane film.

CAS / MDL: 4420-74-0
研究领域: 材料科学 · 腐蚀与防护
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PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY · 2018 · IF 2.582

Effect of cupric ion concentration on the etching behavior of copper in Electrogenerated Chemical Polishing (EGCP)

Ke Wang,Ying Yan,Ping Zhou,Kang Shi,Dongming Guo

Electrogenerated Chemical Polishing (EGCP) is a stress-free polishing method which has been verified to be an effective method to obtain an ultra-flat and ultra-smooth copper (Cu) surface without defects induced by mechanical force. However, the surface roughness deterioration and removal rate decline emerged after polishing for a long time which prevents the application of EGCP in Cu ultra-precision manufacturing. In this study, apparent activation energy experiments and energy dispersive spectrometer (EDS) analysis were carried out to explore the mechanism of the Cu surface roughness deterioration and removal rate decline. With the increasing of cupric ions (Cu 2+ ) concentration, the apparent activation energy of the Cu/Cu 2+ reaction increased which inhibited the material removal rate consequently. Furthermore, it was found that Cu micro bumps were generated on the surface which was speculated to result from the disproportionation reaction of cuprous ion (Cu + ) induced by high concentration of Cu 2+ . Based on this study, lifting the working electrode (WE) with a fixed time interval was verified to be an effective way to avoid the deterioration of surface roughness and the decline of the material removal rate. This study contributes to a further understanding of the chemical etching mechanism of Cu in EGCP.

研究领域: 材料科学 · 电化学
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Journal of Coatings Technology and Research · 2025 · IF 2.8

Mussel-inspired and O3-assisted superhydrophobic copper surface with good anticorrosion performance

Wei Zeng-Feng,Zhang Yu-Meng,Liu Xue-Lian,Zhang Bi-Yang,Ni Li-Jie,Quan Heng

This study introduces a mussel-inspired superhydrophobic coating designed to enhance the long-term anticorrosion performance of copper in marine environments. Fluorine-free and fluorine-containing superhydrophobic coatings were developed by O 3 -assisted pretreatment, solution polymerization of dopamine, and the Michael addition reaction of dodecyl mercaptan and perfluorooctyl ethyl mercaptan. The ozone pretreatment allows dopamine to form a denser adsorption layer on the copper surface, which improves the long-term stability of the coating. The contact angles of the two coatings are 152.8° and 155.1°, respectively. Both types of superhydrophobic coatings demonstrate good corrosion inhibition performance, particularly the fluorine-containing superhydrophobic coating (99.98%). After 28 days of simulated seawater immersion, the fluorine-containing coating still maintains high corrosion inhibition efficiency (97.02%) and good hydrophobic characteristics (140.7°), which highlight its excellent long-term seawater corrosion resistance and stability. This study provides guidelines for designing durable superhydrophobic coatings.

CAS / MDL: 62-31-7
研究领域: 材料科学 · 海洋工程 · 化学工程
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SURFACE & COATINGS TECHNOLOGY · 2020 · IF 3.784

Revealing the antibacterial mechanism of copper surfaces with controllable microstructures

Yangmin Wu,Wenting Wu,Wenjie Zhao,Xijian Lan

Although extensive experiments confirm the ability of copper for biofouling protection, its further utilization is still limited in virtue of unclear relationship between the surface topography and antibacterial performance. In this study, the hydrophobic copper surfaces with different morphologies, including nanowire, nanowire/microflower, and nanosheet/microflower hierarchical structures, were prepared through the one-step chemically etched method and in-situ self-assembly strategy. According to the four-time cyclic antibacterial assays for E. coli and B. subtilis , the copper with nanowire structure displayed a better antibacterial performance than others. Bacteriostasis rate of nanowire structure copper was over 90% in the first cycle, and reached 100% in the final test. In addition, the morphologies of copper surfaces after antibacterial test suggested that nanowire and microflower structures could significantly suppress the adhesion of bacteria. Besides, nanowire structure exerted an outstanding function in inhibiting bacterial adhesion under a lower concentration of inorganic salt.

研究领域: 材料科学 · 微生物学
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APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING · 2019 ·Vol. 125 ·期 4 ·1-12 · IF 1.784

Superhydrophobic copper surface with mechanical, chemical, and UV durability along with corrosion resistance and self-cleaning effect

Feng Libang,Wang Jing,Shi Xueting,Chai Changsheng

Abstract It is the prerequisite of improving the universality, stability, and wear resistance of superhydrophobic materials for the practical applications. A simple and environment-friendly method is developed herein for constructing superhydrophobic copper surface by hydrothermal method. The wettability, surface microstructure, phase structure, and chemical structure of superhydrophobic Cu 2 S-coated copper surface are examined by contact angle measurement, SEM observation, XRD measurement, FT-IR and EDS analyses. Results show that the superhydrophobic Cu 2 S-coated copper surface is composed of a large number of Cu 2 S crystals grafted with long hydrophobic alkyl chains, and which leads to the superhydrophobic copper presenting a rough and hierarchical surface with micro- and nano-scaled binary structure. It is noteworthy that 200 °C of heat treatment has marked influence on the surface microstructure and wettability. Consequently, the mechanical durability of the superhydrophobic copper has been improved greatly upon heat treatment. Just ground on both the hierarchical surface and grafted long hydrophobic alkyl chains as well as heat treatment, the as-prepared superhydrophobic copper surface exhibits not only good mechanical durability and corrosion resistance, but also excellent chemical and UV durability as well as self-cleaning effect. This method provides a novel and simple process to protect the surface of copper. It is believed that such technique may open a new approach to expand the application of copper. Graphical abstract A simple and environment-friendly method is developed for constructing superhydrophobic copper surface by hydrothermal method. Ground on both the hierarchical surface and grafted long hydrophobic alkyl chains as well as heat treatment, the as-prepared superhydrophobic surface exhibits not only good mechanical durability and corrosion resistance, but also excellent chemical and UV durability as well as self-cleaning effect.

CAS / MDL: 16415-12-6
研究领域: 材料科学 · 表面工程
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JOURNAL OF MOLECULAR LIQUIDS · 2023 · IF 6

Experimental characterization and dynamical modeling evaluation for enhanced BTA removal by three amino acids in post-Cu-CMP cleaning

Shihao Zhang,Yazhen Wang,Baimei Tan,Fangyuan Wang,Xiaolong Wang,Haoyu Du

Post-chemical mechanical polishing (CMP) cleaning is an indispensable process to remove organic residues and particles on the wafer surface after CMP. Benzotriazole (BTA), a dominant corrosion inhibitor in Cu-CMP slurry, can easily remain on the copper surface after CMP, affecting the performance and yield of devices, and its removal has attracted more attention. This paper revealed the effect and mechanism of three amino acids, lysine, serine, and proline, on BTA removal in tetraethyl ammonium hydroxide-based alkaline solutions during post-Cu-CMP cleaning. Experimental results showed a diminishing enhancement in the cleaning efficiency of BTA after adding lysine (97.1%), serine (96.7%), and proline (94.1%) with almost the same concentration. Ultraviolet–visible absorption spectrum proved the lysine’s complexing ability was slightly better than the other. Besides, quantum chemical parameters of amino acid molecules calculated by density functional theory further suggested that lysine has more reactive sites and mainly bonds with copper through N2 and N8. The adsorption structures of three amino acids were simulated through the molecular dynamics method, and lysine turned out to be parallel absorbed on the Cu (1   1   1) surface with the lowest adsorption energy of −30.24 eV. Finally, the cleaning process simulation revealed the dynamic behaviors of BTA and lysine.

CAS / MDL: 56-87-1 147-85-3 56-45-1
研究领域: 材料科学 · 化学工程
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APPLIED SURFACE SCIENCE · 2023 · IF 6.7

Synergistic effect of water solubility sulfhydryl compound and rare-earth ions on the microstructure, composition, and corrosion resistance of brass

Kangwei Gongsun,Xiang Gao,Kanglu Feng,Juan Qiu,Chunchao Chen,Changming Bu,Houyi Ma

The aim of the present research is to develop one new strategy to modify the brass surface with well anticorrosion performance. Here, utilizing the synergistic effect between thioglycolic acid (TGA) and Y(III), one organic–inorganic hybrid film composed of a self-assembled film at the top and an oxide film at the bottom was fabricated on brass surface. The formation process of the hybrid film contained the parallel adsorption of TGA molecules, surface oxidation of copper accompanied by zinc dissolution, interface deposition of Y 2 O 3 and assembly of Cu-TGA chelates. Electrochemical results indicated that the protection efficiency was 99.2% under the optimum conditions and the value remained at 92.1% after 12 h immersion in 3.5 wt% NaCl solution. Due to the good water solubility of the film-forming substance and excellent anticorrosion performance of the fabricated film, this strategy has important application potential in the field of surface functionalization of copper alloys.

研究领域: 材料科学 · 电化学
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COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS · 2023 · IF 5.2

Novel method for protecting copper: An in-situ click-assembly film on copper surface

Shuaijia Yang,Peng Zou,Yu Wang,Rui Song,Zhenyu Chen

The in-situ self-assembled film on the copper surface is prepared via a novel click chemistry reaction between furfuryl mercaptan (FM) and tert-butyl acetylene (TBA). The formation of the click-assembled film on the copper surface is confirmed by Fourier transform infrared spectrum , Raman, and X-ray photoelectron spectroscopy analyses. The corrosion inhibition ability of the click-assembled film is evaluated using electrochemical methods. The impedance results indicate that the click-assembled film exhibits a maximum inhibition efficiency of up to 99.86 %, which is attributed to the formation of the C-S bond. This bond facilitates the attachment of corrosion inhibitors to the copper surface. Quantum chemistry calculations and molecule dynamics simulations are conducted to further elucidate the corrosion inhibition mechanism.

研究领域: 材料科学 · 电化学 · 表面工程
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