APPLIED SURFACE SCIENCE
·
2024
·
IF 6.3
Li Liu,Tao Chen,Liping Han,Zhuo Qian,Junpeng Li,Guoyou Gan
The Thermal Conductive Silver Adhesive (TCSA) efficiently transfers heat from electronic components to heat dissipation components, preventing overheating and extending device lifespan. Despite the effectiveness of commercial sintered nano TCSA, high production costs necessitate a more affordable, high-performance preparation method. This study presents a strategy for preparing ultra-high thermal conductivity (TC) TCSA using multidimensional thermal conductive fillers and low-temperature sintering of silver nanoparticles (AgNPs). MXene@AgNPs particles are synthesized via in-situ reduction of AgNPs on MXene surfaces. These particles, combined with silver microflakes (AgMFs) as primary fillers and epoxy (EP), undergo low-temperature heat treatment to form the AgMFs-MXene@AgNPs/EP composite. Characterization and computational models show that filler-filler interface thermal resistance (ITR f-f ) is critical for TC. Adding MXene alone is insufficient, but using MXene@AgNPs particles as secondary fillers allows AgNPs to interconnect fillers, effectively reducing the ITR f-f . The resulting composite achieves an ultra-high TC of 65.51 Wm −1 K −1 with 63 wt% total filler content (60 wt% AgMFs, 3 wt% MXene@AgNPs). This study advances the development of low-cost, high-performance TCSA for thermal management applications.
研究领域:
材料科学
·
热传导工程
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2019
·Vol. 30
·期 6
·5526-5535
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IF 2.195
Yang Fan,Hu Bo,Peng Ye,Hang Chunjin,Chen Hongtao,Lee Changwoo,Wei Jun,Li Mingyu
A silver (Ag) composite paste was fabricated based on Ag nanoparticles (NPs) and Ag microflakes (MFs). Robust interconnections were achieved after sintering in the temperature range of 150–225 °C. The shear strengths of the Ag MF + NP joints before and after thermal shock from − 50 to 150 °C for 1000 cycles were 155.7 ± 14.5 MPa and 78.4 ± 20.8 Mpa, respectively. The results show that the Ag composite paste not only has similar sintering properties to the Ag NP pastes but also exhibited superior mechanical reliability due to the addition of the Ag MFs. In addition, the sintered properties of different Ag pastes were discussed in terms of the coating organics, thermal behaviour and microstructure. The fracture modes after the shearing tests were analysed in detail. The Ag composite paste provides a potential solution for high-temperature applications.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2019
·Vol. 30
·期 24
·21343-21354
·
IF 2.195
Zhan Haijiao,Guo Jiayu,Yang Xiazhen,Guo Bing,Liu Wei,Shen Hangyan,Wang Xiaorong,Tang Weigang,Chen Fei
There is a growing demand for silver pastes and inks used in the field of printed electronics. The synthesis of organic surfactant stabilized silver micro-flakes by the solution-phase chemical reduction method at room temperature has attracted wide attention due to its simple equipment, convenient operation and affordable price. However, the electrical conductivity of silver micro-flakes-filled conductive pastes and inks are significantly influenced by residual surfactants. Therefore, the surface modification of silver micro-flakes to remove surface adsorbents becomes a key issue. In this study, the silver frameworks based on the self-sintering silver micro-flakes at room temperature are developed for silver pastes with excellent conductivity. The silver paste with 48 wt% of the sodium nitrate and succinic acid treated silver powders has a resistivity of 1.08 × 10 −6 Ω m and excellent adhesion strength after being cured at 140 °C in an oven.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
MOLECULES
·
2022
·Vol. 27
·期 22
·8030
·
IF 4.927
Youliang Cheng,Jin Zhang,Changqing Fang,Wenke Qiu,Hao Chen,Haonan Liu,Ying Wei
Conductive silver paste is a key material in the fields of printed circuits and printed electronic devices. However, the preparation of conductive silver paste with low-cost and volatile organic compounds (VOCs) is still a challenge. In this work, conductive silver pastes with excellent comprehensive performances were developed by using water-borne polyurethane (WPU) as the bonding phase and using the ternary mixture of Ag microflakes (Ag MFs), Ag nanowires (Ag NWs), and Ag nanoparticles (Ag NPs) as the conductive phase. WPU endowed conductive silver pastes with the adhesion along with releasing a few VOCs during the curing. Results showed that a small amount of Ag NPs or Ag NWs dramatically enhanced the electrical conductivity of silver paste paint film filled only with Ag MFs. The electrical resistivity for optimal ternary mixture conductive silver paste was 0.2 × 10−3Ω∙cm, and the conductive phase was composed of 20.0 wt% Ag MFs, 7.5 wt% Ag NWs, and 2.5 wt% Ag NPs. Meanwhile, the adhesive strength and hardness of silver paste paint film were effectively improved by increasing the curing temperature. The optimal overall performance of the conductive silver pastes was achieved at the curing temperature of 160 °C. Therefore, this work can provide a new route for preparing conductive silver pastes with high performances.Keywords:conductive silver paste;Ag microflakes;Ag nanoparticles;Ag nanowires;ternary fillers
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
PubMed
高影响因子
Small
·
2023
·
IF 13.3
Jun Zhao,Jiuqing Feng,Yizhou Jiang,Zekai Wang,Jialong Zhang,Shuxing Mei,Guoqing Yang,Zongquan Gu,Cehui Tan,Yajie Qin,Zhuo Li
The quality of electrophysiological (EP) signals heavily relies on the electrode's contact with the skin. However, motion or exposure to water can easily destabilize this connection. In contrast to traditional methods of attaching electrodes to the skin surface, this study introduces a skin-integration strategy inspired by the skin's intergrown structure. A highly conductive and room-temperature curable composite composed of silver microflakes and polydimethylsiloxane (Ag/PDMS) is applied to the skin. Before curing, the PDMS oil partially diffuse into the stratum corneum (SC) layer of the skin. Upon curing, the composite solidifies into an electrode that seamlessly integrated with the skin, resembling a natural extension. This skin-integration strategy offers several advantages. It minimizes motion artifacts resulting from relative electrode-skin displacement, significantly reduces interface impedance (67% of commercial Ag/AgCl gel electrodes at 100 Hz) and withstands water flushes due to its hydrophobic nature. These advantages pave the way for promising advancements in EP signal recording, particularly during motion and underwater conditions.
研究领域:
生物医学工程
·
材料科学
·
医学信号处理
✓ 已验证
产品关联
DOI
PubMed
高影响因子
危险品化学品经营许可证（带存储）